1. CIRTEK ELECTRONICS CORPORATION Company Presentation

2. Outline Company overview and organization Services and CEC BOM
Product Portfolio and Special Capabilities
Company strengths
Plans and programs
Package Technology Roadmap
Final Test, Finishing and FAREL
Cirtek Electronics Corporation
4/14/2017

3. Outline Company overview and organization Services and CEC BOM
Product Portfolio and Special Capabilities
Company strengths
Plans and programs
Package Technology Roadmap
Final Test, Finishing and FAREL
Cirtek Electronics Corporation
4/14/2017

4. Cirtek Electronics Corporation
4/14/2017

5. Company overview Company Structure
Cirtek Holdings Philippines Corporation
Cirtek Electronics Corporation (“CEC”)
Primary purpose is to engage as an independent subcontractor for semiconductor assembly, test and packaging services
Cirtek Electronics International Corporation (“CEIC”)
A BVI company which provides marketing, logistical and administrative support, including collection to CEC.
Cirtek Electronics Corporation
4/14/2017

6. Company overview CIRTEK TODAY History
Established in 1984 as independent Subcontract Assembly & Test Provider
Accredited by International Quality institutions
CIRTEK has grown to provide world class turnkey solutions that include services from package design development, wafer probe, wafer
back grinding, assembly packaging and final testing of semiconductor devices up to drop shipments to Customer's end users.
Competitive pricing and easily adaptable to customers needs
CIRTEK TODAY
25 years experience outsourced assembly & testing solution provider
High quality products, while providing production flexibility
Competitive pricing and adaptable to customers’ needs.
Profitable despite several economic downturns, debt free company
Growing client base composed of companies located around the world
Cirtek Electronics Corporation
4/14/2017

7. Company overview
Cirtek assembles and tests semiconductor devices at its manufacturing complex located on a 20,000 square meter property in Biñan, Laguna.
Its manufacturing facility is composed of two buildings, with a total floor area of 14,100 square meters. 1800SQM of clean room Class 10K. We offer general line and captive line assembly models
A Philippine Economic Zone Authority (PEZA) registered company as an ecozone export enterprise at the Laguna Technopark for the manufacture of standard integrated circuits, discrete, hybrid and potential new packages.
Cirtek Electronics Corporation
4/14/2017

8. Company overview Business Strategies 1
To develop partnership with its existing and potential customers to provide world class quality solutions through management expertise focused on specific applications to meet customers specification, high reliability and multi chips products.
Partnership with Customer to grow business together 1
To offer dedicated or captive line models for assembly and test services in order to efficiently produce the customer’s mature and stable products through shared investment
Captive Line Development 2
To continuously focus on Innovations and re-Engineering in its production and assembly techniques and capabilities, and to co-develop new technologies with customers
Technology Development 3
To actively seek strategic investments opportunities such as, alliances, joint ventures, and/or acquisitions that will be consistent with the Company’s overall business strategies
Mergers and Acquisitions 4
Cirtek Electronics Corporation
4/14/2017

9. Organizational Structure
PRESIDENT & CEO
Jerry Liu
CFO
Tony Buyawe
EXECUTIVE VP/ GEN MANAGER
Jorge Aguilar
QA DIRECTOR
Luz Veril
QA / FAREL SECTION MANAGER
Zeny Puedan
QC/QA SEC.MANAGER
Jacqueline Blancaflor
VP- Global Business Development
Norman Chang
HUMAN RESOURCE
DIRECTOR
Milet Cruzada
ACCOUNTING
MANAGER
Susan Lumba
MULTICHIPS BUS. MANAGER
MeAnn Canoza
IC BUS. MANAGER
Miles Besana
DISCRETE BUS. MANAGER
Medy Chua
QFN /DFN BUS. MANAGER
Wilson Padre
NEW PRODUCT BUS. MANAGER
Rosendo Cerezo
HERMETICS BUS. MANAGER
Laarni Arnesto
SENIOR DIRECTOR SALES & MKTG-CS
Antonio Callueng
VP FOR ENG’G & PURCH, IND’L MGMT,
Raul Santiano
FINAL TEST MANAGER
Walter Alegarme
DEVELOPMENT ENG’G.
Raymond Tecson
FINAL TEST SUPERVISOR
Manny Olandria
CUST SERVICE TEAM
SUSTAINING ENG’G
Chona Morales
PROBE TEST SUPERVISOR
Roderich Ignacio
MULTI DIE TEST SUPERVISOR
Rey Reyes
Cirtek Electronics Corporation
4/14/2017

10. Outline Company overview and organization Services and CEC BOM
Product Portfolio and Special Capabilities
Company strengths
Plans and programs
Package Technology Roadmap
Final Test, Finishing and FAREL
Cirtek Electronics Corporation
4/14/2017

11. Cirtek Services Sort + Assy + Test + Drop shipment
Wafer backgrinding (8” maximum diameter / 4 mils thick capability)
Wafer mapping (8” maximum diameter / ASCII format)
Wafer probing (6” & 8” wafer diameter)
Die sales inspection (Commercial / Military / Medical level of inspection)
Full assembly (Refer to package portfolio)
Marking (ink / laser)
Final test (Refer to test capabilities)
Tape and reel (SOT, 150 / 300 mil SOIC, QFN / DFN)
Tape and Ammo (TO-92 straight / spread leads)
Drop shipment (To any point as required)
Ship to Stock Serve as your HUB/Distribution center
Cirtek Electronics Corporation
4/14/2017

12. Build of Materials Cirtek Standard Materials
Molding Compound
Leadframe
DA Epoxy
Gold Wire ( Mils)
Stamped LF
Copper A194
PPF -NiPdAu
Etched LF
Plating – Spot Ag
Configuration:
Matrix
HDLF
Single/Dual
84-1LMI/SR4
8900- NC
8600 -
2600AT - HT
QMI 529HLV
CRM 1076NS
Eutectic DA
Solder paste
Sn5Pb95
Sn10Pb90
0.80, 0.90, 1.0 mils
Sumitomo – G600, G770
1.2, 1.3, 1.5, 2.0 mils
Hitachi 9220HF10
Copper Wire ( Mils)
NittoG300LC
1.0 , 1.65, 2.0
Sumitomo 6710/6600
Aluminum Wire ( Mils)
Cookson3200LS
1.25, 5.0, 10
Toshiba KE955WY-white
Copper Clip Attach
Plating – 100% Tin
Plating –SnPB (85/15)
Cirtek Electronics Corporation
4/14/2017

13. Outline Company overview and organization Services and CEC BOM
Product Portfolio and Special Capabilities
Company strengths
Plans and programs
Package Technology Roadmap
Final Test, Finishing and FAREL
Cirtek Electronics Corporation
4/14/2017

14. Product Portfolio QFN/DFN Packages
QFN Body Size
Small Body Size
DFN Body Size
2.00 x / 08L
3.00 x / 08L
3.00 x / 16L
3.50 x / 20L
4.00 x / 24L
5.00 x / 28L
7.00 x / 32L
8.00 x / 52L
0.50 x 0.25 x 0.30 / 02L
1.00 x 0.60 x 0.46 / 02L
1.10 x 1.60 x 0.46/ 02L
1.27 x 0.76 x 0.76/ 02L
2.20 X 1.78 x 0.76/ 02L
2.50 X 1.70 x 0.76/ 03L
Customer Specific
6.00 X 6.00 x 0.90/ 02L
2.90 x / 04L
1.70 x / 08L
2.00 x / 08L
2.50 x / 12L
3.00 x / 12L
3.30 x / 16L
3.00 x / 10L
4.00 x / 16L
Cirtek Holdings Philippines Corporation
4/14/2017

