1. PMG, June 15, 2000 Slide 1 Schedule Started ! Done Late Done Done(today)

2. PMG, June 15, 2000 Slide 2 Sensor Delivery p Axial detectors (3-chip):  All sensors in hand p 90 o detectors, DSDM (6-chip):  ~60 sensors to be delivered; current delivery 5/wk  production paced by sensor delivery  Micron delivery just in time, and remains worrisome »Fallback: Accept sensors which have one p-stop fault (noise region 10-15 channels). 15 such sensors have been identified »Need to act soon on lower grade devices p 2 o detectors (9-chip)  Still to deliver 27 + 24 (lyr2), 8 + 24 (lyr4) sensors, which includes sensor to be returned after cleaning  226 sensors being processed at Micron (with yield of 53%), of which 94 have 4 month processing remaining  Taking processing into account, will need to purchase ~10 lower grade devices »Fallback: Accept sensors which have higher R bias, ~50 sensors have been identified p F-Wedge sensors Micron:  All 125 sensors received Eurisys:  Order of 65 sensors complete  Enough sensors on hand to build full complement of F disks  But, breakdown Voltage 70 - 80V at V depl =15-20 V for most  One more batch processed with improved implantation. Received 9 sensors of last batch. Quality indeed better. Requested delivery of all sensors of this batch (~20) in exchange for lower quality sensors received.

3. PMG, June 15, 2000 Slide 3 Sensor Delivery p H Wedges  additional 42 sensors needed which will arrive soon.  ()() ()()

4. PMG, June 15, 2000 Slide 4 High Density Interconnect Status p 3-chip hdi’s  done p 6-chip hdi’s  All hdi’s in hand  40 to be stuffed at Promex p 9-chip hdi’s  Last 46 hdi’s (short tail) on order; delivery next week  40 hdi’s at Promex for stuffing, 46 to go p F-wedge hdi’s  All hdi’s in hand  ~35 to go for stuffing at Promex p H-wedge hdi’s  All hdi’s in hand  75 to go for stuffing at Silitronics

5. PMG, June 15, 2000 Slide 5 Ladder and Wedge Production p Axial detectors (3-chip):  Ladder production has started again at rate 1/day  No problems foreseen p 2 o detectors (9-chip):  Production lagging due to availability of hdi’s »Reorder hdi’s »Problems with surface mounting components (Promex); e.g. problems with 27 hdi’s of one type (short tails)  Production slowly proceeding p 90 o detectors (6-chip):  Paced by Micron delivery, 107 sensors built so far p F Wedges (14-chip):  Production proceeding at adequate pace  Sensor and hdi availability not a problem  Recently received most Eurisys detectors with low V depl  Testing sensors is cumbersome p H Wedges (6-chip):  180 half wedges produced to date  Half wedge production proceeding adequately  Glued 39 full wedges of which ~21 detector grade  Encapsulation and full wedge production is slow but not limiting process

6. PMG, June 15, 2000 Slide 6 Production Status and Projection p Projected rates: assumed yieldcapacity  9-chip: 9.0/week 80% 15/wk  6-chip: 5.4/week 85% 10/wk  H-wedge: 6.2 week 85% 10/wk  F-wedge: 4.3/week 90% 15/wk Nov 1, 00 Aug 10, 00 today 50% line

7. PMG, June 15, 2000 Slide 7 Production Status for first half cylinder p Last dates for detector production keeping original schedule with completion August 1:  F Wedges: June 26, 2000  6/9-chip ladders: June 12, 2000 p 4 flavors of 9-chip ladders; current status: “short tails” Delay of ~ 3 weeks with respect to schedule

8. PMG, June 15, 2000 Slide 8 Production Rate

9. PMG, June 15, 2000 Slide 9 Barrel / Disk Assembly p First barrel (barrel 6) completed May 18 p Grounding problems observed in first barrel, coherent noise  barrel will be moved to address these problems p Second barrel (barrel 5) completed June 13 p Work on third barrel started p Third F disk encountered set back  remeasurement of alignment showed discrepancies of ~100  m  Probably due to mislabeling of files  OGP measurements performed today and disk should be completed today. p Next F disks, one of end disk assemblies, being prepared p Wedge production proceeding adequately for future assembly p H-disk still awaiting ORC sign-off for electrical tests

10. PMG, June 15, 2000 Slide 10 Silicon Support p Silicon Support Cylinder  Fabrication of support at z=o  Adding fiducials to end rings  Finished installing H disk kinematic mounts  Finished installation of adapter ring  Add reinforcements to cylinder feedthroughs  …...  June 26 move CFT to DAB