1. 1 The more awaited revolution

2.  Electronics without silicon is unbelievable, but it will come true with evolution of diamond or carbon chip.  Silicon disadvantages:- >bulk in size >slow operating speed  Germanium disadvantages:- >large reverse current. >Less stability towards temperature.  By using carbon as manufacturing material, we can achieve smaller, faster and stronger chips 2

3. What is Diamond chip?  Diamond chip is nothing but carbon chip. Carbon chip is an electronic chip manufactured on a diamond structural carbon wafer.  The major component using Carbon is ”CARBON NANOTUBE”  3

4.  Carbon nanotubes were discovered in 1991.  It is a nano - size cylinder of carbon atoms.  They are made of one or several concentric walls in which carbon atoms are arranged in hexagonal pattern, measuring several tens of microns in length and less than a few nanometers in diameter. 4

5. 1. Single walled nanotube(SWNT) 2. Multi walled nanotube(MWNT) 3. Torus 4. Nanobud 5. Cup stacked carbon nanotubes. 5

6. 6 Diameter close to I nm. Tube length million of times longer. Application of SWNT p-FET exposed to oxygen n-FET otherwise. Hence a NOT logic gate is created.

7. 7 It has multiple rolled layers. Two proposed models:- 1. Russian model- >Concentric. 2. Parchment model- >Rolled in around itself **Special feature- Chemical resistance.

8. 8 A nanotorus is a carbon nanotube bent into a torus i.e. doughnut shape. Nanotori have unique properties:- >Magnetic moments 1000 times larger than previously expected for certain specific radii. >High thermal stability. Properties are dependent on radius of the torus

9. 9 Fullerene balls covalently bonded to underlying nanotubes. PROPERTIES:- Good field emitters. Fullerene molecules act as anchors, enhancing mechanical properties by avoiding slipping.

10.  Among the carbon technologies being pursued for electronics, graphene is the most promising for integration with silicon semiconductor processes.  It is one atom thick planar sheet of sp2 bonded carbon atoms densely packed in a honeycomb crystal lattice.  A team has used graphene to build a chip known as a frequency multiplier. Frequency multipliers take an incoming electrical signal of a certain frequency and produce an output signal that is a multiple of that frequency. 10

11. Problems faced by graphene:- 1.Has a missing band gap thus, -acts more like a conductor than a semiconductor. -graphene FETs (field-effect transistors) have terrible on-to-off current ratios. 2.Heats up considerably when operated at saturated currents, defeating the purpose of its usage. 11

12. 1. Strength.strongest in terms of tensile strength.stiffest in terms of elastic modulus.Hollow structure, undergo buckling under compression. 2.Hardness Diamond is the hardest material known 12

13. 3. Kinetic In MWNTs inner nanotube core may slide, almost without friction, within its outer nanotube shell thus creating an atomically perfect linear or rotational bearing. 4. Electrical unique properties dependent on structure as told by its indices. 13

14.  Doping Very few found. Unlike silicon no recrystallisation instead doping after annealing turns the regions into graphite amorphous carbon.  Scaling inability to grow single-crystal diamond across wafers much bigger than an inch and a half 14

15. SMALLER COMPONENTS ARE POSSIBLE  As the size of the carbon atom is small compared with that of silicon atom, it is possible to etch very smaller lines through diamond structural carbon. We can realize a transistor whose size is one in hundredth of silicon transistor. IT WORKS AT HIGHER TEMPERATURE  Diamond is very strongly bonded material. It can withstand higher temperatures compared with that of silicon. At very high temperature, crystal structure of the silicon will collapse. But diamond chip can function well in these elevated temperatures. Diamond is very good conductor of heat.  So if there is any heat dissipation inside the chip, heat will very quickly transferred to the heat sink or other cooling mechanics. 15

16. FASTER THAN SILICON CHIP  Carbon chip works faster than silicon chip. Mobility of the electrons inside the doped diamond structural carbon is higher than that of in he silicon structure. As the size of the silicon is higher than that of carbon, the chance of collision of electrons with larger silicon atoms increases. But the carbon atom size is small, so the chance of collision decreases. LARGER POWER HANDLING CAPACITY  For power electronics application silicon is used, but it has many disadvantages such as bulk in size, slow operating speed, less efficiency, lower band gap etc at very high voltages silicon structure will collapse. Diamond has a strongly bonded crystal structure. So carbon chip can work under high power environment.. We can connect high power circuit direct to the diamond chip  16

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