15. 16L Standard – Clip Attach
Product Portfolio
SOIC Packages
150 Mils Body Packages
300 Mils Body Packages
TSOC 6L– 150 x 150 x 55 mils
18L
08L- Stand
20L
16L Standard – Clip Attach
14L - Stand
24/28L
16L - Stand
Exposed Pad Version
08L Mils
16L – 300 Mils
16L – QSOP
Cirtek Electronics Corporation
4/14/2017

16. Product Portfolio Plastic Dual In Line Package 08L 8L, 9L 18L 20L 14L
300 Mils Body Package
600 Mils Body Package
Single In Package
08L
18L
8L, 9L
20L
14L
24/28L
16L
Cirtek Electronics Corporation
4/14/2017

17. Product Portfolio SOT Packages 03L SOT223 TO 92 -Stand 05L SOT 143 06L
TO 92 Packages
03L
SOT223
TO 92 -Stand
05L
SOT 143
06L
TO 92 - Flat
SOT89
Cirtek Electronics Corporation
4/14/2017

18. Product Portfolio Hermetic Packages Cirtek Electronics Corporation
Metal Can ( TO 3- TO 5)
T-Hole Oscillator
SMT/COB Assy
Small Metal Cans
Hybrid Assembly
Build of Materials
Materials
Customer Specific
Consignment
Flexible Arrangement
Cirtek Electronics Corporation
4/14/2017

19. Other Special Assembly Capabilities
Multichip on Standard Package
Standard silicon die attach cylindrical crystal through resistance welding LF design by Cirtek 300 mil (SOIC) Pack.
Multi die on standard 150 mil
2 die up to 32 die, Custom LF design by Cirtek (SOIC) package
Cylindrical Crystal
Control IC
Copper Clip attach on SOIC/QFN ESD and Power Devices
Die to Die Bonding
Multi die embedded ceramic crystal Mounted die in PCB
NC and conductive epoxy
Transfer over mold process
300 mil (SOIC) package
Copper clip
Cirtek Electronics Corporation
4/14/2017

20. Hermetic Module Assembly
Metal lid
Non-hermetically sealed using conductive epoxy
PCB
Passive component attached with solder
GaAs dice attached with conductive epoxy
Gold wire
Cirtek Electronics Corporation
4/14/2017

21. Prescaler-Static divider Module Assembly1 1 3 1 2
LEGEND: 1
CHIP CAPACITOR 1 1 2
CHIP RESISTOR 3
PRESCALER DIE
Cirtek Electronics Corporation
4/14/2017

22. Outline Company overview and organization Services and CEC BOM
Product Portfolio and Special Capabilities
Company strengths
Plans and programs
Package Technology Roadmap
Final Test, Finishing and FAREL
Cirtek Electronics Corporation
4/14/2017

23. Company strengths Certified to the latest quality standards1
Certified to the latest quality standards 2
Solid management team and expertise 3
Ability to adapt to customers’ needs 4
Full turnkey solutions 5
Growing customer base of diverse clients 6
Strong brand name and proven track record 7
A PEZA-registered entity
Cirtek Electronics Corporation
4/14/2017

24. Company strengths   1 World Class Quality standards
Cirtek’s manufacturing practices are designed to be compliant with industry requirements and to exceed customer’s expectation. 
Manufacturing applies latest quality system standards, which include ISO 9001, ISO 14001, QS-9000/TS-16949, BABT and DSCC, as well as certified facility by UL
Cirtek Electronics Corporation
4/14/2017

25. Quality Management System map
Review
Internal Quality Auditing – MOP
Customer Service - COP 10
Customers Requirements
Purchasing
Warehousing
QA /IQA Inspection
Billing
Customers Satisfaction 9
Sales and
Marketing
Process
Design and
Dev’t
Production
Planning
Control
Process
Control Inst / Doc’n
Assembly
Mfg
FA-REL
Final Test
Delivery 1 2 3 4 6 7 8 5
Calibration
Maintenance
Process Engineering
Support Process
Facilities
MIS
Training HR
EMS
Main Process
COP
NOTE:
Support process that has no arrows meaning it will support the whole organization.
MOP
Product Realization
Cirtek Electronics Corporation
4/14/2017

