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1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

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Presentation on theme: "1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies."— Presentation transcript:

1 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies IcomtekCSIR

2 2 Author: D L Johnson Contents of lecture u Overview of Bluetooth u Bluetooth Architecture and stack partitioning u Microprocessor considerations u Example defence projects u The ultimate goal u The future of Bluetooth

3 3 Author: D L Johnson Contents of lecture u Overview of Bluetooth u Bluetooth Architecture and stack partitioning u Microprocessor considerations u Example defence projects u The ultimate goal u The future of Bluetooth

4 4 Author: D L Johnson Overview of Bluetooth - history u In 1994 Ericsson initiated a study to investigate the feasibility of a low-power low-cost radio interface between mobile phones and their accessories u In Feb 1998, five companies Ericsson, Nokia, IBM, Toshiba and Intel formed a Special Interest Group (SIG) u In July 1999 the first bluetooth specification 1.0 was released u The bluetooth consortium today is comprised of 9 promoter companies who are leaders in telecomms, computing and networking and more than 2000 adopter companies u Bluetooth is the fastest growing technology since the internet or the cellular phone, incredible considering that its first public outing was in mid 1998.

5 5 Author: D L Johnson Overview of bluetooth - definition Bluetooth is a low-power, low-cost short range radio system intended to replace cables between fixed and portable devices. It is intended to replace many propriety cables with one universal radio link.

6 6 Author: D L Johnson Overview of Bluetooth - domains Landline Data/Voice Access Points Cable Replacement Personal Ad-hoc Connectivity

7 7 Author: D L Johnson Overview of Bluetooth – technical level u Data links: Can establish up to 7 simultaneous data connections between a master and it’s slaves (piconet) u Voice links: Can establish up to 3 simultaneous voice connections between a master it’s slaves (piconet) u Maximum asymmetrical data rate of 723 kbps (57.6 kbps return channel) u Maximum Symmetrical data rate of kbps u Can have up to ten multiple self contained networks (piconets) sharing spectrum in the same area (scatternet) u Range can be up to 10m for 10mw bluetooth devices and up to 100m for 100mw bluetooth devices u Very low power consumption u Ability to discover available services on another device

8 8 Author: D L Johnson Contents of lecture u Overview of Bluetooth u Bluetooth Architecture and stack partitioning u Microprocessor considerations u Example defence projects u The ultimate goal u The future of Bluetooth

9 9 Author: D L Johnson Bluetooth Architecture and stack partitioning

10 10 Author: D L Johnson Contents of lecture u Overview of Bluetooth u Bluetooth Architecture and stack partitioning u Microprocessor considerations u Example defence projects u The ultimate goal u The future of Bluetooth

11 11 Author: D L Johnson Microprocessor considerations – Speed requirements u Bluetooth IC vendors embed small, low-power ± 20 MIPS processors (ARM7, Hitachi H8, Motorolla Dragonball) u MIPS requirements of Bluetooth stack +Baseband Layer (LC, LM and HCI): 8-12MIPS +Host Protocol Layer (HCI, L2CAP, RFCOMM, SDP):1-2 MIPS +Application layer and profiles: 1-20MIPS +High speed point to multipoint with 7 connections 20MIPS

12 12 Author: D L Johnson Microprocessor considerations – The challenge u What drives Bluetooth development +Drive towards <$5 per IC +Low power IC’s +Majority applications in cell phone market +Majority of uses are point to point voice or data u Why single chip point to multipoint not available +Multipoint needs more powerful embedded link control processor but this drives up the cost of the IC +More powerful embedded processor normally requires more power +Applications are not demanding it yet

13 13 Author: D L Johnson Contents of lecture u Overview of Bluetooth u Bluetooth Architecture and stack partitioning u Microprocessor considerations u Example defence projects u The ultimate goal u The future of Bluetooth

14 14 Author: D L Johnson Example projects – grenade launcher Point to point link

15 15 Author: D L Johnson Example project – mortar sight Point to multipoint link

16 16 Author: D L Johnson Contents of lecture u Overview of Bluetooth u Bluetooth Architecture and stack partitioning u Microprocessor considerations u Example defence projects u The ultimate goal u The future of Bluetooth

17 17 Author: D L Johnson The ultimate goal – smart rocks u Video surveillance u Audio surveillance u Motion sensing u Neural networking u Extremely low power u Ad-hoc networking

18 18 Author: D L Johnson Contents of lecture u Overview of Bluetooth u Bluetooth Architecture and stack partitioning u Microprocessor considerations u Example defence projects u The ultimate goal u The future of Bluetooth

19 19 Author: D L Johnson The Future of Bluetooth u Current version 2.0 working group +High rate bluetooth 10 Mb/s +HI_FI quality non-compressed audio +Video suitable for video conferencing +Local positioning for indoor and built-up areas u More powerful embedded microprocessors which will make low power, single chip point to multipoint possible u Possibility of creating ad-hoc data/voice networks using off the shelf PDA’s or headsets u UWB possibly a future threat to Bluetooth due to its high bandwidth, low power ad-hoc networking features


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