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Applying X-Rays in Material Analysis

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Presentation on theme: "Applying X-Rays in Material Analysis"— Presentation transcript:

1 Applying X-Rays in Material Analysis
Vladimir Kogan Philips Analytical and DANNALAB The Netherlands

2 X-Ray Diffraction Analysis
Based on measuring the intensity of the x-rays diffracted by the sample at different angles Delivers information about the structure and composition of material at different scales This information is used to explain or predict the properties of a sample Bragg's Law l = 2d sin q d

3 Classification of Samples
Amorphous Polycrystalline Monocrystalline Bulks Powders and Foams Thin Films

4 XRD for Amorphous Materials
SAXS Analysis of Human Serum Albumin (HSA) in the Monodisperse Solution and in the Native Serum An understanding of the structural properties of serum albumin is extremely important in the development of new human pharmaceuticals. HSA contributes to many transport and regulatory processes in the body. Distribution, free concentration and metabolism of verious pharmaceuticals can be significantly influenced depending from the binding with HSA. From the monodisperse curve of HSA we have determined the average parameters of the molecule - axes of ellipsoid, suface, volume, radius of gyration etc. From the polydisperse curve (native serum) we have derived the histogram of particles distribution by average radius. DANNALAB, 2002

5 XRD for Polycrystalline Materials
Crystallography - type and dimensions of unit cell Atomic structure - atom’s coordinates Grain’s size and shape Micro and macro strain Phase composition - presence and concentration of different phases D-Mannitol (beta form) HOCH2(CHOH)4CH2OH

6 Si Detector for XRD Applications
0.07mm pitch No cooling required Efficiency: > 94 % for 8KeV Maximum 4mln cps in the complete detector Background: < 0.1 cps Finally, a novel detection system should not give the user a lot of additional maintenance, be it the supply of counting gas, the need for cooling water or regular recalibrations. All these issues are non-existent with the X’Celerator.

7 Specific of Thin Layers
ct > aL at = aS mismatch Substrate = aS Layer = aL ct Strained layer Relaxed layer

8 Different Types of Thin Films
Pseudomorphic epitaxial layers. “No” defects. Strain may be present Example : AlGaAs/GaAs, SiGe/Si Applications: Lasers, High-frequency IC’s Lattice mismatched epitaxial layers. Layers are partly (or fully) relaxed Example: ZnSe/GaAs, InAsSb/GaSb Applications: Blue LED’s, IR optopelectronic Layers with large lattice mismatch and/or dissimilar crystal structures Example: GaN/Sapphire, YBaCuO/SrTiO3, BST, PZT Applications: Blue Lasers and LED’s, High Tc Superconductors, Ferro electrics Layers where the epitaxial relationship is weak. Highly textured. Example: AuCo multilayers on Si Applications: Thin film media, heads

9 XRD for Thin Films and Layers
Reflectivity Measurements Thickness, Density, Surface Roughness Lateral and Depth Correlation Curvature In-plane Scattering Nano-layers Nano-structures In-plane properties High Resolution Diffraction Orientation Quality of Epitaxy, Lattice Mismatch Phase Composition Thickness, Density, Surface Roughness

10 Typical Setup for Reflectivity Measurements
q 2 Divergence slit Attenuator Sample Detector Graphite monochromator Anti-scatter Beam knife Receiving

11 The Information that can be Derived from a Reflectivity Curve

12 XRD Study of Self-Assembled Monolayers C18H37SH on Gold
Reflectivity XRD Study of Self-Assembled Monolayers C18H37SH on Gold Specular Reflectivity Curve Reflectivity Map, Diffuse Scattering Determined thickness of the layers: C18H37SH nm Au nm Au nm Si > nm Determined Average Lateral Correlation Length: 2.5nm DANNALAB, 2002

13 Modern High Resolution Diffractometer
The highly parallel monochromatic beam should be used to study perfect layers

14 High Resolution Diffraction
Analysis of SiGe HBT Structure The introduction of a SiGe epitaxial layer in the bipolar transistor (HBT) brings significant gains in speed, challenging GaAs in its traditional application fields. New technological step of introducing Ge requires also an accurate method for the characterization of Ge content and gradients. Automatic simulation and refinement of a measured rocking curve helps to identify parameters of individual layers. Method delivers 1 % accuracy for composition and 3 % accuracy for SiGe thickness. DANNALAB, 2002

15 High Resolution Diffraction GaN/InGaN (Blue Laser Structure)

16 Relaxed GaInAs/GaAs (224)
Reciprocal Space Map Relaxed GaInAs/GaAs (224) S L

17 Orientation and Domain Structure
Transition in YBa2Cu3O8-x Film on SrTiO3 Substrate XRD Measurements {304} Reciprocal Space Maps 20nm tetragonal (nonsuperconducting) phase 100nm orthorhombic (superconducting) phase With the increase of the thickness of the YBa2Cu3O8-x layer, the dependence of the structure from the SrTiO3 substrate is declining. This results in the appearance of the orthorhombic superconducting phase. DANNALAB, 2002

18 High Resolution Diffraction
Strain Fields in Boron-implanted Silicon DANNALAB, 2002

19 Devices and Structures
Stresses due to adhesive bonding Different methods has been tested to make stress-free bonding of Si with steel. One of the methods (s41 and s42) delivers quality, comparable with the stress free samples (Test1 and Test2)

20 IC Chip Glued on the Ceramic Substrate
Surface Mapping by Measuring Rocking Curves Method 1 Method 2 DANNALAB, 2002

21 Sensor on Chip Assembly Surface Mapping by Measuring Rocking Curves
Mapping of free standing Si sensor Mapping of sensor bump-bonded to chip Wire bonding side DANNALAB, 2002

22 Roadmaps for new XRD detectors
Amorphous Materials Polycrystalline Materials Monocrystalline Materials 0D, 1D and 2D Flat shape Dynamical range 107 Counting speed up to 107c/s/mm2 useful energy and 109 total Energy resolution <250 eV 0D, 1D and 2D Different shapes Very low noise Pixel size down to 0.05 mm Counting speed up to 105c/s/mm2 Energy resolution <250 eV 0D, 2D Flat shape Dynamical range 107 Counting speed up to the 107c/s/mm2

23 Conclusions Special thanks to
Appearance of new technologies for x-ray detectors considered to be one of the key factors for the advances in XRD instrumentation. The applications of XRD actively shifting nowadays to the field of high-tech materials an devices, including advanced x-ray detectors. Both fields have a lot of synergy and may benefit from each other. Special thanks to J. Visschers, for inviting me to this conference J. Woitok, M. Fransen, K. Bethke, R. de Vries for useful comments


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