2 SEMICON Sp. z o.o. History: 1987 – foundation of SEMICON Sp. z o.o. 1992 – first signed distribution agreement: LEM NORMA1993 – 1996 – next distribution agreement: Kontakt Chemie, Schurter, Multi- Contact1997 – SMT assembly line launch1998 – launch of an electronics store in Warsaw (Wolumen)2003 – implementation of the ISO 9001:2008 quality system2009 – starting stencils laser cutting service
3 SEMICON Sp. z o.o. Participation in EU Framework Programmes: – project: GreenRose (FP6)– project: Tele-Ekg (FP6)– project: Radi-Cal (FP7)– project: ChipCheck (FP7)– project: µBGA (FP7)
4 SEMICON Sp. z o.o.Today:Currently, the company employs over 50 people including headquarter, production and shop.Starting from 1st January 2013 we are participating in a new national project - Innovative advanced surface mount technology (SMT) printed circuit boards.Source: STATS ChipPACSource: PCB-togo.comSource: code.google.com
5 Certificates ISO 9001:2008 ISO 14001 AQAP 2110 We only work with companies which have UL certificatesSEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ;
6 SEMICON Sp. z o.o. - business areas Distribution: Electronic componentsElectronic materialsMeasuring equipment and accesories6
7 SEMICON Sp. z o.o. - business areas Subcontracting: PCB assembly (THT, SMT)Laser cut SMT stencils manufacturingOwn production of laser modules
8 THT and SMT assembly More than 15 years experience in electronics Customer support from design to productionEngineering consultancyDirect contact to supply chainESD controlIPC-A-610 trained employeesCompliance with RoHSPCB Design possibilitiesComponent supply possibilities
9 Production capacity - SMT assembly 4 SMT lines Źródło: JUKI Co.4 SMT linesprototypes, small, medium seriesPCB size: max. 800 x 510 mmComponents: x 74 mm, PoPPCB thickness: 0.2 mm - 4.0mm, flex PCB assemblyPitch: ≥ 0.20 mmSelective conformal coating possibilitiesGlue, solder paste possibilitiesAOI inspection, functional tests, test probes, BGA – X-ray measurementsHot Bar technologies (flex, LCD)
10 Production capacity - THT assembly Manual soldering Lead wave solderingPB-free wave soldering in nitrogen1.2 mln THT components monthly/1 shift
11 Main customers Medical Defence Automotive Energoelectronic Lighting TelecommR&D
12 Stencils laser cutting High-speed cutting machine LPKF Stencil Laser G6060Frame or frameless stencilsAccuracy and repeatability: ±2µMaterial: stainless steel, nickelThickness: up to 600µm (oxygen cutting)Engineering, modifications, e.g. glue stencilsAperture inspection – high resolution scannerTension inspectionŹródło: LPKF Laser & Electronics AG
13 Optoelectronic equipment manufacturing Laser modulesWavelenghts: nmPower input: 0,2 – 500mWPointersLine and cross generatorsCustomizationLaser displacement sensors:Resolution: up to 10µmMeasurement range: up to 200mmMeasurement distance: up to 50mSystem includes: laser module and position detector
15 Miniaturization in electronics Passive ComponentsSource: pl.wikipedia.org
16 Miniaturization in electronics - ICs Source: Amkor Technology, Inc
17 SMT challenges 01005 components – paste screenprinting QFN, DFN components – lifting effect, voidsLarge and fine pitch BGAs – thermal balance, voids, „head in pillow” effectPoP components – warpage, placing, BGAs errorsLarge PCB assembly – bow and twist
18 World trends: higher density PoP 3D package developmentFirst generation: multi-level structuresSecond generation: PoPsNext generation: TMV PoPs, BVA PoPsSource: Invensas CoSource: Amkor Technology, Inc.Source: Amkor Technology, Inc.World trends: higher density PoP
19 PoP – Package on Package Why PoP?Higher speed, lower energy consumptionMemory chips from different vendorsDifferent types of memory chips: speed, capacity, etcSeparate inspection of processor and memory chipsLower junction temperatures (at least compared to stacked die)Source: ElectroIQ
20 PoP – Package on Package PoP stacking assembly options:Source: Panasonic Co
21 TMV PoP – Thru Mold Via Package on Package Source: Amkor Technology, Inc.Dimension control vias reduces the distance between the system memory and the TMV after their assembly.
22 TMV PoP – Thru Mold Via Package on Package Why TMV PoP?Improved warpage control and bottom package thickness.High density stacked (memory) interface.Increased die to package size ratio. TMV can provide over a 30% increase in maximum die size.Improved board level reliability.Improved fine pitch SMT process window.Supports Wirebond, flip chip devices (both area array solder and fine pitch CuPillar), stacked die and passive components integration.TMV could also be applied to FlipStack® (combo FC+WB) and FC w/ TSV stacks.Source: IMAPS.
23 BVA PoP – Bond Via Array Package on Package ™Why BVA PoP?The increase in the number of connections to the logic circuits from 300 to over 1000.Reduction of PoP total thickness (lower than TMV PoP).Source: Invensas CoReducing the pitch (up to 0.2mm) of the processor through wire leads increases the number of possible connections in the POP system.
24 BVA PoP – Bond Via Array Package on Package ™Copper wires, height of 400µm pitch of 240µm.Source: Invensas Co
25 Perspectives for PoP solutions Source: Gartner, IncWhat next?