1. 14/12/20111 Chip in board encapsulation Julien Bonis bonis@lal.in2p3.fr

2. 14/12/20112 Encapsulation Chip in board PCB FEV7 Chip bonding by CERN Wire depth are about 0.3mm from surface LAL encapsulationHybrid SA (CH) encapsulation Manual process Industrial process

3. 14/12/20113 LAL encapsulation method : Resin injection Low viscosity epoxy (Araldite 2020) injected under Teflon cap Cavity for glue excess GlueViscosity [CPS] Araldite 2020150 Stycast 1265600 EP30MD1700 EPO-TEK E41101200 Sole of the cap

4. 14/12/20114 5mm 1mm

5. 14/12/20115 Hybrid SA (CH) encapsulation method : Glob top (Jetting process) Resine are spurt on bonding as ink on paper with inkjet printer Industrial automatic process Black resine Thin but irregular surface

6. 14/12/20116 5mm 1mm

7. 14/12/20117 Shortage of resine : Hybrid S.A prefere realise themself bonding Present bonding wasn’t optimizise to globtop, too higth. PCB design should be modify to reduce wire length

8. 14/12/20118 Jetting Globtop encapsulation Disadvantages Black opaque resin Irregulare surface Need fitting Advantages Industrial process, automatique and fast. Subcontractor (bonding and encapsulation in same place) Injection encapsulation under Téflon cap Disadvantages Manual process, need studies for industrialisation No subcontractor possible Polymerisation need time Advantages Transparent resin : visual bonding control Flat surface Sure result