1. 16.01.2013Electronic Pack….. Chapter 1 Slide 1 FYS4260 –FYS9260 Chapter 1 Introduction: Electronic products, technologies and packaging The course material was developed in INSIGTH II, a project sponsored by the Leonardo da Vinci program of the European Union

2. 16.01.2013Electronic Pack….. Chapter 1 Slide 2 Chapter 1 Introduction FYS4260: Master level course FYS9260: Ph.D. level course with additional syllabus and laboratory project Lecturers: Per Ohlckers, Johan Tresvig, etc. Laboratory supervisors: Johan Tresvig Please find on Fronter the course web site and on the web site: http://www.fys.uio.no/studier/kurs/fys4260. Vortex pages stinks! http://www.fys.uio.no/studier/kurs/fys4260 –Updated schedule. NB! Please check regularly – subject to changes! –Lecturing notes (ppt files and sometimes pdf files) –Guide for laboratory project(s) –Earlier exam tests and guides –Miscellaneous information (elektronic version of the textbook, etc) Textbook: Leif Halbo and Per Ohlckers: “Electronic Components, Packaging and Production” Textbook, ISBN 82-992193-2-9, 330 pages, Un of Oslo, December 1995 Mandatory reading: –The textbook, project work, lecturing viewgraphs, and tentatively some web pages for latest technology news. The download documentation from the StimesiII course, tentatively to be given on March 17th, 2011 at Sintef MiNaLab The laboratory project work is mandatory. FYS9260 students have a second project The company visits are strongly recommended, but participation is not mandatory Exam training by answering earlier exam tests is very important in order do understand what is expected at the final exam test. Earlier tests and guides on the course web page.

3. 16.01.2013Electronic Pack….. Chapter 1 Slide 3 Chapter 1 Introduction Detailed mandatory reading: –The complete textbook The book could be more updated, but basic content is still valid. First of all get the overview understanding, then dive into the details, which sometimes are too much, for instance tables on material properties. –Laboratory project 1 (FYS4260 and FYS9260 students): Design, assembly and testing of a surface mount printed circuit board. Graded with 20% weight based upon written report and oral presentation. –Project 2 (only FYS9260 Ph.D students): Design of a microsystem flowmeter. Approved/not approved based upon written report. –Lecturing viewgraphs NB! Please observe that the lecturing viewgraphs are better updated than the textbook and contains additional obligatory reading.(This is especially true for Chapter 9: ”Micro Structure Technology and Micromachined Devices” for instance the basic principles of Silicon Micromachining –Additional web-sites and downloadable journal articles, covering latest technology developments and trends: Links and download instructions will be given on the course web site. Download material from the microBUILDER course. Oral information in the lectures: Mostly covering mandatory reading, but some additional issues will be covered as illustrations of important matters.

4. 16.01.2013Electronic Pack….. Chapter 1 Slide 4 FYS4260-9260 students 2013 FYS4260: Afsharian, Mohammad Bagher ??? Bechmann, Halfdan Solberg Butt, Hussain Javaid Ghahramani, Maziar A Grutle, Øyvind Kallevik Johnsen, Andreas Leret Mohamud, Cabdiwahab Omar A Nygaard, Tønnes Frostad Pedersen, Lars AndreaTrømborg, Jon Øyvind Rabiee, Shirin Spilling, Torjus Stastad, Ole Surbehan, Fatih A Søvegjarto, Bendik Sørensen Waarum, Henrik FYS9260: Mughal, Umair Najeeb On the next slide we will start with the first chapter. Total: 16 or 15 registered students

5. 16.01.2013Electronic Pack….. Chapter 1 Slide 5 Definition of ELECTRONIC PACKAGING AND INTERCONNECTION TECHNOLOGY "The realization of the physical, electronic system, starting with block- /circuit diagram” –Involves choice of technology for implementation, choice of materials, detailed design in chosen technology, analysis of electrical and thermal properties, reliability. – This definition is one among many, and may shift as the field is further developed.

6. 16.01.2013Electronic Pack….. Chapter 1 Slide 6 Multidisciplinarity of Electronic Packaging and Interconnection Technology Requires combination of many disciplines: –Electronics –Materials properties and materials compatibility –Mechanics –Chemistry –Metallurgy –Production technology –Reliability, etc. Product development should involve experts from the various fields, and the interdependence of the fields may be the most important to make a good product.

7. 16.01.2013Electronic Pack….. Chapter 1 Slide 7 TYPES OF ELECTRONICS AND DEMANDS ON THEM - EXAMPLES Satellite electronics –Production volume: one unit, 20 years life required, no repair, very low weight and power, very high development cost acceptable Life saving medical electronics –Similar reliability/power demand, may be in harsh environment (body fluids), medium production volume.

8. 16.01.2013Electronic Pack….. Chapter 1 Slide 8 Examples, cont Telephone main switchboard –10 year life, benign environment, very high complexity, low and high production volume, high price pressure Military electronics –Very high reliability demands, in very rough environments. High development cost (and production cost) acceptable

9. 16.01.2013Electronic Pack….. Chapter 1 Slide 9 Examples, cont Computers –High performance and reliability required. Very short product life, high production volume for some, small volume for some products Consumer products (watches, calculators...) –Extreme price pressure, very short product life, low weight, power, very big market. No repair.

10. 16.01.2013Electronic Pack….. Chapter 1 Slide 10 There's Plenty of Room at the Bottom “There's Plenty of Room at the Bottom” is a lecture given by physicist Richard Feynman at an American Physical Society meeting at Caltech on December 29, 1959. [1] Feynman considered the possibility of direct manipulation of individual atoms as a more powerful form of synthetic chemistry than those used at the time. The talk is considered to be a seminal event in the history of nanotechnology, as it inspired the conceptual beginnings of the field decades later.Richard Feynman [1]history of nanotechnology The lecture is in the same way famous for foreseeing the broader developments of micro- and nanotechnologies from then to now and most probably for future years!

11. 16.01.2013Electronic Pack….. Chapter 1 Slide 11 Moore’s “Law”: Continuous evolution creating a revolution! Exponential increase of transistor count on IC chips – doubling every 18 th month, and decrease of feature sizes with time. Impact comment: See: www.youtube.com/watch?v=AWcV-eoJqT8 www.youtube.com/watch?v=AWcV-eoJqT8

12. 12de 12 Electronic Pack….. Chapter 1

13. 16.01.2013Electronic Pack….. Chapter 1 Slide 13 Development Phases Market research –Gives product idea

14. 16.01.2013Electronic Pack….. Chapter 1 Slide 14 DEVELOPMENT PHASES, continued Pre-study –Gives product suggestion Defining overall specifications –Gives definition of product, simulation/lab model of critical parts Prototype A –Main principles analyzed, important parts implemented, technology chosen

15. 16.01.2013Electronic Pack….. Chapter 1 Slide 15 DEVELOPMENT PHASES, continued Prototype B –Detailed design, correct form and components. Ready for industrialization. Industrialization –Prototype adapted to producability in available production equipment. New production line built if needed, pilot series made. –Marketing started, service planned –Full scale production –Product sale, maintenance, service

16. 16.01.2013Electronic Pack….. Chapter 1 Slide 16 LEVELS OF INTERCONNECTION Fig 1.2 Levels of interconnections in large electronic systems

17. 16.01.2013Electronic Pack….. Chapter 1 Slide 17 End of presentation of Chapter 1 Introduction: Electronic products, technologies and packaging Important issues: –Definitions –Multidisciplinarity –Different types of applications with different requirements –Hierarchy for Levels of Interconnections Questions and discussions?