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Innovative technologies

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Presentation on theme: "Innovative technologies"— Presentation transcript:

1 Innovative technologies
Innovative products Innovative technologies

2 SEMICON Sp. z o.o. History: 1987 – foundation of SEMICON Sp. z o.o.
1992 – first signed distribution agreement: LEM NORMA 1993 – 1996 – next distribution agreement: Kontakt Chemie, Schurter, Multi- Contact 1997 – SMT assembly line launch 1998 – launch of an electronics store in Warsaw (Wolumen) 2003 – implementation of the ISO 9001:2008 quality system 2009 – starting stencils laser cutting service

3 SEMICON Sp. z o.o. Participation in EU Framework Programmes:
– project: GreenRose (FP6) – project: Tele-Ekg (FP6) – project: Radi-Cal (FP7) – project: ChipCheck (FP7) – project: µBGA (FP7)

4 SEMICON Sp. z o.o. Today: Currently, the company employs over 50 people including headquarter, production and shop. Starting from 1st January 2013 we are participating in a new national project - Innovative advanced surface mount technology (SMT) printed circuit boards. Source: STATS ChipPAC Source: Source:

5 Certificates ISO 9001:2008 ISO 14001 AQAP 2110
We only work with companies which have UL certificates SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ;

6 SEMICON Sp. z o.o. - business areas Distribution:
Electronic components Electronic materials Measuring equipment and accesories 6

7 SEMICON Sp. z o.o. - business areas Subcontracting:
PCB assembly (THT, SMT) Laser cut SMT stencils manufacturing Own production of laser modules

8 THT and SMT assembly More than 15 years experience in electronics
Customer support from design to production Engineering consultancy Direct contact to supply chain ESD control IPC-A-610 trained employees Compliance with RoHS PCB Design possibilities Component supply possibilities

9 Production capacity - SMT assembly 4 SMT lines
Źródło: JUKI Co. 4 SMT lines prototypes, small, medium series PCB size: max. 800 x 510 mm Components: x 74 mm, PoP PCB thickness: 0.2 mm - 4.0mm, flex PCB assembly Pitch: ≥ 0.20 mm Selective conformal coating possibilities Glue, solder paste possibilities AOI inspection, functional tests, test probes, BGA – X-ray measurements Hot Bar technologies (flex, LCD)

10 Production capacity - THT assembly Manual soldering
Lead wave soldering PB-free wave soldering in nitrogen 1.2 mln THT components monthly/1 shift

11 Main customers Medical Defence Automotive Energoelectronic Lighting
Telecomm R&D

12 Stencils laser cutting
High-speed cutting machine LPKF Stencil Laser G6060 Frame or frameless stencils Accuracy and repeatability: ±2µ Material: stainless steel, nickel Thickness: up to 600µm (oxygen cutting) Engineering, modifications, e.g. glue stencils Aperture inspection – high resolution scanner Tension inspection Źródło: LPKF Laser & Electronics AG

13 Optoelectronic equipment manufacturing
Laser modules Wavelenghts: nm Power input: 0,2 – 500mW Pointers Line and cross generators Customization Laser displacement sensors: Resolution: up to 10µm Measurement range: up to 200mm Measurement distance: up to 50m System includes: laser module and position detector

14 Laser modules applications
Pointers Cross-hair pointers Alarm systems, laser barriers Sensors Positioning systems Textile industry Wood processing: Wood cutting Stone cutting Metal cutting Tire industry Mining industry

15 Miniaturization in electronics
Passive Components Source:

16 Miniaturization in electronics - ICs
Source: Amkor Technology, Inc

17 SMT challenges 01005 components – paste screenprinting
QFN, DFN components – lifting effect, voids Large and fine pitch BGAs – thermal balance, voids, „head in pillow” effect PoP components – warpage, placing, BGAs errors Large PCB assembly – bow and twist

18 World trends: higher density PoP
3D package development First generation: multi-level structures Second generation: PoPs Next generation: TMV PoPs, BVA PoPs Source: Invensas Co Source: Amkor Technology, Inc. Source: Amkor Technology, Inc. World trends: higher density PoP

19 PoP – Package on Package
Why PoP? Higher speed, lower energy consumption Memory chips from different vendors Different types of memory chips: speed, capacity, etc Separate inspection of processor and memory chips Lower junction temperatures (at least compared to stacked die) Source: ElectroIQ

20 PoP – Package on Package
PoP stacking assembly options: Source: Panasonic Co

21 TMV PoP – Thru Mold Via Package on Package
Source: Amkor Technology, Inc. Dimension control vias reduces the distance between the system memory and the TMV after their assembly.

22 TMV PoP – Thru Mold Via Package on Package
Why TMV PoP? Improved warpage control and bottom package thickness. High density stacked (memory) interface. Increased die to package size ratio. TMV can provide over a 30% increase in maximum die size. Improved board level reliability. Improved fine pitch SMT process window. Supports Wirebond, flip chip devices (both area array solder and fine pitch CuPillar), stacked die and passive components integration.TMV could also be applied to FlipStack® (combo FC+WB) and FC w/ TSV stacks. Source: IMAPS.

23 BVA PoP – Bond Via Array Package on Package
Why BVA PoP? The increase in the number of connections to the logic circuits from 300 to over 1000. Reduction of PoP total thickness (lower than TMV PoP). Source: Invensas Co Reducing the pitch (up to 0.2mm) of the processor through wire leads increases the number of possible connections in the POP system.

24 BVA PoP – Bond Via Array Package on Package
Copper wires, height of 400µm pitch of 240µm. Source: Invensas Co

25 Perspectives for PoP solutions
Source: Gartner, Inc What next?

26 Thank you for attention!
Piotr Ciszewski

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