2. Features Standard, currently available, no added cost Available, slightly more expensive, possibly longer lead time Available, more expensive, possibly longer lead time Not available today, R&D only Minimum Dielectric Core Outer layer5 mil4 mil3 mil2 mil Inner layer5 mil4 mil3 mil2 mil Minimum Dielectric Preg Outer layer4 mil3 mil2 mil1 mil Inner layer4 mil3 mil2 mil1 mil DielectricMulti-Function FR4 135TgMulti-Function FR4 150TgMulti-Function FR4 180Tg250Tg Material MetalHasl CU106A,OSPEnig,Tin,SilverElectrolytic AU contacts 30miElectro AU>30mi Finishes Soldermask Thickness on Traces 0.40.8 Maximum7:018:0110:0113:01 Aspect Ratio Working Panel Sizes 18x2420x2424x2424x36 X-OutsAllowed10%Not Allowed

3. FeaturesStandard, currently available, no added cost Available, slightly more expensive, possibly longer lead time Available, more expensive, possibly longer lead time Not available today, R&D only Minimum line width Outer layer5 mil4 mil3 mil2 mil Inner layer5 mil4 mil3 mil2 mil Minimum finished via diameter13 mil10 mil8 mil6 mil (after copper plating) Drill size 0.4 mmDrill size 0.35 mmDrill size 0.3 mmDrill size 0.25 mm Minimum23 mil20 mil16 mil12 mil (VIP) via pad diameter MinimumDrill size +24 milsDrill size + 20 milDrill size + 18 milDrill size + 15 mil plane clearance diameter Minimum soldermask clearance diameter Drill size +13 milsDrill size + 12 milDrill size + 10 milDrill size + 9 mil Minimum4 mil3 mil2.5 mil2 mil soldermask dam Max./Min. plugged soldermask via (drill size)26mil/13mil26mil/12mil26mil/10mil26mil/8mil Maximum93 mil125 mil250 mil300 mil board thickness Minimum20 mil18 mil16 mil10 mil board thickness Maximum16 * 2019" * 23"22" * 23"-- board dimension

4. HASL HASL OSP OSP ENIG ENIG Selective ENIG+OSP Selective ENIG+OSP Flash Gold Flash Gold Gold contacts Gold contacts Immersion Tin Immersion Tin Immersion Silver Immersion Silver Lead Free HASL Lead Free HASL Carbon Print Carbon Print Peelable mask Peelable mask

5. Shearing Inner layer image Inner layer punching Lamination Brown Oxide Inner layer AOI Drilling De-smear Thru Hole Plating Outer layer Image Pattern Plating Alkaline Etching Outer layer AOI Soldermask Legend Routing Electrical Test Final Inspection Inner layer dev. etch strip Panel Plating Drilling X-Ray De-burring ENIG Immersion Tin HASL or LF HASL Contact Plating Immersion Silver OSP Packaging Material

7. SurfaceItemUnit Mass Production Capability R&D HALTin/lead ThkMIAvg 100Avg 300 OSPCoating ThkMI0.15X0.30 ENIG Min. NiMI100X160 160 X200 Min AuMI 2.0X 3.23.2 X3.5 Selective ENIG+OSP Same as ENIG or OSP Flash Gold Min. NiMI150 Min AuMIEtch resist or 1X23 Gold Contacts Min. NiMI160 160 X200 Min AuMI30 35 X70 Immersion TinSn ThicknessMI0.8X1.01.0X1.2 Immersion SilverAg thicknessMI 6X18 Carbon PrintThicknessMI15±520±5 Peelable maskThicknessMI0.2 0.2 X0.3

8. ItemMass CapabilityR&D Remarks Layers 28 36 Layer to layer alignment ± 4mil ± 3mil Min. Dielectric Thickness 3mil Inner layer Cu 1OZ Core thickness 4mil - 63mil 3mil - 98mil Finished board thickness 16mil - 236mil 250mil Thickness Tolerance 31mil ± 3mil ± 2mil 31mil - 47mil ± 4mil ± 3mil 47mil - 63mil ± 10% ± 8% 1.6mm ± 10% ± 8% Material Type Standard Laminate FR-4, CEM-3, Halogen-Free, High Tg, CAF material, High CTI High frequency Laminate Rogers, Arlon, PI, BT, PTFE

9. ItemsMass CapabilityR&D Remarks Panel Dimension T 1.0mm 26×2028×24 T 1.0mm20×16-24×18 Warp & twist T 1.0mm 0.5% 0.4% Exclude unbalance layout or stackup. T 1.0mm 0.75% 0.5% Aspect Ratio 8 1 12 1 Hole wall Cu (Avg.) 0.98mil 1.2mil Innerlayer base Cu thickness.33oz, 0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz Outelayer Cu thickness.33oz, 0.5oz, 1oz, 2oz, 3oz, 4oz,5oz

