1. UK Assembly IV Update UK Pixel Weekly Meeting Previous update 30/5/2013 13/6/2013

2. Wafer 2433-14, UK Quad 7. 450um edge and Quad 5, production Better breakdown performance > 400V post – assembly < 200V pre - assembly Lower leakage 1.45x10-7 @ 130V Post Assembly 6.8x10-7 @ 130V Pre Assembly (see look-up table later) Higher Leakage observed prior to breakdown 1.38x10-5 @ 130V Post Assembly 6.8x10-6 @ 130V Pre Assembly (see look-up table later)

3. Single assembly SC1, Wafer 2615-19 Lower leakage observed 8.9x10-9 @ 130V Post Assembly 1.1x10-8 @ 130V Pre Assembly (see look-up table later)

4. Comparison of Assembly IV after Paralene Coating Paralene coating process does not appear to affect performance

5. Assembly Look-up table UK Assembly IDPre - AssemblyPost AssemblyComment Bias (V)Leakage (A)Bias(V)Leakage (A)- Quad 2 -52.95x10-7-- -1304.15x10-7 Quad 7 -53.15x10-7-51.22x10-8 -1306.8x10-7-1301.45x10-7 Quad 5 -52.96x10-7-56.0x10-8 -1301.06x10-6-130-1.38x10-5 SC1 -108.47x10-9-115.6x10-9 -1301.1x10-8-1318.9x10-9 SE3 Assembly 2 -107.6x10-9-109.64x10-9 -1302.03x10-8-130compliance SE4 Assembly 1 -106.1x10-9-107.14x10-9 -1051.27x10-8-1301.9x10-9 SC4 Assembly 4-106.5x10-9-106.08x10-9 -1308.75x10-9-1307.3x10-9 SC6 Assembly 6-106.58x10-9-105.65x10-9 -1301.02xx10-8-1307.47x10-9 SC9 Assembly 9-207.6x10-9-207.2x10-9 -1309.5x10-19-1309.2x10-9 SC10 Assembly 10-106.5x10-9-106.1x10-9 -1309.6x10-9-10050x10-9 SC1 Assembly 16-105.1x10-9-108.6x10-9 -1301.2x10-8-1301.19x10-8 SC2 Assembly 17-155.3x10-9-157.9x10-9 -1351.16x10-8-1351.4x10-8 SC4 Assembly 18-155.4x10-9-157.9x10-9 -1351.03x10-8-1351.4x10-8 SC5 Assembly 19-154.9x10-9-158.39x10-9 -1351.55x10-8-1351.2x10-8 SC6 Assembly 20-154.2x10-9-158.3x10-8 -1351.18x10-8-1351.19x10-8 SC9 Assembly 15-155.7x10-9-152.52x10-8 -1351.05x10-8-1352.03x10-8

6. Single module SC9 Assembly 15 Some reduced leakage observed when power is turned down on the chip @ -135V a difference of 5nA between CP-on and CP - off

7. Defect Gallery of Quad 2

8. Summary and to do IV characteristics of the assemblies imply that the bump bonding process is working well Some analysis of the assemblies not performing well is on-going Higher breakdown voltages and lower leakage currents (particularly on quad assemblies) is observed The paralene coating process does not appear to affect the assembly performance Complete population of Assembly look-up table Compile defect analysis of failed and low performing assemblies