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Pixel Production Database STATUS P. Netchaeva - INFN Genova 13 February 2003.

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Presentation on theme: "Pixel Production Database STATUS P. Netchaeva - INFN Genova 13 February 2003."— Presentation transcript:

1 Pixel Production Database STATUS P. Netchaeva - INFN Genova 13 February 2003

2 Pixel Week - Production update - 13 February 2003 - P.Netchaeva INFN Genova 1 Sensors PDB readiness: Item tables + java application for Wafer upload (with sub-structures) + Report with links to Items exist. Test tables (-last update) + java applications for upload data and download data file + Reports exist. Missing: Last update of test tables. Data: 236 wafers: 201 CiS and 35 Tesla are registered. 121 wafers are with Visual inspection test results. 44 wafers are with Planarity test results. 24 wafers are with SCR test results. 0 wafers are with Thickness test results. Tiles: 478 IV tested (of 708) 36 ITS tested

3 Pixel Week - Production update - 13 February 2003 - P.Netchaeva INFN Genova 2 Electronics PDB readiness: Item tables + java application for Wafer upload (with sub-structures) + Report with links to Items exist. FE and MCC “colours” + java applications for their upload + Reports for colour representation of these Items exist. Missing: New reticle layout will not change Item table, but will change java application for Wafer upload. Test definitions, as a consequence: Tables + java applications + Reports for tests. Data: 34 wafers with FEs and MCCs.

4 Pixel Week - Production update - 13 February 2003 - P.Netchaeva INFN Genova 3 Bare Modules PDB readiness: Item tables + java application for Tile + 16 FE assembling + Report with links: to Items, to Bare Module Assembly sub-Items with link to future tests, to X-ray test data exist. Missing: Test definitions, as a consequence: Tables + java applications + Reports for tests. Data: 33 Bare Modules.

5 Pixel Week - Production update - 13 February 2003 - P.Netchaeva INFN Genova 4 Flex Objects PDB readiness: Item tables + java applications for Flex+components, Flex+MCC assembling + Report with links to Items exist. Test tables + java application for upload + Reports exist. Missing: Our Flex Items all are called “Prototypes”. The PDB Item structure for production Items does not exist. Data: 166 FlexLoadedPrototype Items 46 FlexMCCPrototype Items. Missing: Test data.

6 Pixel Week - Production update - 13 February 2003 - P.Netchaeva INFN Genova 5 Flex Objects: Modules PDB readiness: The Modules are Flex Object Items, so as for Flex Objects: Item tables + java applications for Flex with MCC + Bare Module assembling + Report with links to Items to Module Assembly sub-Items with link to future tests exist. Test IV + Report exist. Missing: Our Module Item is called “ModuleFEIPrototype”. The PDB structure for production Item “Module” does not exist. Test definitions, as a consequence: Tables + java applications + Reports for tests. Data: 23 ModuleFEIPrototype Items with substructures.

7 Pixel Week - Production update - 13 February 2003 - P.Netchaeva INFN Genova 6 23 ModuleFEIPrototype Items:

8 Pixel Week - Production update - 13 February 2003 - P.Netchaeva INFN Genova 7 Mechanics + Assemblies with Modules PDB readiness: Structures are defined. => the Items and Assemblies can be registered at least manually. Local Support test tables + java applications + Reports exist. Missing: java application to register Assemblies in the easy way. To start to think about: Tests for Staves (Bi-staves) and Sectors with Modules on them. Data: 200 Omegas are registered. 11 TMT-left are registered with CC test results. Missing (of existing Items): Al tubes, TMT-right, Sector parts. First Module is mounted on Sector: We need to accelerate… not registered…

9 Pixel Week - Production update - 13 February 2003 - P.Netchaeva INFN Genova 8 Shipments PDB readiness: java applications for: send and receive Wafer (sensor or electronics) send just received Items without change receive an Assembly with the following update of all components location + Report with links to Shipments exist. Shipment statistics Report (Items shipped/time) exist. The activity of the manufacturers seems to be well covered by persons in charge. Missing: Send Electronics Wafer with new reticle layout. Data


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