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Wafer probing in Legnaro/Padova E. Fioretto Laboratori Nazionali di Legnaro for the LNL-Padova SPD Test Group 04/02/2003 E. Fioretto INFN - LNL SPD Meeting.

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Presentation on theme: "Wafer probing in Legnaro/Padova E. Fioretto Laboratori Nazionali di Legnaro for the LNL-Padova SPD Test Group 04/02/2003 E. Fioretto INFN - LNL SPD Meeting."— Presentation transcript:

1 Wafer probing in Legnaro/Padova E. Fioretto Laboratori Nazionali di Legnaro for the LNL-Padova SPD Test Group 04/02/2003 E. Fioretto INFN - LNL SPD Meeting

2 Wafer prober location SPD Meeting 04/02/2003 E. Fioretto INFN - LNL LAE building Clean room Probe station

3 … already done July 2002 Transfer of the probe station from Padua to Legnaro August 2002 Chuck upgrade → PA150 → PA200 September 2002 Tests with the reference chip October 2002 Contact tests with the  3 probe card November 2002 Contact tests with the ALICE probe card+ Dummy Contact tests with the ALICE probe card + Dummy December 2002 Microscope upgrade January 2003 Tests of the Wafer PKVM14T E. Fioretto INFN - LNL 04/02/2002 SPD Meeting

4 Microscope upgrade SPD Meeting 04/02/2003 E. Fioretto INFN - LNL The motorization of the microscope and the new EPROM release for the control unit have been installed last week before Christmas.

5 Control software upgrade SPD Meeting 04/02/2003 E. Fioretto INFN - LNL ProberBench Version 5 WINDOWS 2000

6 Contact quality SPD Meeting 04/02/2003 E. Fioretto INFN - LNL Needle-prints Contact height 80  m below the height of first contact

7 ALICE1LHCb Test Protocol SPD Meeting 04/02/2003 E. Fioretto INFN - LNL Tests carried out on each chip : Current consumptions JTAG functionality DAC test Minimum Threshold (Pre_VTH) Threshold scan of all 8192 pixels Probe card MB-card MXI controller JTAG PilotPCVME

8 Tests of the Wafer PKVM14T Only 1 dead pixel Pre_VTH = 201 SPD Meeting 04/02/2003 E. Fioretto INFN - LNL

9 Map of the Wafer PKVM14T SPD Meeting 04/02/2003 E. Fioretto INFN - LNL Lot 3 Class I Class II Class III

10 Chip classification SPD Meeting 04/02/2003 E. Fioretto INFN - LNL Class I - Chips for Bump Bonding JTAG and DAC  OK Mean threshold < 30 mV Pixels missing or defect < 1% (82) I_anal < 350 mA ; I_dig < 270 mA Class III - Chips with major defects JTAG and DAC  not passed Mean threshold not found No digital output I_anal > 350 mA ; I_dig > 270 mA Class II - Chips with minor defects JTAG and DAC  OK Mean threshold > 30 mV Pixels missing or defect > 1% (82) One or more columns are missing I_anal < 350 mA ; I_dig < 270 mA

11 Class Population SPD Meeting 04/02/2003 E. Fioretto INFN - LNL

12 …. more on the Class I SPD Meeting 04/02/2003 E. Fioretto INFN - LNL

13 …. more on the Class I SPD Meeting 04/02/2003 E. Fioretto INFN - LNL Mean Noise I_dig I_an

14 …. more on the Class II SPD Meeting 04/02/2003 E. Fioretto INFN - LNL Chip 74

15 …. more on the Class III SPD Meeting 04/02/2003 E. Fioretto INFN - LNL Chip 73

16 Local Database for the test results SPD Meeting 04/02/2003 E. Fioretto INFN - LNL FileMaker Pro

17 What next SPD Meeting 04/02/2003 E. Fioretto INFN - LNL Test system validation Petra Petra Solve the problems related to the use of the integrated SPD database Michele Michele New solutions to accelerate the time needed for the chip test Automatic procedure for chip searching and needle positioning Next wafer Next wafer


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