1. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Universit à di Trieste & Istituto Nazionale di Fisica Nucleare (INFN) - Trieste ALICE Vertex Detector focusing on the µstrip layers ALICE-STRIP Trieste: Marco Bregant, A. Borysov, L. Bosisio, P. Camerini, G. Contin, F. Faleschini, E. Fragiacomo, N. Grion, G.-V. Margagliotti, S. Piano, I. Rachevskaia, R. Rui

2. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica L3 magnet Dipole magnet Muon Spectrometer HMPID TOF PHOSTPC Inner Tracking System Requirements: Vertex resolution < 100 μm (Charm, Hyperons) Acceptance down to 100 MeV/c Improvement of p T from outter tracker Particle densities up to 80/cm 2 Low mass (γ conversion, multiple scattering) TRD

3. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Inner Tracking System 2 layers of Silicon Pixel Detectors R=3.9 cm; 7.6 cm dN ch /dx 2 ~ 80 particles/cm 2 2 layers of Silicon Drift Detectors R=14.9 cm; 23.8 cm dN ch /dx 2 ~ 5 particles/cm 2 2 layers of Silicon Strip Detectors R=38.5 cm, 43.6 cm dN ch /dx 2 ~ 1 particle/cm 2

4. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Silicon Pixel Detector 60 staves, 240 modules 40960 chs. per module cell size (r ,z): 50 x 425 µm 2 spatial resolution (r  ) 12 µm spatial resolution (z) 100 µm

5. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Silicon Drift Detector 36 ladders, 260 modules 2 x 256 chs. per module cell size (r ,z): 294 x 150 µm 2 spatial resolution (r  ) 35 µm spatial resolution (z) 23 µm sensor active area: 7.02 x 7.53 cm 2 Drift

6. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Silicon Strip Detector 72 ladders, 1698 modules cell size (r ,z): 95 x 4000 µm 2 spatial resolution (r  ) 20 µm spatial resolution (z) 830 µm Ladder, top SSD module (after folding) Ladder, bottom

7. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica SSD module 40 mm 72 mm Sensor 75 mm 42 mm Hybrid 6 µcables 6 chips

8. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica P N n-type silicon 300 µm thick double sided Stereo angle: 35 mrad  p: 7.5 mrad  n:27.5 mrad integrated AC decoupling 768 strips/side, 96 µm pitch Sensor Parts forming a module

9. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica CMOS.25 µm process, rad-hard mixed analogue/digital chip 128 input channels ±14 MIPs dynamics 1.4  2.2 µs adjustable shaping time JTAG programmable powered @2.5 V thinned down to ~150 µm ~11 mm ~4 mm HAL25 chip Parts forming a module

10. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Aluminium traces (14 µm) on polyimide (10 µm) support TAB frames for easy handling Developed & supplied by the Ukrainian group µcable Parts forming a module 2.4 mm 11 mm chip to subhybrid to sensor

11. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Top view carbon-fibre stiffener SMD resistors SMDcapacitors Bottom view aluminium/polyimide flex cooling blocks tail: fits in a ZIF connector for tests Made in UA SubHybrid Parts forming a module

12. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Module assembling scheme

13. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Assembling flowchart Test half module Sensor to ladders Test Chip Test µcable Tabbed chip Hybrid 6X Sub-hybrid Test Chip Test µcable Tabbed chip Hybrid 6X Sub-hybrid Test

14. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica How to do it?... in Trieste Production of 1700 modules split in three locations:  Helsinki: entirely produces on-site  Strasbourg: entirely produces on-site  Trieste: produces in collaboration with an external manufacturer (840 modules) 840 modules: 1700 hybrids, 10000 tabbed chips,... ~30000 tests...a tiny mass production process optimization (including custom jigs) : on-line quality control:  fast & reliable tests for immediate feedback

15. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Step 1: chip + µcable bonding mask TAB-Frame frame holder chip holder positioning system (4 axis) bonder

16. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Step 1: chip + µcable...aligning and automatic TAB bonding

17. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Step 2: hybrid assembling Jig for hybrid assembling

18. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Step 2: hybrid assembling - 6 tabbed chips are aligned and glued to the subhybrid - automatic TAB bonding of the 6 tabbed chips to the subhybrid

19. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica

20. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Steps 3&4: module assembling Bottom side Top side

21. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Module made

22. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Test & validation a test at each step production in three sites (including industry) √ same electronics √ same automatic test

23. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Noise&gain tests Depleted Module (p side)  signal ~ 900 a.u. in response to ~10MIPS from chip internal pulser  noise: ~2.5 a.u. noisy region bad channel summary

24. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Search for short-circuited chs. ch. n is pulsed ch. n+1 is read summary

25. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica The test summary In the right pane: -all the useful information, i.e. -module serial number -chip serial numbers -a led for each test (green: 0K; yellow: minor problem; red: major failure -the list of: -open channels -short-circuited channels -broken AC channels -the final quality (= 100  defective channels) ALL is saved in an ASCII report file Test duration: ~ 10 minutes green: OK!

26. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica The assembling of SSD modules Conclusions an assembling system was designed to produce the SSD module of ALICE production goes smoothly ahead typical rates (yields) are 100 tabbed chips/day (88%) 10 hybrids/day (97%) 20 modules/week (92%, 85% at the first trial) a total amount of number of 1000 (out of 1700) modules were so far assembled in the three production sites

27. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Additional slides

28. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Testing on the beam Test beam Hall at CERN 5 modules have been tested with a π beam (7 GeV)

29. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Test beam results N side S/N ~ 45 P side S/N ~ 60

30. Marco Bregant Vertex05 - Nikko, November 2005 Dipartimento di Fisica Spatial resolution r  resolution design: 20 µm measured:20 µm z resolution design: 830 µm measured:975 µm