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UNLEASHING THE POWER OF CONNECTIVITY New Micro Discrete Packages Cross References SOT-723 SOT-5xx.

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Presentation on theme: "UNLEASHING THE POWER OF CONNECTIVITY New Micro Discrete Packages Cross References SOT-723 SOT-5xx."— Presentation transcript:

1 UNLEASHING THE POWER OF CONNECTIVITY New Micro Discrete Packages Cross References SOT-723 SOT-5xx

2 UNLEASHING THE POWER OF CONNECTIVITY Leading Edge Technology… SOT-223 SOT-89 SC-59 SOT-23 SC-70 SC-75 SOD-123 SOD-523 SOD-323 Existing 2004 2005 SC-101 1 st gen. SOD-723 SC-89 SOT-723 SOT-963 SC-74/TSOP6 SOT-563 SC-88 SC-101 2 nd gen. Clip Bonded Power Packages Smaller Scale Wire Bonded Power Packages 6ld 5ld 3ld 2ld SOT-953 SC-74A/TSOP5 SOT-553 SC-88A SC-59EP DPAK D2PAK SO8-FL SMB SMC SMA PowerMite SOD-123FL SO8-FL SC-59EP SOIC TSSOP Micro-x US-x QFN Technology Driver +8ld

3 UNLEASHING THE POWER OF CONNECTIVITY Package Size Comparison SOD123FL v. other diode packages (max dimensions) 1.0 1.8 3.8 1.35 3.85 1.8 1.0 1.35 2.7 0.7 0.9 1.7 SOD123 PMDU SOD123 SOD123FL MINI2 SOD523 EMD2 ESC SOD523 SC79 SS-MINI2 SOD323 UMD2 USC SOS323 SOD323 Rohm Toshiba Philips Infineon Panasonic

4 UNLEASHING THE POWER OF CONNECTIVITY Package Size Comparison SOD523 v. other diode packages (max dimensions) 1.0 1.8 3.8 1.35 3.85 1.8 1.0 1.35 2.7 0.7 0.9 1.7 SOD123 PMDU SOD123 SOD123FL MINI2 SOD523 EMD2 ESC SOD523 SC79 SS-MINI2 SOD323 UMD2 USC SOS323 SOD323 Rohm Toshiba Philips Infineon Panasonic

5 UNLEASHING THE POWER OF CONNECTIVITY Package Size Comparison SOT563 v. other 6 Leads packages TSOP6 (SOT457) (SM6) (SMT6) (Mini6) (SOT23-6) (SC74) (SC59-6) SC-88 (SOT363) (US6) (UMT6) (S-Mini6) (SC70-6) SOT563 (SOT666) (ES6) (EMT6) (SS-Mini6) (SC75-6) 2.75 2.1 1.6 2.0 3.0 Scale: 12:1 1.0 0.6 1.0

6 UNLEASHING THE POWER OF CONNECTIVITY SC-59SOT-23SC-70SC-75SC-89SOT-723 2.9 1.6 1.2 2.0 2.2 2.75 2.9 2.35 1.0 1.05 1.0 0.9 0.8 0.5 Scale: 9.5:1 (SOT-490) (SOT-523) (EMT3FL) (SS-Mini3) (ESM) ( SOT-416) (SOT-523) (EMT3) (SS-Mini3) (SMPAK) (SSM) (SOT-323) (UMT3) (S-Mini3) (CMPAK) (USM) (SOT-23) (SST3) (Micro3) (SOT-346) (SMT3) (S-Mini) (MPAK) (Mini 3) (VMT3) (SSS-Mini3) (VSM) (TSFP-3) Package Outline Comparison SOT-723 v. other packages

7 UNLEASHING THE POWER OF CONNECTIVITY  Available technologies:  Small signal transistors  Digital Transistors  Bipolar Transistors  Small Signal Diodes  Small Signal Switching  Zener Diodes  Small Signal Schottky  Market & Applications  Wireless  Cell-phones, Cam-phones  Consumer  Digital cameras, DV Camcorders  Computing  PDAs, Video Switching, MP3s  General Purpose  GPS  Features  Lower Package Height  30% lower than SC-89  38% lower than SC-75  Flat Lead Configuration  100% Matte Sn (tin) lead finish  1.44mm 2 PCB area SOT-7xx Package  Description  Dimensions  Length: 1.2 mm  Width: 0.8 mm Body; 1.2 mm including leads  Height: 0.5mm  SOT-723  3 Leads  Benefits  Enables low profile PCB’s in end product  Improves Silicon to package ratio  Pb Free Manufacturing capable  Enables high density PCB manufacturing Next generation discrete packaging for miniaturization. This package is ideal for space constrained handheld and wireless applications.

8 UNLEASHING THE POWER OF CONNECTIVITY SOT-7xx Discovery questions 1. Do you have a space constrained application? A need for a smaller footprint and/or a lower profile. 2. What type of function(s) do you need? E.g. single transistor, digital transistor, switching diode, Schottky diode, zener diode See SOT-723/SOD723 offering A logic device, they may need at least 5 leads. Capture the opportunity and advise marketing 3. Do you require a package with multiple functions? E.g. dual transistors or diodes These could require a package with 4, 5, or 6 leads Capture the opportunity and advise marketing


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