1. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 1 GLAST Large Area Telescope: Presented by G. Haller SLAC haller@slac.stanford.edu (650) 926-4257 Gamma-ray Large Area Space Telescope TEM/TPS TRR

2. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 2 Contents Introduction –Overview –Significant Changes since CDR –Objectives –Status Requirements/Verification EGSE and Test-Procedures Verification Test Plan and Flow –At Assembly Vendor Test-plan and Flow Facility Man-Power Quality Assurance Vibration –At SLAC Test-plan and Flow Thermal Vacuum Test Mass Property EMI/EMC (at sub-contractor) Man-Power Quality Assurance Equipment Calibration/Safety Risk Assessment Schedule Status of Procedures Issues and Concerns

3. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 3 LAT Electronics 3 Event-Processor Units (EPU) (2 + 1 spare) –Event processing CPU –LAT Communication Board –SIB Spacecraft Interface Units (SIU)* –Storage Interface Board (SIB): Spacecraft interface, control & telemetry –LAT control CPU –LAT Communication Board (LCB): LAT command and data interface 16 Tower Electronics Modules & Tower Power Supplies * Primary & Secondary Units shown in one chassis Power-Distribution Unit (PDU)* –Spacecraft interface, power –LAT power distribution –LAT health monitoring Global-Trigger/ACD-EM/Signal-Distribution Unit* TKR CAL TKR Front-End Electronics (MCM) ACD Front-End Electronics (FREE) CAL Front-End Electronics (AFEE)

4. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 4 TEM/TPS Mounted to CAL LAT GRID with 16 CAL/TEM/TPS Modules TEM TPS CAL TKR not shown

5. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 5 EM Tower Electronics Module (TEM) before coating/staking TEM Assembly Main DAQ module, one on each tower –Controls and reads out data from TKR MCM and CAL AFEE front-end electronics –Zero-suppresses CAL event data –Buffers events in cable ASIC FIFO’s –Assembles CAL and TKR event fragments to tower event –Transmits data to GASU –Contains monitoring and low-rate science circuits –LVDS interface to front-end electronics and GASU Tower Electronics Module

6. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 6 Tower Power Supply TPS Assembly EM Tower Power Supply (TPS) before coating/staking Tower Power Supply module, one on each tower –Input 28V –Generates low-noise voltages for TKR (2.65V analog, 2.65V Digital) CAL (3.3V analog, 3.3V digital) TEM (3.3V and 2.5V digital) TKR Bias (20V-140V programmable) CAL (20V to 90V programmable) –Temperature sensors

7. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 7 TEM/TPS Assembly Shown upside-down TEM TPS TEM After TEM and TPS are tested individually, the two modules are mated and the TEM/TPS package is tested

8. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 8 Changes since TEM CDR and Power-Supply Delta CDR Power Supply Review from 9-22-03 –SLAC GLAST web-site -> Electronics & DAQ -> Reviews TEM –Modification of FPGA code To fix a couple of bugs To change flow-control slightly to optimize dataflow throughout system Code was reviewed by GSFC reviewer (Dr Rod) –Some resistor/capacitor values have changed to optimize monitoring ranges –Details of monitoring circuit have changed and a sub-set of current monitoring functions were eliminated TPS –Resistor/capacitor changes to optimize circuit performance over temperature –Changes in poly-switch values to protect better over temperature (instead of RXE185, split the load into two paths with a RXE110 each), increased the current sensing resistor from a 1W to a 3W resistor. –Changed resistor values to Modify TKR 2.5V to 2.65V Decrease maximum CAL Bias from 120V to 90V –Changed Zener diodes at Bias output voltage for new max values –Changed resistor values to optimize in-rush current level Worst Case Analysis updated to incorporate changes Thermal Analysis from CDR/Delta-CDR remained since changes don’t impact thermal performance

9. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 9 Objectives Demonstrate that hardware, software, procedures, and support equipment are prepared to support system environmental test Demonstrate that planned and completed testing meets performance and interface requirements Identify and understand all the risks and limitations TRR is not intended to –Review TEM/TPS design –Review flight readiness –Buy-off hardware or software RFA’s should only be of sufficient concern to stop test –Prior to start of an given test, any applicable TRR RFAs must be closed

10. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 10 Test Entrance / Exit Criteria Entrance –All required paperwork released and in place Procedures, drawings, etc –Test configuration verified and approved –Essential personnel in place –Pre-test TEM/TPS functional successfully passed Exit –As-run procedures completed –Correct and accurate application of test environment –Test data acquired and archived –No damage to TPS/TEM –TEM/TPS performance within specification limits –Post-test TEM/TPS functional successful

11. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 11 Status 3 TEM/TPS –Qualification unit, Tower A, and Tower B units Assembled, Functional tested Ready for environmental test Assembly of balance of 19 TEM and TPS authorized to proceed, but not started yet –All parts at assembler

12. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 12 Tests To-Date TEM and TPS engineering modules were extensively tested –As EGSE in DAQ/CAL/TKR/I&T >50 test-stands were tested with SLAC TPS and TEM Test Procedure TEM and TPS were used to test functionality and performance of TKR and CAL sub-system electronics –Met requirements by sub-system CAL performed vibration tests on coated/staked TEM/TPS to CAL levels, passed (exceptions were first modules in-house staked) –Additional TEM/TPS tests Informal thermal-vacuum test -40C to 55C, passed CPT Vibration tests of staked TEM/TPS passed DAQ qual levels –On test-bed 16 TEM/TPS connected to EM PDU and GASU and to Front-End Simulator modules generating trigger and event-data Run up to 10 KHz data-rates

13. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 13 Tests To-date (con’t) –On fully-instrumented tower 36 TKR MCM’s 4 CAL AFEE’s Ran tests and passed –Test results for TEM/TPS performance tests posted for the EGSE TEM/TPS –E.g. TEM/TPS delivered to CAL: http://www-glast.slac.stanford.edu/Elec_DAQ/EGSE/CAl-AFEE/cal.htm –IO tested to sub-system ICD‘s –Configuration and data-taking tested –Monitoring functions/performance tested –Tested over Frequency (16Mhz to 22 MHz, 20 MHz nominal) Temperature (-40C to 55C) TEM supply range (3.3V +/- 10%, 2.5V +/-10%) One flight PCB TEM/TPS was loaded at SLAC with mostly parts from flight lots, including flight-lot ACTEL FPGA‘s –Passed tests from -40C to 55C over voltage and frequency Three TEM and TPS flight modules assembled at flight-assembly vendor individually tested with CPT procedures, over temperature, passed tests

14. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 14 Requirements LAT-SS-00019 Specifications, Level 3 T&DF Subsystem Specification LAT-SS-00284 Specifications, Level 4 Trigger LAT-SS-00285 Specifications, Level 4 Dataflow LAT-SS-00136 Specifications, Level 3 Power Supply System LAT-SS-00183 Specifications, Level 4 Power Supply System LAT-SS-05522 Specifications, Level 5 TEM Specification LAT-SS-01281 Specifications, Level 5 TPS ICD & Specification LAT-SS-05533 Specifications, Level 5 TEM/TPS Specification

15. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 15 Derived Requirements LAT-SS-05533 TEM/TPS lists 132 requirements for TEM/TPS package (most are from TEM LAT-SS-05522 (108) with extensions (24) to include TPS requirements for the TEM/TPS package) Verification Matrix gives approach to verify each requirement –LAT-TD-05536 –Lists verification method used Assembly level at which requirement is verified –All TEM requirements at TEM assembly level (LAT-SS- 05522) –ALL TPS requirements at TPS assembly level (LAT-SS- 01281) –TEM/TPS package requirements at TEM/TPS assembly level (LAT-SS-05533)

16. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 16 System Performance Level 3 and level 4 DAQ and TRG and power-system requirements are met with a combination of DAQ modules (TEM/TPS, GASU, SIU, PDU, etc), since the DAQ and trigger and power system is comprised of several sub-system module types –Level 5 TEM/TPS requirements which are verified are derived from Level 3 and Level 4 DAQ and Trigger and Power system specifications (as noted in the L5 requirements doc) –Level 5 requirement doc includes derived requirement addressing Functionality/performance Power Mass/C.G. EMI/EMC Environmental incl temperature and vibration

17. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 17 Verification Status Engineering Module TEM/TPS –EM completed full environmental/functional test program with exception of EMI/EMC, mass, and C.G. –Demonstrated compliance with specifications

18. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 18 EGSE and Test-Procedures EGSE for Functional/Performance Tests –Test-Stand documented in LAT-DS-04085 TEM (at TEM module level) –TEM Stray-Voltage-Test Procedure LAT-TD-04097 –TEM Electrical Interface Continuity and Isolation Test procedure LAT-TD-03831 –TEM Test-Procedure LPT LAT-TD-03415 TPS (at TPS module level) –TPS Stray-Voltage-Test Procedure LAT-TD-04098 –TPS Electrical Interface Continuity and Isolation Test procedure LAT-TD-04099 –TPS Test-Procedure LPT LAT-TD-01652 TEM/TPS (at combined unit level) –TEM/TPS Performance Test Procedure LAT-TD-01485

19. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 19 EGSE Test-Configuration LAT-DS-04085

20. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 20 Verification Level – Module Detail Breakout of verification at TEM/TPS Module Level –Tests to be conducted after successful TRR At assembly vendor –Functional test –Vibration –Functional test –Thermal cycle –Functional test –Pre-ship review At SLAC –Incoming functional test –Mass properties –Thermal vacuum (in-situ testing) –EMI/EMC –Functional test –Review –Deliver to I&T »DAQ (out-going) / I&T (incoming) test combined In the following slides first the work/tests at the assembly vendor is defined, then the work/tests at SLAC

21. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 21 At Assembly Vendor Test-Stand –Supplied by SLAC –Operated by SLAC engineers Vibration facility at General Technology –Vibration test-procedure http://www-glast.slac.stanford.edu/Elec_DAQ/Reviews/TEM-TRR/SK-282-SLAC- ESS-Procedure-11-03-04.pdfhttp://www-glast.slac.stanford.edu/Elec_DAQ/Reviews/TEM-TRR/SK-282-SLAC- ESS-Procedure-11-03-04.pdf –Also includes »Thermal test procedures »Environmental chamber (thermal/vibration) description SLAC engineers present for vibration tests Work at assembly vendor specified in SOW –LAT-PS-02615

22. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 22 Process & Test Flow-GTC (Assembly Vendor) See also in more detail in http://www-glast.slac.stanford.edu/Elec_DAQ/Reviews/TEM-TRR/SK-282-SLAC-ESS- Procedure-11-03-04.pdfhttp://www-glast.slac.stanford.edu/Elec_DAQ/Reviews/TEM-TRR/SK-282-SLAC-ESS- Procedure-11-03-04.pdf Assemble TEM/TPS Stake HW Vibration Test Source inspection &EIDP review Pack & ship to SLAC Thermal test Functional test Final functional test Functional Test

23. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 23 GTC Qualification and Acceptance Test Matrix

24. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 24 GTC Environmental Test Requirements Figure 1. Vibration Levels, Duration, and Spectra

25. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 25 Manpower & Quality Assurance at Assembly Vendor Man-Power –Thermal and vibration test man-power provided by assembler –Test man-power supplied by SLAC TEM: L. Sapozhnikov TPS: D. Nelson Test Support: J. Ludvik –Quality assurance: see below Quality Assurance –Assembly QA by vendor as required by SOW –On-site, full-time LAT QA presence (P. Lujan) –Required changes to documentation at GTC is immediately documented on an NCMR and forwarded to SLAC for disposition –All outstanding changes to documents are incorporated and a new revision released into LAT DOCs prior to final inspection at each manufacturing/test level (CCA, Module, Top Assembly)

26. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 26 At SLAC After TEM/TPS module has been shipped from assembly vendor to SLAC: Test-Stand –Supplied by SLAC, operated by SLAC engineers Work flow –Functional Test –Mass Property Plus C.G. measurement –Thermal Vacuum (in-situ testing) –Functional Test –Ship to EMI/EMC vendor –EMI/EMC test –Ship back to SLAC –Final functional test –Review

27. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 27 Mass Property Mass properties checked at SLAC –Procedure in progress (done at SLAC Metrology) –Measured on EM (ref LAT-TD-00564) TEM 2.710 kg TPS 4.340 kg TEM/TPS Total 7,050 kg Allocation 12% above = 7,896 kg –C.G. to be measured for the qualification unit

28. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 28 Thermal Vacuum Test Thermal Vacuum facility in Building 33 at SLAC –Thermal Vacuum Chamber Operating Procedure LAT-TD- 02541 (draft in review) –TEM/TPS Thermal Vacuum Test-Procedure LAT-TD-03631 ( draft in review) –Chamber was relocated to Building 33 from Central Lab –Needs earth-quake securing, in progress (by 1/10) –Needs recalibration (by 1/15)

29. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 29 Qual and Flight Acceptance Thermal Vacuum Test See TEM/TPS Thermal Vacuum Test-Procedure LAT-TD-03631 At < 10-5 Torr

30. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 30 Manpower & Quality Assurance at SLAC Man-Power –Thermal Vacuum test (R. Williams, J. Ludvik) –Test man-power supplied by SLAC TEM/TPS: L. Sapozhnikov, D. Nelson, J. Ludvik –Quality Assurance LAT QA already present at SLAC Required changes to documentation is immediately documented on an NCMR

31. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 31 EMI/EMC Test Qualification Test (Conductive & Radiative) –Sub-contracted to CK Labs –Statement of Work: LAT-PS- 04568 CE102, CECN, CS102, CSCM, CS06, RE101, RE102, RS101, RS103 –Detailed EMI/EMC procedure deliverable by vendor (in work) Required to be reviewed/released prior to tests –SLAC engineers present at vendor for tests –Vendor supplies test-report –LAT QA at SLAC present for tests Flight Acceptance Test (Conductive) –Performed at SLAC –Procedure in work Required to be reviewed/released prior to tests CE102, CS102 –SLAC supplies test-report –LAT QA at SLAC present for tests

32. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 32 Problem Failure Report/ Configuration Management Problem Failure Reporting –Via standard SLAC LAT Non-Conformance Reporting (NCR) System NCR is entered Reviewed/accepted/resolved –LAT engineering –LAT QC Already exercised during past TEM/TPS assembly Configuration Management –Via standard LATDOC system

33. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 33 Planned Tests Function/Performance Tests (LAT-TD-01485) –Verifies all requirements in LAT-SS-05533 except below Thermal Vacuum Tests –Verifies performance/function over temperature Mass/C.G. –Verifies/measures mass and C.G. Vibrations test –Verifies vibration performance requirements EMI/EMC –Verifies EMI/EMC performance

34. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 34 Equipment Calibration Electrical Functional Test Equipment –EGSE Test-Stand was certified by SLAC (will be posted on LAT EGSE web-site shortly) EMI/EMC Test Equipment –Quantitative measurement equipment (sensors, antennas, etc) calibrated to NIST standards –Calibration performed annually All item are (will be) within calibration at time of testing Vibration Test Equipment –Accelerometers calibrated against a standard accelerometer traceable to NIST –Signal conditioners calibrated annually TVAC Equipment –Thermocouples calibrated against standard temperature; calibrated prior to test –Thermocouple reader calibrated very 2 years

35. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 35 Sub-System Safety EGSE –Safe-to-mate –Configuration control –Calibration verification –Functionality verification with “golden” TEM/TPS prior to test with flight hardware MGSE –No custom MGSE Environment –Temperature controlled in all test-facilities –Cleanliness actively controlled in clean-room; hardware bagged and purged when required Training –ESD training completed –Clean room training completed

36. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 36 Risk Assessment GTCC/GCCC TEM ASICs qualification program not completed at GSFC –No issue to-date –Test completion end of February ACTEL FPGA’s –TEM’s use relatively new UMC fabrication-line space-qualified FPGA’s, no flight heritage ESD sensitivity of ASIC’s higher than expected (200V, class 0) –Mate-demate and safe-to-mate are of concern when connecting/disconnecting TEM to front-end test (simulator) board. Keep cables as short as possible, apply handling taught in ESD- training, use de-ionizers Schedule –Pressure to deliver flight hardware could force less than complete characterization and analysis of modules, could result in replicating a problem in follow-on modules Performance –None known

37. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 37 Test-Schedule Depending on assembly vendor, estimate as follows –1/10/05: functional test of qual/TwrA/TwrB –1/11-12/05: vibration test of qual/TwrA/TwrB –1/13/05: functional test of qual/TwrA/TwrB –1/14-15/05: TC of qual/TwrA/TwrB –1/16/05: functional test of qual/TwrA/TwrB –1/17-21: review/shipping –1/24/05: functional test of qual/TwrA/TwrB –1/25/05: mass, c.g. property test of qual/TwrA/TwrB –1/26/05: TV start of TwrA, end Feb 2 –2/3/05: EMI/EMC of TwrA, end 2/5/05 –2/7/05: TV start of TwrB, end Feb 14 –2/15/05: EMI/EMC of TwrA, end 2/16/05 –2/15/05: TV start of Qual, end Feb 22 –2/22/05: EMI/EMC of Qual, end 3/8/05

38. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 38 Status of Main Test Procedures TEM/TPS Performance Test Procedure LAT-TD-01485: released Vibration & thermal cycle procedure –GT procedure SK-282-SLAC: approved EMI/EMC –Qual CKC Lab procedure: will be started 2 nd week of January –Flight Working together with TKR to get procedure finished by 3 rd week of January (procedures are similar) Thermal Vaccum – LAT-TD-03631, in draft form All procedures must be released before respective test

39. GLAST LAT ProjectTEM/TPS TRR, Jan 7, 2005 4.1.7 DAQ & FSWV3 39 Issue & Concerns EMI tests –Concern passing qualification tests Schedule –Tight Qualification and Flight acceptance tests of flight TEM/TPS are performed with front-end simulators, not with actual CAL or TKR electronics –In the planning phase: Taking qualification module after baseline environmental testing is completed Connect it to CAL AFEE / TKR MCM electronics Test over temperature (no vacuum required) Need documentation –Possible for every flight modules: schedule issues