1. Date of download: 6/29/2016 Copyright © ASME. All rights reserved. From: Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules J. Electron. Packag. 2015;137(3):031010-031010-9. doi:10.1115/1.4030686 Infrared (IR) image for an active computing system (Intel Core i5 3470 processor) running 400.perlbench benchmark Figure Legend:

2. Date of download: 6/29/2016 Copyright © ASME. All rights reserved. From: Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules J. Electron. Packag. 2015;137(3):031010-031010-9. doi:10.1115/1.4030686 Architecture—lidded electronic packaging with TEG [5,6] Figure Legend:

3. Date of download: 6/29/2016 Copyright © ASME. All rights reserved. From: Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules J. Electron. Packag. 2015;137(3):031010-031010-9. doi:10.1115/1.4030686 (a) Thermal resistance network of heat flow in electronic packaging and (b) schematic diagram of two-node thermal network Figure Legend:

4. Date of download: 6/29/2016 Copyright © ASME. All rights reserved. From: Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules J. Electron. Packag. 2015;137(3):031010-031010-9. doi:10.1115/1.4030686 (a) Calculated temperature difference between hot and cold sides of a TEG based on the performance counter measurement. (b) The theoretical power output of the TEG as a function of time based on Eq. (8). The CPU load ( ∼ 5 W) is generated by running 400.perlbench in the SPEC2006 CPU benchmark suite on an Intel Core i5 3470 processor. Figure Legend:

5. Date of download: 6/29/2016 Copyright © ASME. All rights reserved. From: Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules J. Electron. Packag. 2015;137(3):031010-031010-9. doi:10.1115/1.4030686 CPU temperature running 400.perlbench spec benchmark in core 2 measured by a thermocouple and a thermal trace, and calculated by a two-node thermal network analysis Figure Legend:

6. Date of download: 6/29/2016 Copyright © ASME. All rights reserved. From: Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules J. Electron. Packag. 2015;137(3):031010-031010-9. doi:10.1115/1.4030686 CPU temperature when executing the 400.perlbench benchmark in core 2 measured with the hardware performance monitoring counters. Horizontal dotted lines represent the targeted temperature for cooling. In this case, 70 °C is the target temperatures under our evaluation to increase the reliability of the CPU. Figure Legend:

7. Date of download: 6/29/2016 Copyright © ASME. All rights reserved. From: Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules J. Electron. Packag. 2015;137(3):031010-031010-9. doi:10.1115/1.4030686 (a) Thermal resistance network of heat flow in electronic packaging with TEGs and TECs, and calculated power generation from the TEGs in the configuration of Fig. 7(c) Figure Legend:

8. Date of download: 6/29/2016 Copyright © ASME. All rights reserved. From: Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules J. Electron. Packag. 2015;137(3):031010-031010-9. doi:10.1115/1.4030686 (a) Temperature distribution measured with thermocouples of the CPU case with a 3 cm × 3 cm-sized TEG using 400.perlbench application in core 2. (b) An IR image of the CPU case with 400.perlbench application in core 2. (c) Schematic of the proposed TECs- and TEGs-based CPU from the measured IR image and thermocouples in Figs. 7(a) and 7(b). Figure Legend:

9. Date of download: 6/29/2016 Copyright © ASME. All rights reserved. From: Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules J. Electron. Packag. 2015;137(3):031010-031010-9. doi:10.1115/1.4030686 Core temperature measurement (°C) of core 0 inside CPU case using an IR camera running 400.perlbench benchmark Figure Legend:

10. Date of download: 6/29/2016 Copyright © ASME. All rights reserved. From: Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules J. Electron. Packag. 2015;137(3):031010-031010-9. doi:10.1115/1.4030686 CPU core temperatures versus sweeping current: (a) with 3.3 mm thick TEG and TEC and (b) with 0.8 mm thick TEG and TEC when executing the 400.perlbench benchmark Figure Legend: