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CALICE Dave Bailey. Aims and Objectives Develop the technology to build a high- resolution tracking calorimeter for ILC experiments Main thrusts: –Testbeam.

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Presentation on theme: "CALICE Dave Bailey. Aims and Objectives Develop the technology to build a high- resolution tracking calorimeter for ILC experiments Main thrusts: –Testbeam."— Presentation transcript:

1 CALICE Dave Bailey

2 Aims and Objectives Develop the technology to build a high- resolution tracking calorimeter for ILC experiments Main thrusts: –Testbeam work with prototype –DAQ electronics development –Mechanical assembly

3 ECAL Multi-module End-Cap W/Si calorimeter (24 X 0 with 29 W layers) Weight full ECAL: ~ 112 T (80 barrel +32 End-Cap ) Barrel : 40 identical trapezoidal modules End-Cap : constituted of 12 modules (3 types) ECAL module : alveolar structure - carbon fibers compound including half of W plates (fixed on HCAL End-Cap with rails)  Minimization of dead zones Detection elements (detector slab) in each alveolar case (Si+W), FE chips integrated, pad size : 5×5 mm Opening plan for full End-Cap Barrel module Détecteur SLAB

4 EUDET - Detector Slab shielding: 100 µm ( cooling ? ) Cables + packaging: 1000 µm PCB: 600 µm glue: 100 µm (ƒ pads size) wafer: 300 µm ground foil: 50 µm v.1 Design SLAB Main ISSUES : Front End chips inside :  Thermal dissipation (cooling ?)  Chip behaviour in an electron shower Long structure :  Design and fabrication problems (composite with segmentation of W plates, mechanical behaviour …)  Segmentation of PCB (design of an interconnection) Diminution of the pads size  Increases of the number of channels (thermal cooling ?)  Size of glue dots Heat shield: µm (copper) Epoxy protection ? ( cooling ? ) v.2 Design SLAB PCB: 800 µm glue: 100 µm (needs tests) wafer: 300 µm Chip without packaging ground foil: 100 µm 6500 µm

5 What are we up to? Aim to build a big chunk of detector in Manchester when the time comes Currently concentrating on 2 areas –DAQ (Marc & Richard) –Mechanical assembly (Ray & Co.) Also starting to use the tier 2 for simulation and (hopefully) data storage so we can do testbeam analysis here too

6 What I have been up to Mostly doing the admin and getting things sorted out! Slowly changing the priorities of the mechanical side to get more involved with the EUDET (FP6 ILC detector/testbeam infrastructure development at DESY) Trying to use the grid to do something useful (failed miserably so far) Thinking about how to take a significant chunk of the DAQ activity off the current incumbents…


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