We think you have liked this presentation. If you wish to download it, please recommend it to your friends in any social system. Share buttons are a little bit lower. Thank you!
Presentation is loading. Please wait.
Published byJaeden Leamon
Modified over 2 years ago
© H. Heck 2008Section 1.31 Module 1:Introduction Topic 3:Interconnect Technology OGI EE564 Howard Heck
Interconnect Technology EE 564 © H. Heck 2008 Section 1.32 Where Are We? 1.Introduction 1.Overview 2.Trends & Challenges 3.Interconnect Technology 2.Transmission Line Basics 3.Analysis Tools 4.Metrics & Methodology 5.Advanced Transmission Lines 6.Multi-Gb/s Signaling 7.Special Topics
Interconnect Technology EE 564 © H. Heck 2008 Section 1.33 Contents Component Packaging Passive Components Connectors Printed Circuit Boards
Interconnect Technology EE 564 © H. Heck 2008 Section 1.34 Overview Components (Chip + Pkg) PCB (Motherboard) PCB (add-in card) Connector Source: Intel Corp.
Interconnect Technology EE 564 © H. Heck 2008 Section 1.35 Overview – SOA Desktop Motherboard Microprocessor Memory Slots Chipset Graphics Connector
Interconnect Technology EE 564 © H. Heck 2008 Section 1.36 Overview – SOA Desktop Motherboard Microprocessor Memory Connectors Chipset Graphics Connector X48 chipset motherboard
Interconnect Technology EE 564 © H. Heck 2008 Section 1.37 Component Packaging Packages house the silicon chips. They provide: Mechanical support Heat removal Environmental protection Electrical signal & power connections (chip to PCB). Silicon Package PCB Soldered Connections Heat Spreader
Interconnect Technology EE 564 © H. Heck 2008 Section 1.38 Component Packaging
Interconnect Technology EE 564 © H. Heck 2008 Section 1.39 Component Packaging Source: Intel Corp.
Interconnect Technology EE 564 © H. Heck 2008 Section Example: Flip Chip Pinned Grid Array Bottom Top Cross-section
Interconnect Technology EE 564 © H. Heck 2008 Section Medium Speed Package Electrical Models Bond WireTracePin / Land Tie Bar L bw R L pin R Z 0, d R tb, L tb, C tb Die Board Source: Packaging Databook, Intel Corp Today’s speeds demand that we use fully coupled 3D package models.
Interconnect Technology EE 564 © H. Heck 2008 Section Passive Components Resistors Uses: termination for interconnect, pull up/down for static features Variability: 5%, 2%, 1% Chip resistors – 1 resistor per component R-Packs – up to 4 resistors per small outline component Resistor networks – more resistors per component Lead inductance and package crosstalk can be important effects for high frequency applications. Capacitors Variability: 20%, 10% Chip capacitors – used for high frequency (local) decoupling of power suppliers Tantalum capacitors – used for bulk decoupling At high frequencies, resistance and inductance of the packages must be included in the models.
Interconnect Technology EE 564 © H. Heck 2008 Section Sockets & Connectors Sockets connect packages to PCBs. Connectors connect PCBs to PCBs. Connection is mechanical between two metal surfaces. LGA775 Socket DIMM connector PCI® Express
Interconnect Technology EE 564 © H. Heck 2008 Section Socket/Connector Electrical Models These are simple models. Coupled models are frequently used for high performance applications. R con Z 0con, dcon Today’s speeds demand that we use fully coupled 3D connector models.
Interconnect Technology EE 564 © H. Heck 2008 Section Printed Circuit Boards Function: provide electrical signal connections between components & deliver power to the components. Material Set: Construction: Typically 4 to 6 layers (always an even number). 4 layer board: 2 signal, 2 power ($0.09/in 2 ) 6 layer board: 4 signal, 2 power ($0.18-$0.24/in 2 ) Higher layer counts are available at higher cost.
