1. FAZIA DAYS, Bologna 10-12/feb/2010, WG8, Emanuele Vanzanella (mechanics & cooling), Alfonso Boiano (electronics) ELECTRONICS HOLDER & COOLING SYSTEM Side cooling and support plate (4 mm thick Cu) Cooling circuit (D=8, d=6, Cu) Electronic card Al shelf (2 mm thick) 1 st step: Design of the mechanical prototype

2. FAZIA DAYS, Bologna 10-12/feb/2010, WG8, Emanuele Vanzanella (mechanics & cooling), Alfonso Boiano (electronics) ELECTRONICS HOLDER & COOLING SYSTEM The heat due to each FEE card (according to P.Edelbruck) is simulated by a dummy card, with suitable resistors mounted in the right places. 2 nd step: design of the electronic card

3. FAZIA DAYS, Bologna 10-12/feb/2010, WG8, Emanuele Vanzanella (mechanics & cooling), Alfonso Boiano (electronics) ELECTRONICS HOLDER & COOLING SYSTEM prototype (Naples machine shop) 3 rd step: machining and assembling solid model design

4. FAZIA DAYS, Bologna 10-12/feb/2010, WG8, Emanuele Vanzanella (mechanics & cooling), Alfonso Boiano (electronics) ELECTRONICS HOLDER & COOLING SYSTEM 4 th step: experimental setup (in air) flowmeter Cooling water termometers Power supply Incoming cold water Outgoing hot water

5. FAZIA DAYS, Bologna 10-12/feb/2010, WG8, Emanuele Vanzanella (mechanics & cooling), Alfonso Boiano (electronics) ELECTRONICS HOLDER & COOLING SYSTEM Hottest point (bottom side) <55°C Al shelf temperature from 45°C to 50°C 5 th step: temperature measurements (IR camera) Resistor temperatures <70°C Average temperature (top side): <60°C

6. FAZIA DAYS, Bologna 10-12/feb/2010, WG8, Emanuele Vanzanella (mechanics & cooling), Alfonso Boiano (electronics) ELECTRONICS HOLDER & COOLING SYSTEM 5 th step: (ctd) Cu plate hottest point (external side): 40°C Cu temperature ranges from 35°C to 28°C. The temperature of the cooling water tube is around 30°C

7. FAZIA DAYS, Bologna 10-12/feb/2010, WG8, Emanuele Vanzanella (mechanics & cooling), Alfonso Boiano (electronics) ELECTRONICS HOLDER & COOLING SYSTEM Electronic card temperature (top side) 60 °C Electronic card temperature (bottom side) 55 °C Al shelf temperature 50 °C Cu plate temperature 40 °C Cooling tube temperature 30 °C Incoming water temperature 16 °C Outgoing water temperature 20 °C Cooling water flow 0,5 l/m Summary of the test T=5 °C T=10 °C T= 4 °C 6 th step: result analisys T=20 °C in good agreement with the design values for vacuum operation

8. FAZIA DAYS, Bologna 10-12/feb/2010, WG8, Emanuele Vanzanella (mechanics & cooling), Alfonso Boiano (electronics) ELECTRONICS HOLDER & COOLING SYSTEM new prototype (under construction) same holes as before. 6 mm thick Cu plate. grooves, closed by welded straps, for water flow. 10 vertical pipes The water flow inside the Cu plate is meant to increase the heat exchange between Cu and water.

9. FAZIA DAYS, Bologna 10-12/feb/2010, WG8, Emanuele Vanzanella (mechanics & cooling), Alfonso Boiano (electronic cards) ELECTRONICS HOLDER & COOLING SYSTEM Electronic card temperature (top side) 60°C Electronic card temperature (bottom side) 55°C Shelf temperature 50°C Side copper plate temperature 40°C Cooling tube temperature 30°C Incoming water temperature 16°C Output water temperature 20°C Cooling water flow 0,5 liters/min. The goal is to reduce the temperature gradient between the Cu plate and the cooling water by circulating the water inside the plate. Further the inlet water temperature will be lowered (around 4 °C). T=5 °C T=10 °C T=10 °C … or more T=15 °C … or less