Presentation on theme: "XIS meeting agenda S0 door troubleHayashida AE/TCE0 TCE card troubleHayashida DE test status at MHIDotani FPGA failure & DSP 2-bit error countermeasureOzaki."— Presentation transcript:
XIS meeting agenda S0 door troubleHayashida AE/TCE0 TCE card troubleHayashida DE test status at MHIDotani FPGA failure & DSP 2-bit error countermeasureOzaki Calibration at Kyoto/Osaka Noise level measurementHayashida CTI measurement with CITsuru How to use CIMIT Possible improvements in FI resolutionKissel BI CCD statusMIT AE/TCE initialization sequenceKissel Ground & Flight Calibration of BI sensorMatsumoto SWG calibration targetsMatsumoto TCE board statusMIT Schedule of TCE card replaceHayashida Schedule of AE/TCE vibration testDotani Schedule of the satellite and XISDotani
Final Integration Test Schedule April May June July 2004 Carry-in, Appearance check, Integration, etc. Electric tests of DP, DHU, etc. Overall tests of power system. Overall tests of RF system (telemetry, command, etc). (Golden week, 4/29–5/5) Overall tests of AOCS. Overall tests of XIS, HXD. Sensors are not installed on the baseplate yet. Satellite baking (5/28–6/7) Overall tests of XRS. I/F check with rocket (6/16–29) (IHI Aerospace at Tomioka, Gunma) Install XIS, HXD (7/5). Overall tests of AOCS. XIS, XRS, HXD tests. Function test: detailed. Running test. Function test: nominal (EOB extension). Mechanical, Electric XIS-S, AE/TCE may not be baked. Carry-in XIS-S (5/14) XIS-related
Final Integration Test Schedule (cont.) Aug. Sept. Oct. Nov Preparation for TV. Thermal vacuum test (8/16–25). Disassemble side panels. (Summer holidays, 7/31–8/8) Running test (rehearsal of mission operations, 9/15–20). Satellite vibration test (10/25–11/5) Overall tests of the power system. Cool solid Ne; remove pick-ups; alignment measurement, etc. Function test: detailed. Cool solid Ne; Alignment, weight, MOI measurements, etc. Open to press. Dec. Install XRS dewar. Preparation for the vibration tests. Function test: nominal (EOB extension). Ship the satellite to USC (ex-KSC; 2005/1/7). Mechanical, Electric XIS-S is temporarily removed. XIS-related
XIS Replacement Plan AprilMayJuneJuly ISAS MIT Kyoto Osaka Final Int. test S/S test, storage Baking Rocket I/F Common Inst. XIS test Install XIS Calibration BI0 BI1 FI0-3 AE/TCE01, 23 BI0,1 AE/TCE23 AE/TCE01 FI0,1 BI0,1 FI2,3 backup AE/TCE Vib. test
Progress of MPU tests at MHI December January February … Burn-in FPGA replace PCB coating Assembly Function test Shock (HF) Thermal Vacuum Shock (LF) Vibration Function test MPU All the test results were fine.
Progress of PPU tests at MHI December January February … Burn-in PCB coating Assembly Function test Shock (HF) Thermal Vacuum Shock (LF) Vibration Function test PPU01 All the test results were fine.
Progress of PPU tests at MHI December January February … Burn-in PCB coating Assembly Function test Shock (HF) Thermal Vacuum Shock (LF) Vibration Function test PPU23 All the test results were fine.
AE/TCE Vibration Test Plan April Mon 27 Tue 28 Wed Set-up Z-axis, function check. Orientation change of the machine. X-axis, function check, Y-axis, function check. Withdrawal & Reserve. 25 Sun 24 Sat 23 Fri Spot bonding of AE/TCE screws. AT level Function check of AE/TCE.