1. G. RizzoSuperB WorkShop – 17 November 20061 R&D on silicon pixels and strips Giuliana Rizzo for the Pisa BaBar Group SuperB WorkShop Frascati-17 November 2006

2. G. RizzoSuperB WorkShop – 17 November 20062 CMOS MAPS electronics & interconnects epitaxial layer (~ 10  m thick) substrate (~ 300  m thick) Principle of Operation: Electrons generated by the incident particle in the undepleted epitaxial layer move by thermal diffusion. –Q ~ 80 e-h/  m -> Signal ~ 1000 e- Signal collected by the n-well/p-epi diode Advantages: Same substrate for detector-readout:  less material in the detection region (thin down to ~ 50 um) Sensor faster and more rad hard than CCDs CMOS deep submicron process –low power consumption and fabrication costs –electronics intrinsically radiation hard Lots of MAPS R&D in many places with a “conventional” approach: Charge-to-voltage conversion provided by sensor capacitance -> small collecting electrode -> small single pixel signal Extremely simple in-pixel readout configuration (3 NMOSFETs) -> sequential readout -> readout speed limitation Developed for imaging applications, recently proven to work well also for charged particles.

3. G. RizzoSuperB WorkShop – 17 November 20063 A new approach for CMOS MAPS This feature exploited for a new approach in the design of CMOS pixels: The deep n-well can be used as the collecting electrode A full signal processing circuit can be implemented at the pixel level overlaying NMOS transistors on the collecting electrode area: In triple-well processes a deep n-well is used to provide N- channel MOSFETs with better insulation from digital signals Use of commercial triple-well CMOS process to address the two previous limitations of conventional MAPS –increase collecting electrode size –increase the complexity of the in-pixel readout electronics

4. G. RizzoSuperB WorkShop – 17 November 20064 Triple well CMOS MAPS Fill factor = deep n-well/total n-well area  0.85 in the prototype test structures Readout scheme compatible with existent architectures for data sparsification at the pixel level -> improve readout speed Standard processing chain for capacitive detector implemented at pixel level PRESHAPERDISCLATCH Charge preamplifier used for Q-V conversion: –Gain is independent of the sensor capacitance -> collecting electrode can be extended to increase the signal RC-CR shaper with programmable peaking time (0.5, 1 and 2  s) A threshold discriminator is used to drive a NOR latch featuring an external reset

5. G. RizzoSuperB WorkShop – 17 November 20065 First Results Prototype chip, with single pixels, realized in 0.13  m triple well CMOS process ( STMicrolectronics ) Very encouraging results: –Prove the principle –Good agreements between measurements and simulation –S/N = 10 measured with electrons from 90 Sr  source –Pixel noise still “high” ENC = 125 e- for known reason Landau peak 80 mV 12502200 3000 (e-) saturation due to low energy particle. 90 Sr electrons Noise only (no source) threshold Second version of the chip currently under test: Small pixel matrix (8x8, 50x50  m 2 ) with simple sequential readout. Improved noise performance: pixel noise ENC = 50 e- –Expected S/N ~ 25

6. G. RizzoSuperB WorkShop – 17 November 20066 R&D Project Aim of our research program is to fabricate MAPS sensors, based on triple well commercial CMOS process, and develop the technology for the fabrication of thin silicon strip detectors. Final goal is to build a prototype of a thin silicon tracker (MAPS and thin silicon strip modules) with LV1 trigger capabilities (based on Associative Memories) –Already working on the design of the readout architecture for MAPS matrix, with data sparsification at the pixel level, having in mind a Linear SuperB as target application. –Technology for thin silicon strips on a large area is not well established. We will explore two alternatives: epitaxial grown substrate and locally thinned high resistivity substrate. –Important aspect of the project is to develop light mechanical and cooling structures for thin silicon modules to benefit of the very low material budget of the sensor itself. Test of the prototype tracker in a test beam in 2008

7. G. RizzoSuperB WorkShop – 17 November 20067 SLIM Collaboration This R&D project will be pursued in the next 3 years within the new SLIM (Silicon detectors with Low Interaction with Material) Collaboration, supported by the INFN and the Italian Ministry for Education, University and Research. The SLIM Collaboration is organized in 4 Work Packages to cover the various aspects of the project: –WP1 “MAPS and Front End Electronics” –WP2 “Thin silicon strips” –WP3 “Trigger/DAQ” –WP4 “Integration, Mechanics and Test Beam” We have a quite detailed project plan Several Italian Institutes involved in the project: –Pisa (coordination), Pavia, Bergamo,Trieste, Torino, Trento, Bologna Total Manpower involved ~ 12 FTE

