1. Copyright PDES, Inc. R 2000.07.19 ISO/IEC 10303-210 Capabilities for Power Electronics Roanoke, Virginia July 19, 2000 Thomas R. Thurman Rockwell Collins Inc Other Contributors: Gregory L. Smith: The Boeing Company Michael T. Keenan: The Boeing Company John G. DeLoof: ATI Corp. Frederick A. Tolmie: Rockwell Collins Inc.

2. Copyright PDES, Inc. R 2000.07.19 Agenda –Contributors / Development Summary –Domain & Scope –Technology Capability –Requirements Capability –Simulation Model –Part Model –Product Structure –Physical model –Physical Design Control –Geometry –Configuration Management –External Definition –AP 210 Implementation Projects

3. Copyright PDES, Inc. R 2000.07.19 AP 210 Project Contributors n PDES, Inc. n Naval Supply Systems Command RAMP Program Office n NASA Goddard Space Flight Center n Rockwell Collins Inc. n Army Tobyhanna Depot n Boeing Defense & Space Group n Delphi-Delco Electronics Systems n NIST

4. Copyright PDES, Inc. R 2000.07.19 AP210 Development Summary n ISO/IEC 10303-210 is currently in IS Preparation n ISO 10303-310 Abstract Test Suite in Preparation n Next Milestones – Register IS Document – Deliver 310 Document to Secretariat

5. Copyright PDES, Inc. R 2000.07.19 AP210 Domain n Domain is Configuration Controlled Design of Electronic Assemblies, their Interconnection and Packaging Product Enclosure Package Die Packaged Part Printed Circuit Assemblies Interconnect Substrate Die

6. Copyright PDES, Inc. R 2000.07.19 AP210 Scope n Scope is the “As-Required” & “As-Designed” Product Information –Design “In Process” –Design “Release” n Sharing Partners: –Design / Analysis –Manufacturing / Analysis –Customer n Sharing Across Several Levels of Supply Base

7. Copyright PDES, Inc. R 2000.07.19 Device Supplier Configuration Managed Corporate Data Process System Engineer Simulation Model Supplier Assembly & Fabrication Vendor Customer Package Data Supplier Requirements AP210 Usage Supply Chain Design Team MCAD ECAD

8. AP210: Electronic Assembly, Interconnect and Packaging Design Technology Physical Component Placement Bare Board Design Layout templates Layers non-planar, conductive & non-conductive Material product Geometrically Bounded 2-D Wireframe with Topology Surfaces Advanced BREP Solids Constructive Solid Geometry Part Functionality Analysis Support Shape 2D, 3D Package Material Product Properties Configuration Mgmt Identification Authority Effectivity Control Requirement Traceability Analytical Model Document References Product Structure/ Connectivity Functional Packaged Fabrication Design Rules Product Design Rules Requirements Design Allocation Constraints Interface Rules Geometric Dimensioning and Tolerancing Geometry Design Control R

9. Copyright PDES, Inc. R 2000.07.19 Technology Capability n Generic Assembly and Interconnect Data Model – Through hole, SMT, fine-line, MCM’s, molded parts, single chip package, etc. n Design for Manufacture: Technology Capability and Constraints – Example: Explicitly State Relationship Between Land Shape Requirements and Interconnect Fabrication Technology Data. » Material Identification & Composition (e.g., IPC -xxxx) » Interconnect Fabricator Process Capability » Package Terminal Characteristics » Substrate to Terminal Joint Characterization (I.e., solder joint models) n Product Design Rule Constraints Technology Fabrication Design Rules Product Design Rules

10. Copyright PDES, Inc. R 2000.07.19 Requirements Capability Requirements Design Allocation Constraints Interface Rules n Supports System Engineering Methodology Throughout Standard, ie., allocation. n Requirements can be Extracted from Specifications and may be Assigned to Almost any Design Aspect for purposes of design reuse, constraints, or interface control. n May be Geometric Based: Nesting Shape Limits n Some Design aspects Serve as Explicit Requirements for Other Design Aspects (e.g., Connectivity for Layout) n Implements organization standard design rules for assembly and layout.

11. Copyright PDES, Inc. R 2000.07.19 Simulation Model n Simulation Model is a Product Model n Simulation Model includes Interface Declaration n Simulation Model includes Source Code whose Syntax is Defined by External Simulation Language (I.e., VHDL, Spice, VHDL-AMS, Mast, Verilog,...) n Simulation Model Port Type Classification defines the Engineering Domain that the Network Listing models Represent »Electrical--Causal, non-causal, lumped, distributed »Thermal, Displacement

12. Copyright PDES, Inc. R 2000.07.19 Part Model Capability n Information structures –Rich Pin-Mapping Capability – Tightly Coupled Simulation Models and Product Definition Data – Defined Parameter Types – Defined Port Names and Types – Simulation Models Instantiated by Explicit Assignment of Product Definition Data to Parameters and Ports n Provides Verifiable Correlation Between the 2D Land Pattern and the 3D Geometric Representation of the Component Part Functionality Termination Shape 2D, 3D Single Level Decomposition Material Product Characteristics