26. Continual Improvement Process
Cirtek Quality Management System
R E Q U I R E M E N T S
C U S T O M E R S
C U S T O M E R S
S A T I S F A C T I O N
Information
Input
Output
Cirtek Electronics Corporation
4/14/2017

27. Outstanding Quality System
QUALITY MILESTONE IN SYSTEM AUDITS PERFORMED BY CUSTOMERS AND INDEPENDENT AUDITORS
ACCREDITTED AS QUALIFIED SUPPLIER BY OEM’s
CUSTOMER/END USER
SPONSOR
YEAR QUALIFIED
APPLICATION
HUAWEI – CHINA
PANASONIC MOBILE COMM–JAPAN
CANON INC - JAPAN
GE HEALTH CARE
MICRONAS AUTOMOTIVE
PANASONIC ELECTRONIC-JAPAN
IBM-JAPAN
INTERNATIONAL RECTIFIER
ST MICROLECTRONICS
CMD
EMERSON (ASTEC)
MEDTRONICS
GENNUM
SEMTECH INC
ANALOG DEVICES INC
SUNPOWER
MICRONAS
DALLAS-MAXIM
IR DIVISION
ST MICRO
SILICON LINK
MICROSEMI
GENNUM-CANADA
2009
2008
2007
2006
2005
2003
2002
POWER SUPPLY - CE
REPEATER/BASE STATION
ELECTRONIC DEVICES
CT SCANNER
HAL SENSOR
FLAT SCREEN TV
ENTERPRISE/OFFICES
DATA NETWORKING
POWER SUPPLY / CHARGERS
MOBILE APPLICATION
POWER SUPPLY - CE
MEDICAL IMPLANTABLE
HEARING AID
Cirtek Electronics Corporation
4/14/2017

28. Company strengths     2 Solid Management Team and Expertise
Management team is composed of highly experienced individuals from various semiconductor and OSAT companies. 
The Cirtek Team has over 150 years of combined management and engineering package design expertise specific to semiconductor industry. 
Lean organization and prudent decision making. 
Focused and goal oriented.
Cirtek Electronics Corporation
4/14/2017

29. Customer requirements
Company strengths 3
Ability to adapt to customer’s needs 
Technical abilities which provide customers a full range of turnkey solutions
Customer satisfaction as evidenced by the awards received from several customers 
Customer requirements
World class quality standards
Excellence in manufacturing
Clean room (Class 10K) facility and practice 5S (Japanese) Discipline
On-time Delivery
Competitive pricing
Flexibility / Responsiveness
Cirtek Electronics Corporation
4/14/2017

30. Package Design & Development Higher productivity / efficiency
Company strengths 4
Full Turnkey Solution 
Provide vertically integrated manufacturing solutions to its customers.
Package Design & Development
Assembly &
Packaging
Test, Pack & drop ship
to end Customers +
Higher productivity / efficiency
Lower cost
Faster time to market
Cirtek Electronics Corporation
4/14/2017

31. Company strengths   5 Growing customer base of diverse clients
A growing portfolio of customers. CHPI currently has 42 customers around the world 
The Company’s customers are located in various countries, with the bulk of revenues contributed by customers located in Europe and the USA
% Contribution to revenues per region
USA
Europe
Asia
Cirtek Electronics Corporation
4/14/2017

32. Company strengths    6 25 Years Proven Track Record
Continuous production growth and generating employment. 
Financially strong. 
Delivering profit and dividend every year.
Cirtek Electronics Corporation
4/14/2017

