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NVIDIA CHIPSET PARTNERS IntelAMD  Established in 1994.  Over 70 R&D engineers plus120+ staffs.  20,000 Sq-Ft. head office located in Shenzhen.  4.

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Presentation on theme: "NVIDIA CHIPSET PARTNERS IntelAMD  Established in 1994.  Over 70 R&D engineers plus120+ staffs.  20,000 Sq-Ft. head office located in Shenzhen.  4."— Presentation transcript:

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2 NVIDIA CHIPSET PARTNERS IntelAMD

3  Established in  Over 70 R&D engineers plus120+ staffs.  20,000 Sq-Ft. head office located in Shenzhen.  4 branch offices in major cities of China: Wuhan, Beijing, Shenzhen and Hefei.  European branch offices: Spain, Germany, UK, and Austria; warehouse in Netherland.  Channel partners: Australia, South Korea, Philippines, Malaysia, Indonesia, India, Vietnam and Thailand. Branch Offices:

4 J&W Technology Limited. Worldwide Distribution: United Kingdom SpainItaly Germany Austria Beijing Hefei Shenzhen Hong Kong South Korea Indonesia Vietnam Thailand Australia Malaysia India

5 CEO R & D Centre Design Dept Software Dept CAD Dept Project Manager Engineer Dept Signal Testing Technical Director Financial Dept Human Recourse QC Dept Testing & Evaluation Local Customer Overseas Sales Sales (Key Account) Technical Support After Sales Service PMC & Production

6  Certified and Select Suppliers to ensure the quality and consistency materials for production.  Frequent communication and evaluation with clients and suppliers to ensure our best services to our partners.  Applied “King Dee K3 System” on material inspection and distribution.  Keep close relationship with suppliers.  Flexible and effective production planning to meet the prompt delivery and market changes.

7 Shenzhen Yong Fu Factory Address: BaoAn district, Fu Yong, Fu Tong industrial area. Employees: 4,000+ Space: 29,436 Square meters Products: Desktop Computers and Laptop boards. Production lines: SMT 51, DIP 21

8  20 fully automatic high-speed SMT lines.  Monthly output 500K + + in 2 facilities.  workers, working round the clock.  RoHS production facilities.

9 0603chip, WCSP ( ball size0.26 mm) 0.4 ㎜ PIN Spacing QFP, BGA, CSP >> DIP TYPE >> Support Complicated PCB Assembly in DIP type.

10 >> X-Ray >> AOI (Reflow ) >> AOI (Solder paste inspection facility / 3D)

11 >> Burnt in test>> Fall test >> RoHS XRF Equipment >> Vibration Test

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17 For more information please visit our website at:


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