8. G. RizzoSuperB WorkShop – 17 November 20068 Backup

9. G. RizzoSuperB WorkShop – 17 November 20069 Device Simulation (ISE-TCAD) Detailed physical simulations performed using ISE-TCAD software to: –understand the charge collection mechanism and its time properties –study influence of neighboring pixel and n-wells –optimize sensor design (needs 3D simulation, in progress) Preliminary results: –Collected charge ~ 1500 e- assuming pepi thickness  15  m: likely to be true. Charge collection drops rapidly out of deep nwell area –Collection time: ~50 ns Uncertainties about process: Test structure chip realized to measure some process parameters -> a crucial input for simulation

10. G. RizzoSuperB WorkShop – 17 November 200610 Single devices channel 4 - pixel with large (2670 m 2 ) collecting electrode area channel 3- pixel with medium (1730 m 2 ) collecting electrode area channel 6 - pixel with small (830 m 2 ) collecting electrode area channel 5 - pixel with input pad for charge injection (830 m 2 collecting electrode area) channel 1 - pixel with input pad for charge injection channel 2 - pixel with input pad for charge injection (100 fF detector simulating capacitance) 0.13  m CMOS HCMOS9GP by STMicroelectronics: epitaxial, triple well process (available through CMP, Circuits Multi-Projets) Test Chip Layout channel 1-2-5 have integrated injection capacitance for readout electronics characterization

11. G. RizzoSuperB WorkShop – 17 November 200611 Gain & Noise Measurements Channel 2 Channel 5 Channel 1 Equivalent Noise Charge is linear with C T =C D +C F +C inj +C in ( C D =detector capacitance, C F =preamplifier feedback capacitance, C in =preamplifier input capacitance ) Sensor capacitance higher than initially expected: noise performance greatly affected. Room for improvement in next chip submission Charge sensitivity and Equivalent Noise Charge measured in the three channels with integrated injection capacitance Cinj Good agreement (~10%) with the post layout simulation results (PLS) Gain~440 mV/fCENC= 11e - +425e - /pF

12. G. RizzoSuperB WorkShop – 17 November 200612 Response to infrared laser Infrared laser used to emulate charge released by particle – =1060 nm  absorption coefficient=10 cm -1 in Si  pixel can be back illuminated Total charge released equivalent to ~ 6 MIPs Charge released in a broad region under the sensor: fraction of the charge collected by pixel depends on the laser spot intensity profile (not well known yet) Largest charge collected in the largest pixel. Charge does not scale linearly  laser spot larger than the pixel area and with non uniform profile Results roughly compatible with a gaussian laser spot profile of about 50  m …

13. G. RizzoSuperB WorkShop – 17 November 200613 5.9 keV line  1640 e/h pairs: with charge entirely collected clear peak @ 105 mV -> gain=400 mV/fC below 100 mV excess w.r.t. noise events <- charge only partially collected Using 55 Fe gain calibration: pixel noise 8 mV ENC=125 e- Signal from simulation  1500 e- S/N expected = 12 Threshold set cuts this region Peak value of the shaper output: blue - 55 Fe source (5.9 keV) green - No source (same acquisition time) Calibration with 55 Fe X-ray Soft X-ray from 55 Fe source used to calibrate pixel noise and gain in channels with no injection capacitance 164022003000 (e-)  =105 mV  =12 mV PWELLNWELL P - EPI-LAYER P ++ SUBSTRATE PWELL INCIDENT PHOTONS Charge entirely collected DEPLETION REGION Charge only partially collected by single pixel

14. G. RizzoSuperB WorkShop – 17 November 200614 Response to 90 Sr electrons Acquisition triggered by coincidence scintillator & pixel signal above threshold (set @ ~0.5 MIP) Setup not easy as it seems: you need to fire a single pixel ~30x30 m 2 ! Response to M.I.P from 90 Sr beta source used to measure S/N ratio Pixel 90 Sr beta source Scintillator Si chip 300 um e- 45% are ~ M.I.P: Landau peak 15% die in Si 40% release more than a M.I.P, they deform Landau shape or saturate the shaper

15. G. RizzoSuperB WorkShop – 17 November 200615 Response to 90 Sr electrons Landau peak clearly visible @80 mV Using M.I.P signal from 90 Sr and average pixel noise S/N=10 Using gain measured with 55 Fe, M.I.P most probable energy loss corresponds to about 1250 e- Fair agreement with sensor simulation:  1500 e- expected for pepi layer thickness  15  m. Hint on the process secrets! Threshold set cuts this region Landau peak 80 mV 125022003000 (e-) saturation due to low energy particle. Peak value of the shaper output: blue - 90 Sr beta source green - No source

16. G. RizzoSuperB WorkShop – 17 November 200616 Second chip layout Single Pixel channels Pixel Matrix

17. G. RizzoSuperB WorkShop – 17 November 200617