Interconnect Technology EE 564 © H. Heck 2008 Section PCB Construction Power Plane Signal Trace Solder Mask Via Barrel Surface Mount Pad Via Land Laminate (Dielectric) Laminate (Resin) Laminate (Glass) Signal Trace Power Plane Solder Mask
Interconnect Technology EE 564 © H. Heck 2008 Section PCB Signal Layer 0.050" G 0.005" W 0.024" D " S " S 2 0.012" D 1
Interconnect Technology EE 564 © H. Heck 2008 Section PCB Vias Vias make layer-layer connections by drilling holes and filling them with conductor material (copper). They are used in chips, package, and boards. Silicon Package PCB Soldered Connections Heat Spreader
Interconnect Technology EE 564 © H. Heck 2008 Section PCB Design Goals Function: All signals connected Performance: Maximum operating frequency Cost Minimized technology requirements Layer count Board size Relaxed width & spacing Relaxed via size Design for manufacturability Component selection Component placement Trade routing
Interconnect Technology EE 564 © H. Heck 2008 Section Summary Package electrical parameters are typically modeled with lumped circuit elements and transmission lines. We will examine the effects of lumped elements later, and will account for them in our design project. We will also consider when transmission line models are required. For high volume PCs, system designers use pervasive, low cost PCB solutions: FR-4 material set 4 layer boards 5/5 or 6/6 mil trace/space wiring 4 boards per panel for motherboards PCBs are used for motherboards, add-in cards, and CPU packages. PCBs provide interconnect for high speed buses operating as high as 400 MHz/800 MT/s and beyond.
Interconnect Technology EE 564 © H. Heck 2008 Section References Intel Packaging Databook, Intel Corporation, 2002, Component Types Used for SMT, IBM Microelectronics Division, January Surface Mount Design and Land Pattern Standard, IPC-SM-782, IPC, Revision A – August R.R. Tummala, E.J. Rymaszewski (ed.), Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York, 1989.
Interconnect Technology EE 564 © H. Heck 2008 Section Appendix: More Packages Celeron® Processor Package Celeron® Processor Cartridge Pentium® Processor w/ MMX™ Package 850 Chipset Package
Interconnect Technology EE 564 © H. Heck 2008 Section Appendix: More Connectors ISA PCI Memory DIMM SLOT1 AGP
Interconnect Technology EE 564 © H. Heck 2008 Section Appendix: CPU Sockets PGA370
THE COMPUTER MOTHERBOARD AND ITS COMPONENTS Compiled By: Jishnu Pradeep.
Packaging. Packaging Requirements Desired package properties Electrical: Low parasitics Mechanical: Reliable and robust Thermal: Efficient heat removal.
© H. Heck 2008Section 5.21 Module 5:Advanced Transmission Lines Topic 2: Intersymbol Interference OGI EE564 Howard Heck.
Computer Maintenance Unit Subtitle: Motherboards Copyright © Texas Education Agency, All rights reserved.1.
© H. Heck 2008Section 5.31 Module 5:Advanced Transmission Lines Topic 3: Crosstalk OGI EE564 Howard Heck.
V. Bande, Applied Electronics Department (English version)-> Information for students Lecture 11 1 Passive Electronic.
Printed Circuit Board Design Sung Yeul Park Dept. of Electrical and Computer Eng University of Connecticut September 24, 2014.
Understanding Computers “Getting Inside the Computer” Computer Hardware.
PCB design and fabrication Lin Zhong ELEC424, Fall 2010.
HIGH DENSITY DESIGN COMPONENT SOLUTIONS. Technology Challenges Market Drivers: Make it smaller Make it operate faster Make it more efficient Make.
IC packaging and Input - output signals J. Christiansen, CERN - EP/MIC
Printed Circuit Board Daniel Miller Joe Quesada Justine Lazo 1
Chapter 3 By James Hanson June 2002 DRAM Dynamic-RAM Needs to be refreshed every few milliseconds 1 Transistor/ 1 Capacitor.
© International Rectifier DirectFET MOSFETs Double Current Density In High Current DC-DC Converters With Double Sided Cooling.
MOTHERBOARD The MOTHERBOARD is the main circuit board of your computer and is also known as the main board or logic board. If you ever open your computer,
Macroeconomic Themes:31 Contribution of Monetarism in Macroeconomic Policy Supply of money is the determinant of the national income In the long run, the.
