1. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 1 EXPORT CONTROL THE INFORMATION AND TECHNICAL DATA CONTAINED IN THIS DOCUMENT ARE CLASSIFIED UNDER CATEGORY 4E001.A ACCORDING TO THE SWISS EXPORT CONTROL REGULATIONS. EACH RECIPIENT IS RESPONSIBLE TO ENSURE THAT USAGE AND/OR TRANSFER OR DELIVERY OF THIS INFORMATION COMPLIES WITH ALL RELEVANT EXPORT CONTROL REGULATIONS. PROPRIETARY INFORMATION THE INFORMATION CONTAINED IN THIS DOCUMENT IS THE PROPERTY OF THE VIBRO-METER GROUP OF COMPANIES AND SHALL BE USED ONLY BY THE RECIPIENTS FOR THE PURPOSE FOR WHICH IT HAS BEEN SUPPLIED AND SHALL NOT BE DISCLOSED TO ANY THIRD PARTY WITHOUT THE WRITTEN CONSENT OF VIBRO-METER

2. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 2 GEnx 1B Engine Monitoring Unit P0x Delta DDR – Section 2.5 Power Supply Module 18 th November 2008

3. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 3 Power Supply Changes BOM and Manufacturing changes driven by outcome of HALT testing and recent lessons learnt Layout and Mechanical Housing unchanged

4. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 4 GENx EMU Power Supply EMU127 271-127-0SS-HHh BOX/COVER(TOP) 271-127-108-XXX 271-127-101-XXX FRONT PLATE 271-127-110-XXX FRONT BACKPLANE 271-127-120-XXX REAR COVER 271-127-150-XXX REAR BACKPLANE 271-127-160-XXX PSM Power Supply Module 271-127-200-XXX DC/ 271-127-220-XXX AC/DC 271-127-260-XXX VSM Vibration Signal Processing Module 271-127-300-XXX Programmable component 271-127-311-XXX BOOT 271-127-713-XXX CPM Communication and Processing Module 271-127-400-XXX CPU1 Programmable Component 271-127-411-XXX CPU2 Programmable Component 271-127-412-XXX CPU3 Programmable Component 271-127-413-XXX CPU1BOOT 271-127-710-XXX CPU2BOOT 271-127-711-XXX CPU3BOOT 271-127-712-XXX FLEX for PSM/Rear Backplane 271-127-270-XXX FLEX for PSM/VSM/CPM 271-127-280-XXX FLEX for VSM/Front Backplane 271-127-350-XXX FLEX for VSM/Rear Backplane 271-127-360-XXX FLEX for CPM/Front Backplane 271-127-450-XXX FLEX for CPM/Rear Backplane 271-127-460-XXX FLEX for CPM/VSM 271-127-470-XXX

5. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 5 DC/DC Convertor sub-Module

6. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 6 1. Replacement of ALU capacitors (1) Description: HALT test made on EMU (P06) shows that the hold-up electrolytic capacitors (C101, C102, C103, C104, C105, C106), providing the power reserve in case of a loss of power input (Transparency time), present a risk of failure with high vibration levels. For reliability improvement, these capacitors have been replaced with a new type of capacitors with a higher vibration resistance. Solution: Change current 6 capacitors 1000 μF / 63V type PEG 124 (Evox Rifa manufacturer) with 5 capacitors 1400 μF / 63V type PEG 225.

7. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 7 1. Replacement of ALU capacitors (2) Higher Vibration resistance - old capacitors (PEG124 series) have a vibration specification of 10g, 3x2h - new capacitors (PEG-225 series) is giving improved vibration specification of 20g, 3x22h With new capacitors (5xPEG225 instead of 6xPEG124): 7000 μF available instead of 6000 μF  transparency time increased. Better ESR characteristics Higher current ripple tolerance Improvements with new capacitors:

8. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 8 1. Replacement of ALU capacitors (3) New capacitors have the same temperature characteristics. New capacitors are compatible with footprint of current capacitors  Need no modifications of current layout of PSM Manufacturer EVOX RIFA provides characteristics of PEG225 capacitors for full temperature range : -55°C to +125°C Improvement of characteristics for power quality qualifications tests. No impact on other qualification tests (similarity), (no weight/mechanical impact, no EMI impact….) Improvements with new capacitors:

9. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 9 2. Replacement of flyback converter diodes D731 and D732 Description: Reverse voltage on diodes D731 and D732 can go up to 45V. Diodes currently mounted are D1FS4 diodes specified with a maximum reverse voltage of 40V. These diodes present a risk of failure. Solution: Replace current diodes D731 and D732 with diodes type ES1B specified with a reverse voltage of maximum 100V. Solution already tested and verified.

10. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 10 3. Component Vibration decoupling improvement Analysis: Lessons Learnt. The localized usage of glue onto soldered components shows an improvement onto some vibration related failure modes. Solution: Components with a high weight or specific form-factor have to be glued. The list of these additional components is given hereafter. L301, L401, L501, L601 L701. Must be glued due to component size and weight

11. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 11 AC/DC Convertor sub-Module

12. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 12 1. Replacement of diode D5 of AC/DC flyback converter Problem: Current diode D5 of flyback converter (AC/DC board) is a schottky diode with a very high leakage current at high temperature  for high temperature conditions, power dissipate on diode may increase its temperature near its maximum operating temperature. For reability improvement, this schottky diode must be replaced by a diode with lower leakage current. High temperature tests confirm that this diode present a risk of failure for very high temperature conditions Low current < 20mA (used to supply internal regulator of PSM)

13. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 13 1. Replacement of diode D5 of AC/DC flyback converter Solution: Replace the current schottky diode type 15MQ040N diode with a diode type ES1B (VM PNR 957.05.05.0846) with better DC reverse current characteristics and a higher operating temperature range This solution has been validated with high temperature tests. No functional impact. CHARACTERISTICSCurrent diodeDiode ES1B Leakage currentUp to 20mA @ 125°CUp to 200μA @ 125°C Operating Temperature -40 °C to +150°C (upscreened) -55°C to +150°C Reverse Voltage / Forward current40V / 3A100V / 1A

14. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 14 2. Upscreened diode D8 of AC/DC flyback converter Description: The Diode Dual Fast Recover BYW99W-200 (VM PNR:957.05.05.0105U) is an upscreened part. VM has searched for a replacement for this device, and propose to use of the part MUR3020WT (VM PNR:957.05.05.0106) which has the same technical characteristics, and is already a full Mil Temp component. So the upscreening is no longer required. Solution already implemented and fully tested in “other” Engine mounted equipment using the same PSU. Output Diode of Flyback converter DCGND From after AC IN filter (internal) 330V 271-126-260-HHh VDC D8

15. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 15 3. Replacement of diode D3 and transistor Q1 Description: During the mounting of the board in production, the insulation between the transistor / diode and their support can deteriorate. Solution: Replace current components with new parts with a insulated package instead of a non insulated package. New components mounted are the same parts that the old ones, only the package is changed (technical characteristics are identical): - D3 : STTA506D  STTH506FP (PNR 957.05.05.0857) - Q1 : STP7NK40Z  STP7NK40ZPF (PNR 957.05.18.0052) Note: Insulations tests are now made during production tests to guarantee the wanted insulation. Solution already implemented and fully tested in “other” Engine mounted equipment using the same PSU. With non insulated parts. When the transistor or diode is screwed to their support, the insulation pad mounted between can be damaged, causing a deterioration of the insulation. With insulated parts, this problem is resolved

16. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 16 4. Component Vibration decoupling improvement Analysis: After EMU123 and EMU127 investigations, the generalized usage of glue onto soldered components shows an improvement onto some failure modes. Solution: Components with a high weight or specific form-factor have to be glued. The list of these components is given hereafter. (only components not glued yet are listed)

17. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 17 DZ9, DZ10: PNR 957.05.07.0018. Must be glued due to component size (lesson learnt T900) C200, C203: PNR 957.02.03.1531. Must be glued due to height+weight Pin of capacitors C301, C302, C303, C304, C305 have to be looped. For vibration stress relief 4. Component Vibration decoupling improvement

18. © Vibro-Meter Confidential and subject to Export Control as per Front PageGEnx EMU DDR 18 November 2008Section 2.5 PSU Slide 18 PSU Verification Listed PSU Changes have already been verified by Vibration and Temperature RET testing on legacy EMU product Certification plan is as per 25-Point Certification Matrix to be performed at Component Level for – 2B certification (Currently scheduled Feb to May 2009)