1. Stave programme

2. 2 Staves recently build Stave#7 –I think is at QML –Intend was to aggressively thermally cycle and look for structural issues Stave#8 –Shield-less tapes, no cut-outs –K13C2U/EX1515, 45gsm –2.275mm OD Titanium pipe, no fittings –Intended to be the 130nm thermo-mechanical prototype –At Sheffield, waiting for fittings? –Then to RAL/Oxford, to be placed in old frame (located at Oxford), for mounting of thermo-mechanical dummies Stave#9 –Shield-less tape with cut-outs, one side Au-plated, but with delamination problems –K13C2U/EX1515, one side 45gsm, one side probably 100gsm –3.125mm OD stainless pipe, VCR fittings –Intended for Wire-bonding trials – in particular along edge to study implications of C-channel Measuring capacitive coupling between cooling plate and dummy readout strip (not yet done) Measuring conductivity beteen pipe and core/skins (not yet done) –Currently at Oxford, waiting for locking points and the stave from frame from QML –Then to RAL for plasma cleaning and wire-bonding

3. 3 What we talked about at one point… A very thin stave (2-3mm) –This went on the backburner since we are investigating the embedded break A stave with a multiply cut (and welded) cooling pipe Local flatness is good, globally there still seems to be a (~200μm) bow –not sure whether this is a problem –Need to see how it works with new jig Material optimization always to be worked on, but no obvious target at the moment –I don’t thik we have a conclusive answer whether glue application on pipe is sufficient…

4. 4 What we will need in the future 1 or 2 stave cores for 130nm electrical staves –Want to do a nice job, as these will be visible 3 stave cores for insertion trials in mock-up at RAL –Exact design of cylinder mock-up needs to be decided, but 3 is minimal number to study insertion of a stave between two adjacent ones All these should have the ‘final’ 130nm stave design (13 modules etc.) –Use new set of tooling –I also think we need a stave frame for each of them Smaller things: –Prototype embedded break (with thermistors + their connections) –Co-cure ground pads into skins (better conductivity measurements) –Have we ever concluded on the core material question (different HC size, corrugations?) And some procedural questions –Further development of procedures play through a real production schedule (2wks per stave core, 1 stave per wk)? –At what point should we start production at Liverpool?