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A Combined Pressure and Temperature Sensor without external temperature probe.

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Presentation on theme: "A Combined Pressure and Temperature Sensor without external temperature probe."— Presentation transcript:

1 A Combined Pressure and Temperature Sensor without external temperature probe

2 Content (1) Key P/T Sensor Specifications (2) Patented Thin Film Technology (3) Sensor Design for CO2 / R744 MACS (4) Finite Element Modeling / Simulation (5) Qualification Testing (6) Other Thin Film Applications and Sensor products

3 (1) Key P/T Sensor Specifications  Pressure: Measurement Range0 to 170 Bar Accuracy< ± 1,0%(F.Sp.) Response time~4 ms(t 63 )  Temperature: Media -40°C to +180°C Accuracy ~ ± 3 K Response time< 10 sec(t 63 ) Ambient Temperatureup to 135°C  Electrical Interface:3-pin LIN2.0,3-pin PWM, 4-pin P/T analog

4 (2) Patented Thin Film Technology  Thin Film Element on SST  Sputtered Metal Strain Gauge  TiON Strain Gauge with high K-Factor/ Gauge Factor: K: TiON ~ 5 (CrNi ~ 1,1..2) K-Factor: dR/R= K * dl/l  High Temperature Resistance (330°C)  Pressure Range: 10 to 3.000 Bar 6 mm

5 (3) Sensor Design for CO 2 / R744 MACS  Digital output: LIN2.0 or PWM (Temperature output embedded in signal)  Integrated Temp. feature: Less part complexity, higher reliability, less flow restriction and reduced leakage risk.  Long term stability, Rugged Design.  Smallest possible thread interface: M10x1mm

6 Exploded View / Cross Sectional DV Chip p,T Connector Flexwire Component board with µC Housing Flexwire Combined Sensor Assembly (p,T)

7 Kavlico DV Chip Dual Frequency-Output ASIC for Thin-Film and PRT Resistive type sensors:  Ratiometric multiplexed frequency (digital) output for Sensor (Pressure-) and Temperature-data.  Coarse gain and offset calibration via serial-interface, allowing wide range of sensors.  Fine calibration by µP ; calibration coefficients to be stored in memory of µP.  Extreme temperature range ( -50ºC to +200ºC ).  Low-Power (sleep mode and 3mA operational current)  Self-diagnostics and failure analysis.

8 DV Chip placement on Thin Film Flexure  Accurate Temperature measurement independent from ambient temperature.  Digital, non-susceptible output (temperature output embeded in signal). Bumps on DV Chip Underfill Adhesive Electrical Contact Bridge pads

9 Schematic Thin Film Strain Gauge DV chip Flexwire Inter- connection Micro Controller LIN2.0 Transceiver Out Sensing (Sensor assy) Conditioning (PC Board) p T

10 (4) Finite Element Modeling of P/T Sensor

11 Effect of Chip on Diaphragm Stress and Deflection The influence of DV chip on the stress distribution and deflection of diaphragm is small Condition: 180ºC temperature, 150 bar pressure R r

12 Ambient Conditions: a)25ºCstill air b)150ºCstill air 150ºC air flow / 4.4 m/s c)135ºC still air Thermal Analysis Impact to electrical Components (PCB) CO 2 @ 200 kg/h and 180ºC or 165ºC

13 a)Temperature Distributions after 5 Min. (25ºC Ambient Temperature) Printed Circuit Board 112~140ºC 25°C, V oo = 0m/s Initial Fluid Temperature: 25ºC; Transient to 180 ºC

14 b) Temperature Distributions after 5 Min. (150ºC Ambient Temperature) 167~173ºC Printed Circuit Board 166~172ºC Initial Fluid Temperature: 25ºC; Transient to 180 ºC 150°C, V oo = 0m/s 150°C, V oo = 4.4m/s

15 Replace PCB Mount the circuit board to components with low thermal conductivity (plastics) away from the metal housing. ULTEM 2310 Polyetherimide Plastic Connector Circuit Board Stainless Steel 304L

16 c) Design at 135ºC Ambient Temperature 141-144ºC Printed Circuit Board Temperature 139-141ºC CO 2 Temperature 5 min of 180ºC 5 min of 165ºC Initial Fluid Temperature: 135ºC; Transient to 180ºC and 165 º C

17 Conclusions  DV chip has negligible influence on the performance of sensor diaphragm / pressure sensor functionality.  By connecting the circuit board to plastics and away from the metal housing, the circuit board temperature can be reduced to around ~ 140ºC under 135ºC ambient Temperature

18 (5) Qualification Testing  Leackage test Requirement <1,0 gram per year The test is carried out at an external test lab, specialized on these kind of tests.  Design validation test on sensor level Start after sample build in July 2008 Duration appr. 6 month.

19 (6) Other Thin Film Application and Sensor Products:  Direct Fuel Injection / Common Rail  In-Cylinder Pressure  Transmission / Break Pressure  Compressed Natural Gas (CNG)  Traction Control  (Mobile) Hydraulic Pressure / Controls  HVAC / Hydraulic Machinery

20 Contact: Mr. Markus Butenop Director of Sales KAVLICO GmbH Potsdamer Str. 14 32423 Minden Germany Phone:+49 (0)571 3859 – 171 Fax.:+49 (0)571 3859 – 119 /

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