1 Exercise 2 The Motherboard. 2 Motherboard Form Factors AT-Type AT-Type Baby or Mini AT Baby or Mini AT ATX-Type ATX-Type Proprietary Designs Proprietary.
Lecture 31 Macroeconomic Analysis 2003 Golden Rule of Saving and Capital Accumulation.
Multilayer thin film technology for the STS electronic high density interconnection E. Atkin Moscow Engineering Physics Institute (State University) –
An International Technology Roadmap for Semiconductors.
ECE 404 PCB Design Presentation Jakia Afruz. Printed Circuit Board Electronic Board that connects circuit components PCB populated with electronic.
How is a PCB Made ? What determines impedance ?
1 From logic to hardware Ellen Spertus MCS 111 November 25, 2003.
LOGO. Types of System Boards Nonintegrated System Board Nonintegrated system boards can be easily identified because each expansion slot is usually.
Sierra Proto Express Introducing our Micro Electronics Division.
©Richard L. Goldman 1 AT Style System Board (Animated Presentation) ©Richard L. Goldman April 25, 2002.
PACKAGE FABRICATION TECHNOLOGY Submitted By: Prashant singh.
Building a PC. Motherboard Selection Ensure the selected motherboard is appropriate for the processor model and frequency you are planning to use AMD.
EELE 461/561 – Digital System Design Module #4 Page 1 EELE 461/561 – Digital System Design Module #4 – Interconnect Construction (Printed Circuit Boards)
1/20 Passive components and circuits - CCP Lecture 13.
VELO upgrade electronics – HYBRIDS Tony Smith University of Liverpool.
Copyright © 2007 Heathkit Company, Inc. All Rights Reserved PC Fundamentals Presentation 3 – The Motherboard.
Components of a PC. Motherboard. Computer Mother Board Computer Mother board and its constituent components A typical PC mother board with important.
Unit 1 Computer Motherboard. Computer systems, such as desktop computers, laptop computers, work stations, and servers, are information handling systems.
Interconnection and Packaging in IBM Blue Gene/L Yi Zhu Feb 12, 2007.
Manufacturing Processes for a 4 Layer Multi-layer PCB Section through PCB Via hole SMD Pad The following presentation covers the main processes during.
Global Circuit Page 1 Basic Design Rule for Advanced PCB (1) 1. High speed current path Load Driving gate Current trace At low frequency current, follows.
Chapter 2 On the Motherboard The Complete A+ Guide to PC Repair 5/e Update.
Computer Maintenance Unit Subtitle: CPUs Copyright © Texas Education Agency, All rights reserved.1.
CPUs and motherboards Unit objectives: Describe the function and features of CPUs, identify a CPU, and classify CPUs according to their specifications.
Click to edit Master subtitle style 4/25/12 Thermal Management By using PLPCB technology with HEAVY Copper in PCB Pratish Patel CEO, Electronic Interconnect.
1 SPACE PRODUCT ASSURANCE esa Repair & modification course based on: EUROPEAN COOPERATION FOR SPACE STANDARDIZATION ECSS-Q-ST-70-28C July
Interconnection Structures A computer consists of a set of components (CPU,memory,I/O) that communicate with each other. The collection of paths connecting.
1 New build-up technique with copper bump AGP Process.
Parts and usage. Motherboard is the most important component in any personal computer. It contains almost every important elements of the computer. Sometimes.
Inside the PC. Power Supply Heat Sink Used to cool the CPU or graphics processors Designed to increase the surface area in contact with the cooling.
Motherboard Group 1. Introduction: A Motherboard is the main printed circuit board (PCB) found in computers and other expandable systems. Sometimes.
The printed circuit board (PCB) design §PCB design is part of the design process of a product in electronics industry. §PCB is a piece of insulating plastic.
3/22 How a Bus Works. Roll Call Lecture: –general traces addresses sizes types –How a PCI bus works.
© 2017 SlidePlayer.com Inc. All rights reserved.