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ROBERT HENDRY, GILBERT HENDRY, KEREN BERGMAN LIGHTWAVE RESEARCH LAB COLUMBIA UNIVERSITY HPEC 2011 TDM Photonic Network using Deposited Materials.

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Presentation on theme: "ROBERT HENDRY, GILBERT HENDRY, KEREN BERGMAN LIGHTWAVE RESEARCH LAB COLUMBIA UNIVERSITY HPEC 2011 TDM Photonic Network using Deposited Materials."— Presentation transcript:

1 ROBERT HENDRY, GILBERT HENDRY, KEREN BERGMAN LIGHTWAVE RESEARCH LAB COLUMBIA UNIVERSITY HPEC 2011 TDM Photonic Network using Deposited Materials

2 Motivation for Silicon Photonics Performance scaling becoming extremely difficult Data movement cost increasingly expensive On/off-chip communication bandwidth limited Photonics offers:  Higher bandwidth density  High datarate and parallel wavelengths  Low operating power  Low latency HPEC 20112

3 Target Architectures Optical link to memory Optical interconnection network on stacked memory HPEC 20113

4 Ring Resonators HPEC 20114 waveguide light source modulator waveguide signal switch waveguide signal switch Off resonance On resonance waveguide signal filter optical message electric control electric control

5 Photonic Communication Light source Optical signal ring-resonator modulators Electrical control detectors filters Photonic Network HPEC 20114

6 Photonic Communication Light source Optical signal Electrical control detectors filters Photonic Network 10 Gb/s x 3 = 30 Gb/s aggregate bandwidth HPEC 20115

7 Optical Power Budget Optical Power Detector Sensitivity Nonlinear Effects Total Injected Power Received Power Maximum Network-Level Insertion Loss Injected Power Per Wavelength P total = P channel × N The total injectable power P total must remain below a threshold to avoid non-linear effects. P total is then divided among the N wavelengths of a WDM packet, where each channels injects at P channel. HPEC 20116

8 Silicon Photonics Technologies Crystalline Silicon  Best electrical and optical properties  Unable to deposit Material Propagation Loss Crystalline Silicon 1.7 dB/cm [Xia et al. 2007] HPEC 20119

9 Silicon Photonics Technologies Crystalline Silicon  Best electrical and optical properties  Unable to deposit Polycrystalline Silicon  Can deposit  Very lossy Material Propagation Loss Crystalline Silicon 1.7 dB/cm [Xia et al. 2007] Polycrystalline Silicon 6.45 dB/cm [Fang et al. 2008] HPEC 20119

10 Silicon Photonics Technologies Crystalline Silicon  Best electrical and optical properties  Unable to deposit Polycrystalline Silicon  Can deposit  Very lossy Silicon Nitride  Very low loss  Can deposit  Not useful active devices Material Propagation Loss Crystalline Silicon 1.7 dB/cm [Xia et al. 2007] Polycrystalline Silicon 6.45 dB/cm [Fang et al. 2008] Silicon Nitride 0.1 dB/cm [Shaw et al. 2005] [Gondarenko et al. 2009] HPEC 20119

11 Poly-Si / SiN Combination approach We can use silicon nitride and polycrystalline silicon in combination  SiN for non-active wave guides  Poly-Si for active devices (e.g. ring-resonator based switch) Designs for a layered modulator and switch HPEC 201110

12 Poly-Si / SiN Combination approach Waveguide crossings eliminated  Insertion loss, crosstalk both incurred heavily in waveguide crossings However,.1 dB insertion loss per vertical coupling [Sun et al. 2008] HPEC 201111

13 Insertion Loss Analysis Worst-case insertion loss for a photonic mesh [Biberman et al. 2011] HPEC 201112

14 Insertion Loss Analysis Worst-case insertion loss for a photonic mesh [Biberman et al. 2011] HPEC 201113

15 Photonic TDM NoC Architecture Mesh topology No electronic links, other than TDM clock distribution TIME Time slot 1 Time slot 2 Time slot 3 Time slot 4 Time slot 5 HPEC 201115

16 Photonic TDM NoC Architecture Mesh topology No electronic links, other than TDM clock distribution TIME Time slot 1 Time slot 2 Time slot 3 Time slot 4 Time slot 5 HPEC 201116

17 Photonic TDM NoC Architecture Mesh topology No electronic links, other than TDM clock distribution TIME Time slot 1 Time slot 2 Time slot 3 Time slot 4 Time slot 5 HPEC 201117

18 Photonic TDM NoC Architecture Mesh topology No electronic links, other than TDM clock distribution TIME Time slot 1 Time slot 2 Time slot 3 Time slot 4 Time slot 5 HPEC 201118

19 Photonic TDM NoC Architecture Mesh topology No electronic links, other than TDM clock distribution TIME Time slot 1 Time slot 2 Time slot 3 Time slot 4 Time slot 5 HPEC 201119

20 Photonic TDM NoC Architecture Mesh topology No electronic links, other than TDM clock distribution TIME Time slot 1 Time slot 2 Time slot 3 Time slot 4 Time slot 5 HPEC 201120

21 X-Y Buffering Mesh topology No electronic links, other than TDM clock distribution Optical Power Detector Sensitivity Nonlinear Effects Maximum Network-Level Insertion Loss P total = P channel × N HPEC 201121

22 Photonic TDM vs. Photonic Circuit-Switched Insertion Loss HPEC 201122

23 Single-Layer Switch vs. Multi-layer Switch Single-layer TDM SwitchMulti-layer TDM Switch Control East 1 2 5 6 3 7 4 8 North South West Gateway HPEC 201123

24 Single-Layer Switch vs. Multi-layer Switch Single-layer TDM SwitchMulti-layer TDM Switch Control East 1 2 5 6 3 7 4 8 North South West Gateway HPEC 201123 18 crossings4 crossings

25 TDM Network Insertion Loss Analysis 4x4 Network 8x8 Network 16x16 Network 64x64 Network HPEC 201125

26 Maximum Bandwidth (# of Wavelengths) 4x4 Network 8x8 Network 16x16 Network 64x64 Network HPEC 201126

27 Summary of Results HPEC 201127

28 Conclusions Poly-Silicon and Silicon Nitride in conjunction are a good choice of materials for photonic interconnection networks  Low-loss  = more wavelengths = higher bandwidth We’ve shown that our best network, when at large scale, can be improved with a multi-layer implementation Future work: We expect the elimination of waveguide crossings to significantly reduce crosstalk across a wide variety of network architectures HPEC 201128

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