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XIS meeting agenda S0 door troubleHayashida AE/TCE0 TCE card troubleHayashida DE test status at MHIDotani FPGA failure & DSP 2-bit error countermeasureOzaki.

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Presentation on theme: "XIS meeting agenda S0 door troubleHayashida AE/TCE0 TCE card troubleHayashida DE test status at MHIDotani FPGA failure & DSP 2-bit error countermeasureOzaki."— Presentation transcript:

1 XIS meeting agenda S0 door troubleHayashida AE/TCE0 TCE card troubleHayashida DE test status at MHIDotani FPGA failure & DSP 2-bit error countermeasureOzaki Calibration at Kyoto/Osaka Noise level measurementHayashida CTI measurement with CITsuru How to use CIMIT Possible improvements in FI resolutionKissel BI CCD statusMIT AE/TCE initialization sequenceKissel Ground & Flight Calibration of BI sensorMatsumoto SWG calibration targetsMatsumoto TCE board statusMIT Schedule of TCE card replaceHayashida Schedule of AE/TCE vibration testDotani Schedule of the satellite and XISDotani

2 Final Integration Test Schedule April May June July 2004 Carry-in, Appearance check, Integration, etc. Electric tests of DP, DHU, etc. Overall tests of power system. Overall tests of RF system (telemetry, command, etc). (Golden week, 4/29–5/5) Overall tests of AOCS. Overall tests of XIS, HXD. Sensors are not installed on the baseplate yet. Satellite baking (5/28–6/7) Overall tests of XRS. I/F check with rocket (6/16–29) (IHI Aerospace at Tomioka, Gunma) Install XIS, HXD (7/5). Overall tests of AOCS. XIS, XRS, HXD tests. Function test: detailed. Running test. Function test: nominal (EOB extension). Mechanical, Electric XIS-S, AE/TCE may not be baked. Carry-in XIS-S (5/14) XIS-related

3 Final Integration Test Schedule (cont.) Aug. Sept. Oct. Nov Preparation for TV. Thermal vacuum test (8/16–25). Disassemble side panels. (Summer holidays, 7/31–8/8) Running test (rehearsal of mission operations, 9/15–20). Satellite vibration test (10/25–11/5) Overall tests of the power system. Cool solid Ne; remove pick-ups; alignment measurement, etc. Function test: detailed. Cool solid Ne; Alignment, weight, MOI measurements, etc. Open to press. Dec. Install XRS dewar. Preparation for the vibration tests. Function test: nominal (EOB extension). Ship the satellite to USC (ex-KSC; 2005/1/7). Mechanical, Electric XIS-S is temporarily removed. XIS-related

4 XIS Replacement Plan AprilMayJuneJuly ISAS MIT Kyoto Osaka Final Int. test S/S test, storage Baking Rocket I/F Common Inst. XIS test Install XIS Calibration BI0 BI1 FI0-3 AE/TCE01, 23 BI0,1 AE/TCE23 AE/TCE01 FI0,1 BI0,1 FI2,3 backup AE/TCE Vib. test

5 Progress of MPU tests at MHI December January February … Burn-in FPGA replace PCB coating Assembly Function test Shock (HF) Thermal Vacuum Shock (LF) Vibration Function test MPU All the test results were fine.

6 Progress of PPU tests at MHI December January February … Burn-in PCB coating Assembly Function test Shock (HF) Thermal Vacuum Shock (LF) Vibration Function test PPU01 All the test results were fine.

7 Progress of PPU tests at MHI December January February … Burn-in PCB coating Assembly Function test Shock (HF) Thermal Vacuum Shock (LF) Vibration Function test PPU23 All the test results were fine.

8 AE/TCE Vibration Test Plan April Mon 27 Tue 28 Wed Set-up Z-axis, function check. Orientation change of the machine. X-axis, function check, Y-axis, function check. Withdrawal & Reserve. 25 Sun 24 Sat 23 Fri Spot bonding of AE/TCE screws. AT level Function check of AE/TCE.


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