10. ItemMass CapabilityR&D Remarks Line width tolerance Line width10mil±1.5 mil±1.0 mil 5mil Line width 10 mil ±1.0 mil±0.8 mil Line width <5mil±0.8 mil±0.6 mil Single-ended impedance 28 impedance < 50Ω± 10%± 8% 50 impedance 90Ω± 10%± 8% >90Ω± 8%± 6% Differential impedance impedance < 50Ω± 15%± 12% 50 impedance 90Ω± 15%± 10% >90Ω± 12%± 8%

11. ItemMass CapabilityR&D Remarks Process Method (Soldermask)Screen Printing Alignment±2 mil Thickness On Surface 0.40 mil On Laminate 1.60 mil Developing capability (drill) 16mil With S/M clearance Soldermask Type Taiyo PSR4000 Tamura DSR 2200 Halogen Free Soldermask Huntsman ColorGreen, blue, red, blackMatte Board thickness for plug via requirement 24mil - 95mil20mil - 98mil Plug via size (drill size) 10mil - 22mil6mil - 31mil

12. ItemMass Cap.R&DRemarks Hole Size tol. NP round hole±2mil±1mil NP slot±3mil±2mil PTH round hole±3mil±2mil PTH slot±4mil±3mil Slot Location Slot width87milLen./wid2Len./wid 1.5 87mil slot width 118mil Len./wid 2Len./wid 1.3 slot width 118mil Len./wid 1.3Len./wid 1.2 Hole Registration tol.±3mil±2mil width length

13. ItemMass Cap. R&DRemarks Routing Tolerance ±4mil ±3mil Hole to outline tolerance ±5mil ±3mil V-CUT Thickness 20mil - 98mil 138mil Angle 30° 45° 60° Core Thickness ±2mil ±1mil Alignment of upper and lower cuts ±4mil ±3mil Chamfer Thickness 31mil - 98mil 138mil Angle 20 – 60° 60 – 90 ° Depth Range 20mil - 79mil Depth tol. ±8mil ±6mil

15. LaminateType LF HF Tg ( ) /DSC Td- 5% ( ) / TG A IPC-4101B Z-CTE/TMA T- 260 (min) /TM A T-288 (min)/ TMA Dk/ 1MH z Df/ 1M Hz Fill Anti CA F Res sys a1/a2 ppm / ) 50- 260 Isola PCLFR- 370-HR YN180350 IPC- 4101B/126 45/2202.6%60204.8 0.01 5 YYPN IsolaFR408YN185350 IPC- 4101B/99 19/230 3.3%60 3.6 0.01 2 NYMF ShengyiS1000YN150335 IPC- 4101B/99 48/2503.3%60104.7 0.01 1 YYPN ShengyiS1000-2YN180340 IPC- 4101B/126 45/2202.8%60204.8 0.01 3 YYPN ITEQIT158TCYN150340 IPC- 4101B/99 40/2503.3%60204.8 0.01 6 YYPN ITEQIT180ATCYN180340 IPC- 4101B/126 45/2402.8%60204.7 0.01 7 YYPN According to our experiments on lead free material, the experience during the PCB manufacturing and also the feedback from our customers during their assembly, we compared the general property parameters of various lead free material. Please refer to below table: Basic Property Comparison for Various Material

17. Item Current20122013 Mass Production R&D Mass Production R&D Mass Production R&D Resin System FR-4 Normal TgYes---Yes---Yes--- FR-4 Middle Tg -150Yes---Yes---Yes--- FR-4 High Tg -180Yes---Yes---Yes--- Halogen Free FR-4Yes---Yes---Yes--- Rogers 4350 2lyrYes---Yes---Yes--- BTLimited---Yes---Yes--- PolyimideLimited---Yes---Yes--- RCC and Prepreg RCCYes---Yes---Yes--- Prepreg (recommended Yes---Yes---Yes--- Current Supplier 1. Shengyi 2. Panasonic 3. Goworld 4. ITEQ 5. Grace; 6. Rogers 7. Arlon 8. MGC 9.LG;

18. Item Current20122013 Mass Production R&D Mass Production R&D Mass Production R&D HDI N+C+N343446 Any layer4+2+45+2+54+2+46+2+65+2+56+2+6 Any layer min. core (mm/mil).075/3.05/2.075/3.05/2.035/1.4 Max. board thickness 2.4/953.2/1262.4/953.2/1262.4/953.2/126 ( mm/mil ) Min. board thickness 0.2/8 ( mm/mil ) Warp & Twist tolerance0.75%---0.75%---0.75%---

