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RF Front End/ADC-DAC Device Technology Reliability (New) Description: we propose to study and characterize state-of-the-art high-speed ADCs and DACs for.

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Presentation on theme: "RF Front End/ADC-DAC Device Technology Reliability (New) Description: we propose to study and characterize state-of-the-art high-speed ADCs and DACs for."— Presentation transcript:

1 RF Front End/ADC-DAC Device Technology Reliability (New) Description: we propose to study and characterize state-of-the-art high-speed ADCs and DACs for use in RF front end space applications, and to identify the technical risks and mitigation techniques. state-of-the art ADC and DAC technologies will be surveyed and evaluated. state-of-the art ADC and DAC will be characterized vs temperature voltage and signal dynamics Motivation and Benefits Modern RF systems interface directly to baseband, removing IF components and moving ADC and DAC as close as possible to the RF input. This requires high-speed and high dynamic range ADCs and DACs. Currently available space-qualified ADCs and DACs have limited speed, performance and radiation tolerance The motivation is to understand and address the technology and reliability challenges necessary to enable confident use of key SoA ADC and DAC devices in space RF front end applications. Deliverables: ADC/DAC technology & reliability report ADC temp, rad characterization test report DAC temp, rad characterization test report ADC/DAC Device Technology ’07 final report Schedule/Costs FY08 Plans: survey currently available > 50MSPS ADC/DAC technologies performance parameters footprint, materials and construction reliability data radiation tolerance perform automated ADC_DAC reliability tests power consumption vs. temp & radiation gain temperature coefficient signal to Noise ratio vs. temp & radiation effective number of bits vs. temp & radiation non-linearity vs. temp & radiation CL SEI image Benefits these planned NASA missions: Juno, Europa NASA and Non-NASA Organizations/Procurements ADC and DAC devices and test hardware will be procured at total cost of less than $ Total Full-Cost = $ Lead Center/PI: JPL, James Skinner Center Funding Split: JPL – CL image Par-4

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