13. Copyright PDES, Inc. R 2000.07.19 Part Model Capability (cont-d) Part Functionality Termination Shape 2D, 3D Single Level Decomposition Material Product Characteristics n Extend Industry Standard Package Definition from Drawings to Direct Digital Application, E.G., JEDEC MO-156, Issue A n Implements Programmable “Make From” Parts n “White Box” Model for Detailed Analysis n Multi-level Multi-Discipline Part Shape Representation – Environment – Purpose – Material Condition

14. Copyright PDES, Inc. R 2000.07.19 Product Structure and Connectivity n Hierarchical Models include: Functional, Physical, Requirements, Rules, Assembly, PCB, Parts, and Materials n Functional Model: Folded Hierarchical Network, Flattened Network, Flattened Network With Routing Constraints n Network Description Capability: –Generic, or Multi-discipline Product Structure/ Connectivity Functional Packaged n Interconnect (e.g., PCB) is a Separately Defined product n Multiple Assemblies for Same Interconnect n Multiple Interconnects in the Same Assembly

15. Copyright PDES, Inc. R 2000.07.19 Product Structure and Connectivity n Signal Based Characterization of Functional Unit: –Signal Data Type Definition – Allowed Signal Categories (e.g., ATLAS) – Uses External Definition Capability n Schematics: Schematics Module in AP 212 n Schematics Symbol: Schematics Symbol Module in AP 212 n Pin Mapping: Included in AP 210 Product Structure/ Functional Packaged

16. Copyright PDES, Inc. R 2000.07.19 Physical Model Capability n Assembly Component Placement n Topologically Explicit Model of the Layout “Metal” n Functional Conductivity Characterization of Layout “Metal” in Electrical, Optical, Thermal Domains. Physical Component Placement Bare Board Design Layout Templates Layers non-planar, conductive & non-conductive Material product n Lumped, Distributed, Thermal Terminals n Geometric Context for Supporting Mapping Between Circuit, S Parameter, Full-3D Electrical Models n Material Description, Composition, and Assembly

17. Copyright PDES, Inc. R 2000.07.19 Physical Model Capability (cont-d) n “Define Once, Reuse Many Times” n Design Intent Preserved for Complex Layouts (Multiple Conflicting Planes and Signal Lines) n Easy to Extract Bare Board Test Data Physical Component Placement Bare Board Design Layout Templates Layers non-planar, conductive & non-conductive Material product n Explicit Stratum Material and Complex Stackup Model n Material Definitions Include Composition and Assembly Note: Use AP 209 for Woven Material Definition n Classify Holes, Line Widths for Tolerances

18. Copyright PDES, Inc. R 2000.07.19 Physical Design Control n Industrial Benefit –Groundwork for Significantly Improving Cycle Time –Basis for Rule-Based GD&T engines in CAD/CAM n Methodolody –Application-to-application exchange (e.g., between CAD/ CAM and Coordinate Measurement Machines.) Without Human Interpretation –Explicitly Based on the ASME Y14.5M and ISO 1101 Standards for Drawing Based Exchange of GD&T Data. Geometric Dimensioning and Tolerancing Design Control

19. Copyright PDES, Inc. R 2000.07.19 Physical Design Control

20. Copyright PDES, Inc. R 2000.07.19 Geometry Capabilities n 2D Compatible with IPC, EDIF, and GDSII n 3D Geometry Models based on AP 203 and others (not all geometry from AP 203 used). n Moves electronic product representation into 3D Realm Geometrically Bounded 2-D Wireframe with Topology Surfaces Advanced BREP Solids Constructive Solid Geometry Open Shell Model Geometry n Parametric Curves (tapers, etc.) n Open Shell Model Supports “Layout Metal” on Curved Surfaces.

21. Copyright PDES, Inc. R 2000.07.19 Configuration and Design Management Capabilities n Conventional Design Control for In- Process and Released Data n Include Simulation Models n Associate Different Design Discipline Models with Same Product Definition Configuration Mgmt Identification Authority Effectivity Control Requirement Traceability Analytical Model Document References n Net Change Capability: – Add, Delete, Change Properties – Applies to Any Sensible Design Object (Constrained by Rules in Data Model) – Allow Direct Correlation Between Change on Drawing and Design Database Change

22. Copyright PDES, Inc. R 2000.07.19 External Definition n Externally Defined Data types Reference Authoritative Documents, for example: – IEC 1182-1 1988 (Land Shapes, Land Patterns) – JEDEC MO-156, Issue A, Date APR 1994 – Externally Defined Data Types Provide Technology Independence.

23. Copyright PDES, Inc. R 2000.07.19 AP210 Implementations n PreAmp Application Framework Uses CD n BD&SG Durability Analysis Uses DIS n ProAM Uses DIS n RASSP Manufacturing Interface Uses DIS-WD1 n TIGER Program Uses DIS-WD1 n RAMP Manufacturing Interface Will use IS n PDES INC. Electromechanical Pilot Project Uses IS n Member Companies will use IS