33. Ability to price products competitively
Company strengths 7
A PEZA-registered entity 
As a PEZA*-registered entity, the Company enjoys certain incentives like tax holidays, duty free importation of materials and reduced power rate vis-a-vis non-registered entities which enables it to price its products competitively.
Tax incentives +
Ecozone power rate
Ability to price products competitively
Entitlement to 5% gross income tax (GIT) incentive. Secure new 4 year income tax holiday (ITH) for new projects
Reduction of 12.5% to 13.5% on power cost
Company savings
* The Philippine Economic Zone Authority (PEZA) is an attached agency to the Department of Trade and Industry tasked to promote investments, extend assistance, register, grant incentives to and facilitate the business operations of investors in export-oriented manufacturing and service facilities located inside selected areas throughout the country
Cirtek Electronics Corporation
4/14/2017

34. Outline Company overview and organization Services and CEC BOM
Product Portfolio and Special Capabilities
Company strengths
Plans and programs
Package Technology Roadmap
Final Test, Finishing and FAREL
Cirtek Electronics Corporation
4/14/2017

35. Plans and Programs 1
Expansion of Manufacturing facility and Capacity 2
Innovation and Re-Engineering 3
Completion of current projects and programs with customers
This will enable us to support 400 Million units of additional new business from existing and potential customers.
Sustaining cost reduction program, higher quality product and stable process through automation and re-engineering. To develop new packages through innovation to maximize yield and satisfy or exceed customer expectation.
Concluding and enabling Cirtek to realize new potential business in the pipe line worth US$11.8 Million by 2012 and to expand product portfolio.
New Potential business:
Power MOSFET QFN
Open cavity moisture / pressure sensor for automotive
Opto Couplers
Exposed Cavity Power Amplifier – HSOP
Current protection devices
Cirtek Electronics Corporation
4/14/2017

36. Outline Company overview and organization
Product offerings, Services and CEC BOM
Product Portfolio and Special Capabilities
Company strengths
Plans and programs
Package Technology Roadmap
Final Test, Finishing and FAREL
Cirtek Electronics Corporation
4/14/2017

37. Package and Technology Roadmap
Package Development Roadmap
PCB / LGA / SIP
FLAT TO92
SMT-COB
STD TO92
FLIP CHIP ASSY
0.5X0.25X0.30 DFN PACKAGE
HYBRID ASSY
AIR CAVITY QFN / DFN
CERAMIC ASSY
SMT
COL / CLEAR PACKAGE DFN
1.0X0.5X0.48 DFN PACKAGE
POWER QFN USING CU CLIP
WLCSP
1.2X0.76X0.76 DFN PACKAGE
JEDEC STD QFN / DFN
METAL CAN
LED ASSY
SOD323
SOT223
SOT23
TSOC
SOT23
SOT143
SOT89
MSOP
TO272
OPEN CAVITY SENSOR
16 QSOP
SOIC NB
SOIC WB
SOIC W/ CRYSTAL
PDIP
SOIC EPAD
HSOP / DSO
Cirtek Electronics Corporation
4/14/2017

38. Package and Technology Roadmap
Cost Reduction / Development Roadmap
Technology
Copper wirebond (90% lower than Au)
AuAg wirebond (20% lower than Au)
BSOB bonding
Ribbon bonding
AuSn Eutectic die attach
Stacked Die attach
Soft solder / Eutectic Die attach
Die attach film
Low loop profile
( 3% lower Au cost)
Auto Clip attach
Material
Korean Cu wire supplier (21% lower cost)
Chinese leadframe supplier (20% lower cost)
Brass / steel leadframe (10% lower than Cu)
High Density Leadframe
(12% productivity improvement)
Matrix Leadframe
Ultra High Density Leadframe
( High Volume)
MGP / automold conversion (14% lower cost)
Mold compound selection GE300LC2 (21.8% lower cost)
Ag plating thickness reduction (5% lower cost)
Cirtek Electronics Corporation
4/14/2017

39. Outline Company overview and organization Services and CEC BOM
Product Portfolio and Special Capabilities
Company strengths
Plans and programs
Package Technology Roadmap
Final Test, Finishing and FAREL
Cirtek Electronics Corporation
4/14/2017

