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3D MEMS Accelerometers for Building Applications

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Presentation on theme: "3D MEMS Accelerometers for Building Applications"— Presentation transcript:

1 3D MEMS Accelerometers for Building Applications
Mikaël Colin – MEMScAP S.A. 1st MEMSCON Event – Bucharest October 7th, 2010 1st MEMSCON Event 07/10/10, Bucharest Company

2 1st MEMSCON Event - 07 October 10, Bucharest
Acceleration RF ID tag Accelerometer end-user specifications Parameter Value Unit Acceleration 0.01-2 g Frequency 0.1-10 Hz Duration 15 s Size constraint - mm3 Operating temperature -20 to +50 °C Operating Humidity 0 to 100 %RH Vibrations (15g) 1000 Shocks 2000 Battery lifetime 2 years 3D MEMS accelerometer MEMS = Micro ElectroMechanical System 1st MEMSCON Event - 07 October 10, Bucharest MEMScAP, France

3 Accelerometers transduction mechanisms
Vibration Beam Accelerometer (VBA) Resonance frequency is dependent on the applied force Driven oscillator at resonance frequency (closed loop) High end applications Spring Mass System Acceleration force causes a proof mass displacement Displacement measurement system Direct or indirect measurement Indirect measurement methods: Piezoelectric effect Piezoresistive effect Capacitive sensing 1st MEMSCON Event 07/10/10, Bucharest Company

4 Transduction principles
Piezoelectric effect Piezoresistive effect Capacitive sensing 1st MEMSCON Event - 07 October 10, Bucharest MEMScAP, France

5 1st MEMSCON Event - 07 October 10, Bucharest
MEMS Technologies Bulk micromachining Surface micromachining Hybrid integration 1st MEMSCON Event - 07 October 10, Bucharest MEMScAP, France

6 Concept of 3D accelerometer
Mounting of 3 1D accelerometers 3-axis sensitive mechanical structure 3 independent structures on the same die 1st MEMSCON Event - 07 October 10, Bucharest MEMScAP, France

7 1st MEMSCON Event - 07 October 10, Bucharest
Selected concept 3 independent capacitive micromachined sensors on a single die ~ 4mm ~ 11mm Out of the wafer plane sensitivity In plane sensitivity 1st MEMSCON Event - 07 October 10, Bucharest MEMScAP, France

8 1st MEMSCON Event - 07 October 10, Bucharest
Fabrication Wafer level packaging concept 1st MEMSCON Event - 07 October 10, Bucharest MEMScAP, France

9 1st MEMSCON Event - 07 October 10, Bucharest
ASIC+MEMS Assembly Hybrid integration in a ceramic carrier MEMS ASIC Read-out 1st MEMSCON Event - 07 October 10, Bucharest MEMScAP, France

10 1st MEMSCON Event - 07 October 10, Bucharest
Thank you for your attention 1st MEMSCON Event - 07 October 10, Bucharest MEMScAP, France

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