1. MIO-2261 Sales kit MI/O-Ultra (Pico-ITX SBC) Intel ATOM N2600/N2800
Embedded Stackable Board Computer
PM Victor.Huang
May, 30, 2012

2. MIO-2261 Compelling Features
Intel® Atom N2600/N2800 Pico-ITX SBC with 18/24-bit LVDS/ VGA/ LAN/Half-size Mini-PCIe/ 2COM/ 1 mSATA/ 4 USB2.0/MIOe
Intel N2600/N2800+ NM10, DDR SO-DIMM
N G / N G DC
Dual Core Processor with All Fan-less Design
Smallest SBC w/ 100x72mm size (same as 2.5” HDD)
with MIOe extension flexibility
Low Power Consumption (Kit TDP: 5~8W)
DirectX 9, MPEG2 (H/W acceleration)
H.264/ VC1/ WMV9 (H/W Decode/Acceleration)
12V DC Power input ,Support DC power hot plug
15KV Air ESD protection COM port design
TVS design for power ESD/EFT protection
1GbE-Intel LAN/ HD Audio
2 COM/ 4 USB2.0/ 1 mSATA/ 8-bit GPIO/ SMBus/I2C/
MIOe Extension / Half-size Mini PCIe
Power connector
Support SUSI Access
Supports Embedded Software API and Utility
WinCE7.0, XP, XPE, Win7,WES7,QNX,Vxwork Support
Lockable
DC Jack
2018/Q4 Longevity

3. MIO-2261 spec

4. MIO-2261 Block Diagram

5. Board Layout-Top VGA Power button /HDD LED /Power LED HD Audio
(Line-in, Line-out)
18/24-bit LVDS
2x RS-232
DDR3 SO-DIMM Socket

6. Board Layout-Bottom MIOe VGA 2xUSB2.0 1 GbE LAN 12V DC input SATA
LCD Power Selection
/Auto Power On
MIOe
(SMbus, 2 x USB2.0, 2 x PCIe, line-out, LPC, 5Vsb/12Vsb)
mSATA
Inverter
2xUSB2.0
GPIO
Half-size Mini PCIe
SMBus

7. MIO-2261 MIOe supported interface
Considering most demands from customer and future chipset trends (~2013Y new platforms)
Interface
Number
MIO-2261 Supports
Functions can be
Display port 1
Yes
HDMI, LVDS, DVI, CRT or eDP display interface…
GP PCIE 4
(2 x PCIex1)
Gigabit Ethernet, USB 3.0, SATA/RAID, FPGA or PCI expansion…
USB 3.0
USB 2.0 2
N/A
Super speed storage, capture card, HD Webcam & display interface…
LPC
Legacy bus & Multi-UART, PS2 KB/MS, GPIO, FDD, IR, Parallel port from LPC I/O…
HD Audio
(Line-Out)
Line out, keep flexibility with selected amplifier…
SMBus
Implementation for GPIO control, Smart battery/ Charger, W/R EEPROM or System communication…
Power Control 3
Reserved
VCC
+12VSB
2A for MIOe module
+5VSB
3A for CPU board and MIOe module totally
GND

8. Order Information
Packing List
Embedded OS/API

9. Coast Line (Rear IO) Model Rear I/O Photo
MIO-2261N-S6A1E MIO-2261N-S8A1E
LAN + 2USB + VGA
MIO-2261
(by request)
LAN+ 2USB + VGA + DC Power Jack

10. Thermal Solution Standard Thermal Solution Optional Thermal Solution
Model
MIO-2261N-S6A1E / MIO-2261N-S8A1E
Photo
Description
CPU Heatsink Dimension: 99.5(L)* 70.5(W)*15.7(H)mm
Total height including CPU board + heatsink is 33.48(H)mm
Standard Thermal Solution
Optional Thermal Solution
Heat Spreader Dimension: 99.5(L)* 70.5(W)*11.2(H)mm
Total height including CPU board + heat spreader is 29(H)mm

11. MIO-2261 Advanced Technology
Intel Atom Cedar Trail Ultra Low Power Solution
Ultra Low Power Consumption, all comes with Dual Core processors:
N G Dual Core: TDP of Intel bundle kit is 5 Watts
N G Dual Core: TDP of Intel bundle kit is 8 Watts
Fan-less Design:
All Fan-less low profile heatsink design
Multiple Display Support & H/W Decode
Dual independent display : VGA + 18/24-bit LVDS
Support additional 48-bit LVDS, HDMI , or DisplayPort through MIOe eDP
Graphic Engine and H/W Decode:
DirectX 9 and OpenGL3.0 support
Hardware decode H/W acceleration: MPEG2
H/W Decode/Acceleration: H.264/ VC1/ WMV9
DC Power Hot Plug Protection Design
Good to protect board in case direct power in and damage the board and system.
COM Port 15KV ESD Protection Design
TVS (Transient Voltage Suppressor)design for power ESD/EFT protection

12. Design for Ruggedize Solution --- Advantech MIO-2261
MIO-2261 is designed with 100% Solid Capacitors (固態電容)
Higher tolerance for high frequencies & high temperature
With better MTBF compared with Electrolytic Capacitors
No more exploding capacitors
More reliable solution if using Solid capacitors than Electrolytic capacitors
High ESD Protection for RS-232 I/O Pins to ±15kV
IEC Air Gap Discharge: ±15kV
IEC Contact Discharge : ±8kV
Human Body Model: ±15 kV
Rugged Design on Selected Components
Wide temperature design and test criteria: Power/ Clock generator/ Sequence
PCB Type: TG-150 as PCB type, much reliable in high temperature environments.

