1. Status n-XYTER and CBM-XYTER Christian J. Schmidt et al., GSI Darmstadt GSI, Darmstadt, Feb. 29 th 2008

2. 11th CBM Collaboration Meeting, GSI, Feb. 29th 2008 n-XYTER / CBM-XYTER Front-End:  128 channel charge sensitive front-end for MIPs in Silicon, both polarities  Purely data driven, autonomous hit detection (self triggered)  Peak detection, analogue storage and readout  Average per channel hit rate 160kHz with 10% dead time (determined by pile-up on slow channel) Readout:  Per channel analogue energy and digital time stamp FIFO  De-randomizing, sparcifying Token Ring readout at 32 MHz Architecture: Neutron – X, Y, Time and Energy... R

3. 11th CBM Collaboration Meeting, GSI, Feb. 29th 2008 Short to Mid Term: n-XYTER  Detector Prototyping Current n-XYTER, developed for thermal neutron detection (EU-FP6 NMI3 DETNI) It will serve us to realize various detector prototyping projects within CBM but also FAIR CBM STS module prototyping CBM MUCH readout (in particular high density gas detector readout) CBM MAPMT-RICH but also other projects as e.g. PANDA GEM TPC or Silicon MVD

4. 11th CBM Collaboration Meeting, GSI, Feb. 29th 2008 Midterm and Beyond: the Dedicated CBM-XYTER Exploit detector prototyping experiences Self triggered architecture Rates adapted Radiation hard On chip ADC Efficient, low lead-count serialized data transfer DC-coupled double sided Silicon readout

5. 11th CBM Collaboration Meeting, GSI, Feb. 29th 2008 CBM-XYTER Development Collaborators AGH Krakow (Robert Szczygiel, Pavel Grybos) IZT Heidelberg (Peter Fischer et al) GSI Darmstadt (Christian J. Schmidt) coordination MEPHI Moscow (Eduard Atkin et al) principle tripod collaboration

6. 11th CBM Collaboration Meeting, GSI, Feb. 29th 2008 Status of Testing, Chip Availability n-XYTER has been investigated and tested at Uni-Heidelberg, Uni-Münster, VECC (Kolcatta, India), INP & AGH Krakow, GSI-Detectorlab No functional flaws seen cross coupling (in-channel and inter -channel) may increase effective noise figure in current chips, reason to be identified Temperature coefficient makes current chips less convenient to operate Complicated Mixed Signal Chip First 250 chips will rapidly be used up after testing and evaluation An engineering run will need to supply the bag of chips

7. 11th CBM Collaboration Meeting, GSI, Feb. 29th 2008 The n-XYTER Starter Kit... Chip testing at PI Heidelberg and at GSI detectorlab Steps towards a CBM readout chain: SysCore (Norbert Abel, Udo Kebschull, Andreas Kugel, Dirk Gottschalk)

8. 11th CBM Collaboration Meeting, GSI, Feb. 29th 2008 Analogue Signal Sequence (Test Channel) Testpulse Release Slow Shaper Fast Shaper Discriminator Output

9. 11th CBM Collaboration Meeting, GSI, Feb. 29th 2008 Analogue and Digital Signal Out at 32MHz operation at 250 MHz Clk speed clk32MHz clk128MHz DataValid Delay 4ns

10. 11th CBM Collaboration Meeting, GSI, Feb. 29th 2008 First n-XYTER connected to Silicon Strips in Krakow CBM Collaboration Meeting 26.02.2008 Krzysztof Kasiński (AGH Cracow) cincian@o2.pl ASICs and Detector, Sucima Readout (Adam Czermak, Robert Szczygiel, Krzysztof Kasinski and others)

11. 11th CBM Collaboration Meeting, GSI, Feb. 29th 2008

12. 11th CBM Collaboration Meeting, GSI, Feb. 29th 2008 The plan to get more chips for detector prototyping Re-submission of MPW masks with modified process options (non opto) will quickly: clarify current process related uncertainties yield enough chips for prototyping and beam tests this year An engineering run prepared for submission in September 2008 will provide abundant chips for prototyping even of larger detector systems

13. 11th CBM Collaboration Meeting, GSI, Feb. 29th 2008

14. 11th CBM Collaboration Meeting, GSI, Feb. 29th 2008 FEB-Developments (n-XYTER based) FEB starter kit (Rafal Lalik) one-chip board for evaluative needs. 4chip FEB for gas detector readout 4chip FEB for Silicon detector readout, double sided Flexcable as an alternative to PCBs: Studbonding of chips to micro cables

15. 11th CBM Collaboration Meeting, GSI, Feb. 29th 2008 Current CBM-XYTER development issues ADC or Time over Threshold (TOT) architecture for signal conversion? What is an adequate scheme to daisy-chain various chips for a bandwidth charing data transfer over one link? Even though everybody celebrates the novel funding sucesses of FAIR, the money still has a long way to go until it may be accessible for our partners in Krakow and Moscow! Realize radiation hardness tests on the TRAP chip to quantify hardness for UMC 0.180 Fundamental architectural bifurcation: TOT promises far less architectural overhead and thus substantial power saving. Yet the ADC appears crucial if resolution beyond even 5 bit is targeted. Higher resolution TOT tends to result in non equal bin-width We will need to evaluate these options from the detector side.

16. 11th CBM Collaboration Meeting, GSI, Feb. 29th 2008 Serious Externally Determined Issues Financing promises need to be put in action National funding agencies must get moving to channel money to the working groups Institutes need to express commitment For the CBM-XYTER development be given priority by contributors, We are going... but yet with handbrakes on....

17. 11th CBM Collaboration Meeting, GSI, Feb. 29th 2008