1. DEVELOPMENT OF THE CBM-MVD: THE PROTOTYPE
Michal Koziel
on behalf of CBM-MVD collaboration
(+49) 069 /

2. The MVD – required performances
CBM-MVD will:
improve secondary vertex resolution
host highly granular silicon pixel sensors featuring fast read-out, excellent spatial resolution and robustness to radiation environment.
See P.Senger introduction
Required performances (SIS-100)
Radiation tolerance
> 1013neq/cm2 & >3 MRad
Read-out speed
> 30 kframes/s
Intrinsic resolution
< 5 µm
Operation in vacuum
„Light” support and cooling
Material budget ~ 0.3 % X0

3. Research fields towards the MVD
Sensor development
Radiation tolerance
Support
& cooling
System integration
M.Winter
Front-End Electronics
Main challenges:
Provide fast and radiation tolerant sensor featuring low material budget
Develop sensor readout system capable to handle high data rates
J.Stroth
Provide cooling and support with low material budget

4. Progress towards the MVD ...will meet all requirements
Prototype
Demonstrator
4 sensors
½ of 1st station
Final
...will meet all requirements
2008
2010
2012
Sensor:
MIMOSA-20
~200 frames/s
few 1011 neq/cm2 & ~300 kRad
750µm thick
Sensor:
MIMOSA-26 AHR
~10 kframes/s
~1013 neq/cm2 & >300 kRad
50µm thick
Sensor:
MIMOSIS-1 (diff. geometry)
Readout speed
~30 kframes/s
2015
Radiation tol. >1013 neq/cm2 & >3 MRad
Readout
Serial/analog
Readout
CP/digital/high data rates
Cooling & support:
TPG+RVC foam
Cooling & support:
CVD diamond
Material budget:
~ 2.45 % X0
Material budget:
~ 0.3 % X0

5. Sensors for the MVD prototype Achieved performances
MIMOSA-26 AHR
0.35µm process
High Resistivity (HR) EPI (400Ω·cm)
Main features:
CP architecture
in pixel amplification
comparator for each column
0 suppression logic
pitch: 18.4 μm∼ 0.7 million pixels
21.2 x 10.6 mm2
18.4 µm pixel pitch
CMOS processes with smaller feature size (0.18µm)
Achieved performances
MIMOSA-26 AHR (2009) [1]
Design goals (SIS-100)
MIMOSIS-1 (~2015)
Radiation tolerance
~1013neq/cm2 & >300 kRad
~1013neq/cm2 & >3 MRad
Read-out speed
~10 kframes/s
>30 kframes/s
Intrinsic resolution
~3.5 µm
< 5 µm
Material budget
~ 0.05 % X0 (50µm Si)
[1]
CMOS processes with smaller feature size (0.18µm)
Sensor geometry – column length
Extensively studied at IKF:
[1] M.Deveaux „Radiation tolerance of a column parallel CMOS sensor with high resistivity epitaxial layer”, accepted for publication in Journal Of Instrumentation 2011

6. Readout concept for MVD prototype
Driver board
Clk
Start
Reset
JTAG
FEB CB
RCB
PEXOR PC
PCI optical receiver
multiwire
LVDS
5 x 800MBit/s
multiwire
LVDS
5 x 1GBit/s
Optical Fibers
1 optical link
5 x 300MBit/s
Optical Fibers
CBM DAQ
Powering
Latchup detection
Current & temperature monitoring
LVDS to Optical conversion
Powering
LVDS drivers
Current & temperature monitoring
vacuum
Data reduction
Time stamping
Slow control
Fast control
Data concentrator
Data reduction
Time stamping
Slow control
Fast control
LVDS to Optical conversion
Signal distribution
Filtering
FEB – Front End Board // CB – Converter Board //
RCB – Readout Controller Board

7. Low voltage distribution
Main objectives:
On-line current monitoring
Latch-up detection & handling (based on STAR solution)
Possibility to use radiation tolerant components (CERN)
Slow control

8. Mechanical design * Material budget ~2.45% X0
Cooling
Cooling
& carrier *
Heat Sink
Heat Sink
Carrier
* +20C ,
Demonstrator
Prototype
Sensor
Cu heat sink
CVDD
300µm
R/O
Flex Cable
Sensor
Flex Cable
Cu heat sink
RVC
TPG
R/O
Sensors thinned down to 50µm
750µm thick sensors
Material budget ~2.45% X0
Material budget ~0.35% X0
TPG - Thermal Pyrolitic Graphite RVC - Reticulated Vitreous Carbon

9. Mechanical design
Sensor
Cu heat sink
CVDD
300µm
R/O
Flex Cable

10. Improving connectivity and handling
 SERWIETE (SEnsor Row Wrapped In an Extra Thin Envelope)
IMEC (Belgium) +
IKF Frankfurt +
IPHC Strasbourg (sensors)
Radiation tolerance ?
Reliability ?
Thermal cycles ?
Real material budget ?

11. Thermal imaging system
IKF Technology Lab
Digital Microscope Keyence VHX-600
Probe Station PA200 (Suss-Microtec)
Thermal imaging system
(VarioCAM HiRes 640)
10-7 mBar vacuum chamber

12. Conclusions & Summary The concept of the MVD read-out is defined
The hardware components for MVD prototye have been delivered to the IKF
Assembly and debugging in progress
Software development is ongoing
Lab tests to be performed
In parallel – software developments
Challanges:
Deliver MIMOSIS-1 – with required radiation tolerance & readout speed for MVD
Most optimum read-out
Connectivity
Second station – large area sensors…

13. Thank you for your attention...
CBM-MVD Collaboration members:
Samir Amar-Youcef, Norbert Bialas, Michael Deveaux, Dennis Doering, Melissa Domachowski, Christina Dritsa, Horst Düring, Ingo Fröhling, Tetyana Galatyuk, Michal Koziel, Jan Michel, Boris Milanovic, Christian Müntz, Bertram Neumann, Paul Scharrer, Christoph Schrader, Selim Seddiki, Joachim Stroth, Tobias Tischler, Christian Trageser, Bernhard Wiedemann
Jérome Baudot, Grégory Bertolone, Nathalie Chon-Sen, Gilles Claus, Claude Colledani, Andrei Dorokhov, Wojchiech Dulinski, Marie Gelin-Galivel, Mathieu Goffe, Abdelkader Himmi, Christine Hu-Guo, Kimmo Jaaskelainen, Frédéric Morel, Fouad Rami, Mathieu Specht, Isabelle Valin, Marc Winter