13. Reliable Power Design The power tolerance range is 12V +/-10%
MIO-2261 is designed with Power Hot Plug protection IC design
To avoid pulse current to damage the board when DC power hotplug directly
MIO-2261
DC Power adapter

14. Performance benchmark (CPU Arithmetic Benchmark-ALU, FPU)
+ 16%
+ 104%
+ 96%
33.8% 96.2% 104.0%
MIO-2261
(N GHz)
MIO-2261
(N GHz)
PCM-3362
(N G)
Sliverthrone XL
(Z G)
Intel Tunnel
(E G)

15. Performance benchmark (Processor MultiMedia - Integer, Float Point)
+ 17%
+ 102%
+ 94%
MIO-2261
(N GHz)
MIO-2261
(N GHz)
PCM-3362
(N G)
Sliverthrone XL
(Z G)
Intel Tunnel
(E G)

16. Power consumption 10.32 Watts 9.6 Watts 9.12 Watts 7.68 Watts
MIO-2260
(N GHz)
MIO-2261
(N GHz)
MIO-2261
(N GHz)

17. Graphic Performance- 3DMark 2006
N455 to N2800
244% increase
N455 to N2600
130% increase
MIO-2261
(N GHz)
MIO-2261
(N GHz)
MIO-2260
(N GHz)

18. Pico-ITX Competitor Comparison

19. MIO-Ultra Target Applications
Home Automation
HMI (Human Machine Interface)
Ultra Low Power Demand
Portable Device
POS/ KIOSK
Measurement Instrument
Machine Automation
Medical

20. New Form factor MI/O-Ultra Introduction

21. Why a New Form Factor – MI/O Extension
- Takes New Position between SBC and COM
Resource: Need redesign PCB to fulfill the SPEC requirement
Options: Go ODM or SOM projects for customized demand, need higher quantity & NRE.
The SPEC on standard SBC can’t be fulfilled if need additional I/O change
Less cabling: less problems and cost on assembling.
Concentrated thermal design: make thermal design be easier in customer’s system integration.
The customer needs a board easier for system integration
The customer hopes to keep domain knowhow through easier way
Documentation: customer can keep domain knowhow to design their own I/O module by referring to Advantech design guide & SPEC.
Time to Market
Time to Profit
Save development schedule and cost: Choose one platform based on MI/O Extension structure, just change I/O module can approach different applications in a short time.

22. Positioning on Different Solutions
MI/O Extension
Single Board Computer
Computer On Module
Readiness
100%
(I/O module only by demand)
60~80%
(Need bundle carrier board )
Flexibility
Middle
Low
High
RD Resource
Low ~ Middle
(design I/O module if needed)
(design carrier board)
Pricing
Develop Schedule
Short ~ Middle
Short
Long
Dimension
146*102mm
100*72mm
Q7, ETX, COM-Express,
COM-Ultra...
Keep domain knowhow
Yes
(design I/O module) No
Target customer
Only lack few I/O interfaces
Sensitive on pricing
Tight development schedule
With RD ability who can design I/O module.
Need single board solution
Need wide-range choices
Time to Market
Complicated SPEC demand
With exists COM carrier board
With senior RD ability who can design power sequence and I/O functions.

23. MI/O Extension Features

24. Product Line Positioning

25. MI/O-Ultra Market Position
Smallest Size SBC with Maximum Flexibility
Ultra Small Size (100x72mm)
Flexibility from M/O Extension
Competitive price with simple I/O
Ultra Low Power (<8W)
Easy for System Integration
20% size reduction of PC/104
Portable Device
Small HMI/PPC
Embedded Instrument
In- vehicle
Home Automation

26. MI/O Extension-Ultra (Pico-ITX)
Heat Spreader
Right angle connector
Unified rear IO
MIOe extension
RAM Module
Heat-generated parts
Install Heat Spreader
conduct heat to chassis cover for better thermal solution
Install MIOe module
Flexibility and unified multiple interfaces
Easy system integration
Ultra small from factor w/ 100x72mm size
Heat-generated parts on TOP
Rear IO and connector on BOT
Unified rear IO with less cabling
Optional heat spreader
Flexibility from MIOe extension
Secure core knowledge on MIOe modules
MIOe extension design guide for reference
Unified multiple interfaces
Less design effort ,
Heat-generated parts on TOP
Easy to make thermal solution
Right angle connector
Easy system integration and cabling
Biz
RMA rate

27. Comparison with other SBCs

28. Flexibility Possibilities
MI/O Extension SBC+ MIOe Expansion Module = Vertical Applications
MIOe Module A
MI/O A
MIOe Module B
MI/O B
MIOe Module C
Your own MIOe design !