19. Item Current20122013 Mass Production R&D Mass Production R&D Mass Production R&D Min. core thickness (mm/mil) 0.1/40.075/30.1/40.075/30.1/4.075/3 include copper Min. dielectric thickness.05/2.04/1.6.05/2.03/1.5 (mm/mil ) Min. line width/space.075/3.05/2.03/1.5.04/1.6.03/1.5 (mm/mil) Tol. of W 4mil/.1mm ± 35%± 20%± 35%± 20%± 35%± 20% line widthW 4mil/.1mm± 20%± 10%± 20%± 10%± 20%± 10% Min. annular ring (mil)544332 Min. Clearance (mil)6.556565 Min. hole to trace (mil)6.556565

20. Item Current20122013 Mass Production R&D Mass Production R&D Mass Production R&D Min. drill hole diameter (mm/mil)0.2/8 0.15/6 PTH Tolerance (mil)2---2 2 NPTH Tolerance (mil)212121 Aspect ratio of PTH8:0110:018:0110:018:0110:01 Hole location accuracy ( mil )323232

21. Item Current20122013 Mass Production R&D Mass Production R&D Mass Production R&D Min. Laser Drill diameter (mil)433232 Aspect ratio of Microvia1:01 Plate Filling Microvia (if required)Yes---Yes---Yes--- Stacked via & via on holeYes---Yes---Yes--- Min. Capture Pad annular ring ( mil )1210 88 Min. Target Pad annular ring (mil )1210 88 Laser drill methodLarge Window, Conformal Mask and Copper Direct Drill

22. Item Current20122013 Mass Production R&D Mass Production R&D Mass Production R&D Plug hole board thickness (mm/mil) min/max.5-2.4/20-94.4-3.2/16-126.4-2.4/16-94.4-3.2/16-126.4-2.416/94.4-3.2/16-126 Plug hole diameter( mil )8-316-88/316-88/316-8 Solder Mask registration tolerance ( mil ) ±1.5---±1.5---±1.5--- Min. Solder dam ( mil )31.53 --- Min. SMT Pitch ( mm/mil )0.3/12---0.3/12---0.3/12--- Min. BGA Pitch ( mm/mil )0.4/160.3/120.4/160.3/120.4/160.3/12

23. Item Current20122013 Mass Production R&D Mass Production R&D Mass Production R&D Routing Tolerance ( mm/mil )± 0.1/4± 0.075/3± 0.1/4± 0.075/3± 0.1/4± 0.075/3 Punching Tolerance ( mm/mil )± 0.1/4---± 0.1/4---± 0.1/4--- Step Milling Tolerance mm/mil ± 0.1/4± 0.075/3± 0.1/4± 0.075/3± 0.1/4± 0.075/3 Min. Hole to board edge (mil) 108 8 8 Impedance control 28 Z 50Ω ± 20%---± 20%---± 20%--- 50 Z 100Ω± 10%---± 10%---± 10%--- Z 100Ω ± 8%---± 8%---± 8%--- Surface Process HASL, ENIG, OSP, ENIG+OSP, Electrolytic Ni/Au, Immersion-Silver, Immersion-Tin, Gold finger, Peelable blue mask, Carbon ink

24. Item Current20122013 Mass Production R&D Mass Production R&D Mass Production R&D Max. layer count222422241824 HDI N+C+N343446 Max. panel size (inch/mm) 24x 18 610x460 Max. board thickness (mm/mil) 2.4/943.2/1262.4/943.2/1262.4/943.2/126 Min. board thickness (mm/mil) 0.25/100.2/80.25/100.2/80.25/100.2/8 Tolerance of T 0.5 mm ± 0.05mm---± 0.05mm---± 0.05mm--- thicknessT 0.5 mm± 10%---± 10%---± 10%--- Warp & Twist tolerance0.75%---0.75%---0.75%---

25. ItemMass ProductionR&D HASL ( mi) Average Thickness 100 300 ENIG Min Ni ( µ)100X150 X 150 Min Au ( µ)1.2X2.0 2.0 X4.0 OSP ( µm )0.25X0.50.35X0.5 Immersion-Silver ( µ)6X18 Immersion-Tin( µm )0.8X 1.01.0X 1.2 Gold Finger Min Ni ( µ)160 160 X200 Min Au ( µ)35 35 X70 Peelable blue Mask ( mm )0.2 0.2 X0.3 Carbon ink ( mm).15± 5.20± 5

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