40. Wafer Probe and Final Test
Cirtek Electronics Corporation
4/14/2017

41. Final Test Summary WAFER PROBE CAPABILITIES Wafer Prober
EG1034 – 4” and 5”
EG2001 – 6”
EG2080 – 8”
Ink/Inkless less Process
ASCII format
Cirtek Electronics Corporation
4/14/2017

42. Final Test Summary TEST CAPABILITIES MULTI BIN/POST TEST MARKING
Mixed signal device
CREDENCE ASL-1000, EAGLE ETS 500D, LTX
Discrete device
TESEC 881-TT, FROTHINGHAM CV3000B
Linear device
KEITHLEY, GENESIS
RF / IF device
HP RACK & STACK, HP84000
Digital /Asic device
FAIRCHILD SENTRY, SIEMENS S725
OPTO relay device
TESEC, HIPOT
Protection device
TESEC, KEITHLEY
MULTI BIN/POST TEST MARKING
SOT 89, 223
TO92
Cirtek Electronics Corporation
4/14/2017

43. Final Test Summary TEST / TAPE & REEL CAPABILITIES
Integrated test and TNR handlers
SRM S248 – SOT
SRM XD16 – SOT
SRM S12 – SOT
VECTOR T20 – SOT
QMT 1500 – SOT
SRM 248XS – TDFN
ASM FT2030 FLEXIPACK – SOIC
SRM 244XS – SOIC
ISMECA –NX16 – DFN ( 0402)
Test handlers (SOIC/PDIP)
MCT 3608/5100
MT 8305/8588/8704
AETRIUM 2020 DTS
TNR handlers (SOIC)
G6 Visdynamics
Systemation TO 485 with 3D vision
STI 8028 / ST 60
Cirtek Electronics Corporation
4/14/2017

44. FAREL CAPABILITIES
Cirtek Electronics Corporation
4/14/2017

45. Failure Analysis Capability
Internal / external inspection
High / low power microscope
X-RAY
SOFTEX 100
Decapsulation
DECAP AS2000
Autoclave
NAPCO 8110-TD test chamber
Open / short test
TEXTRONICS curve tracer
85% / 85oC moisture soak
ENVIRO SYSTEM chamber
Temperature cycle
Polisher / grinder (cross sectioning)
SBT–MODEL 900
Cirtek Electronics Corporation
4/14/2017

46. Reliability Test Capability
Die shear
MIL STD
Bond strength
MIL STD
Mark permanency test
MIL STD
3 mins soaking time using 30 strokes
Solderability test
MIL STD / JESD22-B102D
8 hrs steam 100oC
Temperature cycle
MIL STD 883E /JESD22-104B
10 cycles 10 minutes / cycle
Low -65oC (+0, -10oC)
High 150oC (+15oC / -0oC) +150oC (+15,-0oC)
Stability bake
MIL STD
6 175oC
Cirtek Electronics Corporation
4/14/2017

47. Reliability Test Capability
High temp storage
JESD22-A103B
500 hrs 150oC
Auto clave
JEDEC 22A 102-C
15 PSI for oC
Fine leak
MIL STD 750D / Test Condition D
30 secs soaking 125oC
Moisture soak
IPC / JEDEC J-STD-020C
168 hrs soaking 85% RH / 85oC temp
Cirtek Electronics Corporation
4/14/2017

48. WHY CIRTEK as ASSSEMBLY & TEST SUBCONTRACT PARTNER?
QUALITY FIRST MIND SET
STABLE COMPANY
PROVEN TRACK RECORD
GROWING COMPANY
FLEXIBLE & RESPONSIVE
↗ Cost competitive
↗Continue to Innovate and re-engineer to add value to production and cost
●Abundance of skilled workers
●Very low turn over rate
●Educated workforce
→ Philosophy - Long Term Relationship
→ Strategy – Partnership for Business Growth
→ World Class Quality -External manufacturing of Customer
Cirtek Electronics Corporation
4/14/2017

49. Cirtek Electronics Corporation
4/14/2017