29. Unified MIOe for MIO Extension SBC
Interfaces are considered including most demands from customer and future chipset trends
Interface
Number
Functions can be
DisplayPort 1
HDMI, LVDS, DVI, CRT or eDP display interface…
PCIe x 1 4
Gigabit Ethernet, USB 3.0, SATA/RAID, FPGA or PCI expansion…
USB 3.0
USB 2.0
Super speed storage, capture card, HD Webcam & display interface…
LPC
Legacy bus & Multi-UART, PS2 KB/MS, GPIO, FDD, IR, Parallel port from LPC I/O…
HD Audio (Line-Out)
Line out, keep flexibility with selected amplifier…
SMBus
Implementation for GPIO control, Smart battery/ Charger, W/R EEPROM or System communication…
VCC (Power)
+12VSB
+5VSB
GND or

30. Compact Chassis Design
MIO Positioning
Easy
System Integration
Minimum Design Effort
Secure Core
Knowledge
Compact Chassis Design
Flexibility/
Vertical Market
Cost Effective
MIO

31. SUSIAccess Smart Access To Embedded Devices31

32. 1 2 3 Integrated Device Monitoring, Configuration & System Recovery
Remote
Configuration 3
SUSIAccess is a embedded cloud service, it is a embedded software as a service (SaaS) solution
It integrates Device Monitoring, Configuration & System Recovery, three major functions.
It enable our board customers the smart access to embedded devices.
System
Recovery

33. Core Features Centralized Device Monitoring
Collects all embedded device data
Displays data in a customized dashboard
Auto notifies errors via warning popups and alerts
Integrated Remote Configuration
Remotely adjust embedded device settings
Transfer files to a remote device for firmware or application updates
Remote diagnostics via screen captures, hardware log analysis, and windows XP event log files
One-Click System Recovery
Back-up complete system and files any time
Restore a system
Smart back-up saves images to offsite FTP
There are three core features of SUSIAccess, 1st: Centralized Device Monitoring, it can Collects all embedded device data and displays data in a customized dashboard, Auto notifies errors via warning popups and alerts
2nd. Integrated Remote Configuration, Remotely adjust embedded device settings and transfer files to a remote device for firmware or application updates . Or Remote diagnostics via screen captures, hardware log analysis, and windows XP event log files. 3rd. One-Click System Recovery, to Back-up complete system and files and restore a system at any time. The Smart back-up saves images to offsite FTP

34. Centralized Device Monitoring
On CPU/SYS Temp, Fan Speed, Voltage & Modules
Collects all embedded device data On CPU/SYS Temp, Fan Speed, Voltage & Modules life and wireless signaels

35. Integrated Remote Configuration
For Power On/Off, Display, Volume & File Transfer
Remotely adjust settings of embedded device for Power On/Off, Display, Volume & File Transfer

36. Advantech Peripheral Modules Solution36

37. Peripheral Highlights
PATA/SATA/USB
Full Range
Wide Temp.
30u Plating
Fix Die
Thermal Sensor
7 years Longevity
High Brightness
Various Interface
SQFlash
SQRAM
Wireless
Touch/Display

38. SQFlash – Smart & Quality Flash Module
Leading Technology
Fragment Writing – better endurance, performance
GuaranteedFlush – robust mDDR cache
Power Failure Protection
OS Mutual – High random access
Full Range Interface/Form Factor
PATA, SATA, CF, CFast, USB, mPCIe, SD
Wide Temp. modules for both SLC & MLC
Flexible firmware and software customization
Security features

39. SQRAM – Smart & Quality Memory Module
Rugged Specification
Fixed Die with Samsung memory chip
Extra-thick 30u" gold-plated contact pins
Stable operation in extreme temp. (-40° to 85ºC)
Industrial grade capacitors ensure voltage stability
Thermal Sensor & software package
Sorting Mechanism
10G vibration
Low temp. (-40 ℃) & high temp. (+85 ℃) burning
Thermal shock stress test
VDD, Frequency Margin test
Power Cycling, application test

40. Embedded Wireless Module
Industrial WiFi Module
7 years longevity
Stable operation in extreme temp. ( -40° to 85ºC)
Cisco CCX 4.0 certified
Seamless roaming between respective APs
Support Intel Active Management Technology 7.0
Industrial leading power consumption
Multiple OS support
Full Range Solution/ Interface/ Form Factor
Frequency band: 2.4GHz and 5/2.4GHz
Data Rates: n 1T1R, 2T2R and 3T3R
Form Factor: Full-size and Half-size mini PCIe, mini PCI and USB
Signal Protocol: PCIe, PCI and USB
Solution type: WiFi module and WiFi + Bluetooth module

41. Industrial Display add-in Touch Solution
Rugged Display Solution
Full range of size support from 5.7” to 42”
Wide operation temp from -20~ 70 degree C
IP54 rating for water and dust proof (ITM series)
Backlight MTBF support of 50K hours
Touch enhancement
5 years longevity
Widely Input flexibility
Various interface for each application

42. Thank You Contact product manager for any further information Victor
Thank You Contact product manager for any further information 42