1. The EC-front development plan and planning S. Ahmad, P. Barrillon, D. Cuisy, S. Dagoret, P. Dinaucourt, R. Sliwa, JL. Socha EC design review – LAL – 1 st march 2012

2. 3 different PCBs: First one (EC DYNODE board) allows to reroute half of the dynodes of 1 MAPMT so that they are aligned perpendicularly to the others. It covers the 4 MAPMTs. Second one (EC ANODE board) covers one MAPMT but has dimensions reduced allowing a flex pcb to get out. It is used to collect signal from the anodes and send them to the ASICs. Third one (EC HV board) covers one MAPMT. It welcomes the dynodes and supplies the HV to the EC-dynode board which transmits it to the 4 MAPMTs. EC unit description: front part Per EC unit: 1 EC-DYNODE board 4 EC-ANODE boards 1 EC-HV boards UV filter MAPMT Flexible pcb toward EC-back HV cables toward HV box 2

3. Risk analysis 3 MAPMTs not available at due time Delay in EC assembly/integration Failure in MAPMT pins soldering within the EC EC boards and integration not matching the spec EC insulation insufficient Failure of 1 component (MAPMT, connector, …)  Development plan built taking these risks into account

4. The development plan 4 Important constraints: compactness, fragile MAPMTs, dense stack of 3 pcbs, 14 different (high) voltages, potting, precise positioning Production of a mechanical mock up of the EC-front – Check the mechanical design of the 3 PCBs of the EC-front – Check the assembly of the EC-front – Check the potting procedures – Development of all the tools needed for the continuation Production of a prototype of the EC unit – Check the PCBs electrically, as well as their performances (individually and together) – Validate the assembly and the potting process Production of the Flight Model EC units – Tests at each step of the fabrication and integration Spares will be available for each sensitive components – In total 2 EC-Front units (8 MAPMTs, 2 EC-dynodes, 4 straight EC-anodes, 4 bent EC-anodes, 2 EC-HV) – Spare connectors and passive components (capacitors, resistors, extensions, pins) – Spare PCBs

5. The development plan: tests 5 ElementsCodeType of testsDuration MAPMTAPerformances and uniformityFew hours/unit – 2 weeks total EC-dynodeBElectrical continuityFew minutes/unit – 1 day total EC-anodeCElectrical continuity15 mn/unit – 1 or 2 days total EC-HVDElectrical continuityFew minutes/unit – 1 day total (A + B)EElectrical continuity – assemblyFew minutes/unit – 1 day total (A + B + C + D)FElectrical continuity – functionalities - assemblyFew hours/unit – 2-3 days total All the elements will have to be tested individually and associated For some of them, the tests should be simple and fast

6. The planning Mechanical proto will be started as soon as the CNRS market will be approved (next week hopefully) 6

7. The planning EC-front CAD work (bodies, schematic, design) early 2012 Production of few samples of each board (after design review) with the goal being the test of EC unit prototype 7 done  in progress…