1. Research Interest Reliability of “green” electronic systems Nano-based Pb-Free Technology Processing, characterization, and defects ID of Pb-Free electronic materials and components Metal and alloy based electroplating processes Sn whisker phenomenon Numerical analysis and simulation of residual stresses in thin films Residual stress analysis using X-Ray Diffraction Technologies Polymer and metal based composite materials Aerosol Jet Printing Techology Dr. Aleksandra Fortier Assistant Professor Email: Aleksandra.Fortier@unt.eduAleksandra.Fortier@unt.edu

2. Development of Novel Technique for Mitigation of Sn Whiskers Growth in Electronics Sn Film Brass-substrate Microstructure of Electronic Component coated with Pure Sn Film 5µm Growth of Sn Whisker over time on the surface of Sn film 10µm Sn Ni Brass substrate Microstructure of Electronic Component coated with Composite Ni/Sn Film 20µm Whisker free Electronic Component with composite film

3. Inside Set-up 3mm Residual Stress Measurements in Thin Films Using XRD Technology

4. Physical Set-up of the XRD Position of Angles Direction of Stress Measurement Bragg’s Law Strain Calculation Principles of Residual Stress Analysis with XRD

5. Advantages of Novel Technique for Mitigation of Sn Whiskers Growth Non-uniform compressive residual stress distribution in Electronic Component coated with Pure Sn Film (captured with XRD) Distribution of uniform tensile stress in Electronic Component coated with composite film (captured with XRD) Advantages of Composite Plating Uniform stress distribution in the film over time Whisker -free Components Uniform microstructure Minimize likelihood of electronic systems failure

6. t=0.00012” Model 2 Model 1 Model 3 Simulation Analysis of Residual Stress Development in Thin Films

7. Stress Distribution in Thin Film Cross section of Model Residual Stress Results in Thin Films using ANSYS Software Tool Stress Distribution in Composite Thin Film Cross section of Model

8. Development of Functional Components using Aerosol Jet Printing Technology Equipment  Components developed from nano to micro scale in size  Thin Layer Deposits from 100 nm  Variety of materials and substrates can be used  Material viscosities from 1- 1,000 cP  Nanomaterial Deposition Capability  Non-planar Capability  Flexibility for researchers to define specific application  Low Temperature Processing  Wide range of applications 3D Electronics Alternative Energy Biomedical Applications Displays Sensors Metal Components Components Repair Medical Implants Hybrid Manufacturing

9. Benefits From Research Results Reduced Materials and Manufacturing Costs Reduced Process Time Improved product performance Improved manufacturing process Amount Controlled Deposition No need for post processing Economical & Environmentally clean process Data –driven Printing pattern created in CAD Flexible shapes Data –driven Printing pattern created in CAD Flexible shapes