1. 23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)Daejeon, Korea Presented by Naehyuck Chang Kiyoung Choi 2015 General Co-Chairs On Behalf of VLSI-SoC 2015 Organizing Committee June 9, 2015 VLSI-SoC 2015 Report 23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)Daejeon, Korea

2. ●Program Chairs ○Youngsoo Shin, KAIST, Korea ○Chi-Ying Tsui, HKUST, Hong Kong ●Vice Program Chair ○Jae-Joon Kim, POSTECH, Korea ●Analog and mixed-signal IC design ○Jaeha Kim, Seoul National University, Korea ○Tai-Cheng Lee, National Taiwan University, Taiwan ●CAD: synthesis and analysis ○Minsik Cho, IBM Research, USA ○Masahiro Fujita, University of Tokyo, Japan ●Circuits and systems for signal processing and communications ○Per Larsson-Edefors, Chalmers University, Sweden ○Oscar Gustafsson, Linköping University, Sweden ●Embedded system: architecture, design, and software ○Vijaykrishnan Narayanan, Penn State University, USA ○Jason Xue, City University of Hong Kong, Hong Kong TECHNICAL PROGRAM COMMITTEE 23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)Daejeon, Korea

3. ●Low-power and thermal-aware design ○Massimo Poncino, Politecnico di Torino, Italy ○Tadahiro Kuroda, Keio University, Japan ●Memory: technology, circuit, and system ○Yiran Chen, University of Pittsburg, USA ○Rahul Rao, IBM, India ●Prototyping, verification, modeling, and simulation ○Swarup Bhunia, Case Western Reserve University, USA ○Graziano Pravadelli, University of Verona, Italy ●System architectures: NoC, 3D, multi-core, and reconfigurable ○Yuan Xie, UC Santa Babara, USA ○Nam Sung Kim, University of Wisconsin-Madison, USA ●Design for variability, reliability, and test ○Chris Kim, University of Minnesota, USA ○Jing-Jia Liou, NTHU, Taiwan ●Security of SoC Systems ○Ozgur Sinanoglu, New York University Abu Dhabi, UAE ○Srinivas Katkoori, University of South Florida, USA 23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)Daejeon, Korea TECHNICAL PROGRAM COMMITTEE

4. ●Total submissions Abstracts: 138, Full papers: 118 23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)Daejeon, Korea Submission Stats TrackSubmissions Analog and mixed-signal IC design 17 CAD: synthesis and analysis 5 Circuits and systems for signal processing and communications 17 Design for variability, reliability, and test 11 Embedded system: architecture, design, and software 8 Low-power and thermal-aware design 10 Memory: technology, circuit, and system 11 Prototyping, verification, modeling, and simulation 7 Security of SoC Systems 4 System architectures: NoC, 3D, multi-core, and reconfigurable 20 COI 8 Total 118

5. No. of reviews/paper: 4 Target acceptance rate Regular: 48/118 = 41% Regular + Poster: 66/118 = 56% Session schedule 12 regular session (4 papers per session) + 1 poster session Acceptance notification June 25th 23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)Daejeon, Korea Review Process TrackRegularPoster Analog 72 CAD 21 Circuits & Systems 73 Variability 41 Embedded 31 Low-power 31 Memory 51 Prototyping 21 Security 11 System Architecture 84 COI 62 Total 4818

6. PhD Forum abstracts included in the proceedings? Copyright issue should be resolved between IFIP and IEEE 23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)Daejeon, Korea Issues

7. Look forward to seeing you in Daejeon, Korea! Thank you!