1. Atotech’s Solutions for MLB Production using Advanced Basematerials
Speaker:
Jaime Peraza Ordaz
PMM Atotech Europe
mobile:
Tobias Sponholz
Global Assistant Product Manager BTT PTH Mobile: +49 (0)

2. Agenda 1 2 3 4 Application Guide Horizontal Electroless Copper
Printoganth P Plus 2
Vertical Electroless Copper
Printoganth PV (E) 3
Direct Plating
Neopact
Seleo CP Plus 4
Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO

3. Application Guide

4. PTH Process Overview Application and Pricing Guide
PTH PROCESS APPLICATION GUIDELINE
Segment
Application/ Technology
Recommended Process
Vertical
Horizontal
Direct Plating
IC Substrate
SAP (GX92, GX13, GX-T31, ..)
Printoganth MV Plus
Printoganth SAP Plus
n/a
MSAP, AMSAP (BT, BT PCF, ...)
Printoganth P Plus
HDI & MLB
Advanced Materials (PTFE, BT, High Tg FR4,
Printoganth PV E
Neopact Seleo CP Plus
Standard Materials (standard FR4,…)
Noviganth LS Plus
Printoganth U Plus or Printoganth U
Seleo CP Plus

5. Horizontal Electroless Copper Printoganth P Plus

6. Printoganth P Plus enables highest flexibility in production mix
Printoganth P Plus Features & Benefits
Market Introduction in Sept. 2009
Target Application
Any production with advanced materials where adhesion or blistering is an issue e.g. flex, rigid-flex, PTFE, BT, PI, etc.
HDI and AMSAP technology
Technical Benefits
Extremely good non-blister behavior and coverage performance
Very good reliability
Easily adjustable deposit rate 0.35 – 0.5µm / 4 min
Enhanced bath stability
Printoganth P Plus enables highest flexibility in production mix

7. Horizontal MLB and HDI Processes Comparison
Printoganth U
Printoganth U Plus
Printoganth H-DK
Printoganth P
Printoganth P Plus
Reliability +
+++ ++
Deposition rate
0.35 µm in 4 min
0.5 µm in 4 min
0.3 µm in 4 min
µm in 4 min
Non-blistering performance
fair on all standard base materials
excellent even on challenging base materials
Bath Stability
CN-free No
Yes
Components excl. NaOH 4 5
, JPO
CN-
Printoganth P Plus is Atotech’s most capable process for HDI manufacturing

8. Horizontal Desmear Uniplate P
Process Sequence
Securiganth E Sweller
Securiganth P500
Reduction Cleaner Securiganth E or Reduction Conditioner Securiganth P500
Sweller
Permanganate Etch
Reducer
SECURIGANTH® desmear series is the industry standard for horizontal HDI manufacturing.
Optimal desmear attack on a wide variety of base materials.

9. Horizontal Activation & E’less Cu Uniplate LB
Process Sequence
Cleaner Securiganth E
Securiganth SPS
Neoganth Pre-Dip B
Neoganth U Activator
Neoganth WA Reducer S
Printoganth P Plus
Cleaning
Etch Cleaning
Pre Dip
Neoganth 800
Activator
Reducer
E’less Copper

10. Economic Activator Neoganth 800 Features & Benefits
New Ionic activator system for horizontal application running at only 75ppm Pd
Activator U = 225 ppm
Enables significant savings in running costs by less consumed Pd
Fully compatible to established Atotech conditioning system
easy drop in solution
Perfect coverage on a wide range of relevant base materials
Same excellent reliability results as Activator U
Robust & easy process
Wide working window
Activator 800 during Alpha site test

11. Non-Blistering Performance Theoretical Explanation
Non-blistering performance is related to internal stress within deposited e’less Cu layer
Relevant factors for Cu deposit behavior
Stabilizer type & concentration
Stabilizer Co-deposits (e.g. Ni)
Deposition temperature
Baking after electroless Cu deposition
X-ray diffraction (XRD) measurement reveals constant tensile stress with Printoganth P Plus – a type of internal stress that is beneficial for non-blistering!
relative strain
Printoganth P series Z X

12. Printoganth P Plus Applications
Flex-Rigid Board
FR4 Production Board
KCC production panels
Nur zeigen, nicht ins Handout
Nicht bei KCC!
No Blistering due to excellent stress characteristics
Bright deposition color

13. Reliability Summary
Quick Via Pull test, 3-6 mil – all passed.
Solder Shock Test (6x 288°C, 10s floating) – No ICDs, passed. with THs and BMVs
Solder Shock Test (9x 326°C, 10s), THs & BMVs – few ICDs, ok. with THs and BMVs
IST (+150°C / 3’/ cool down within 2‘, max. 10% resistance increase) – 2000 cycles passed.
Various E-tests (daisy chains) – all passed.
Printoganth P Plus fulfills all reliability requirements for high-end HDI production.

14. Printoganth P Plus Customer References
Country
Lines
Capacity [Tm²/ yr]
Panel Type
Remark
AT&S
Austria 2
240
FR4
KCC
Korea 5
1000
FR4, RCC
INTERFLEX 3
700 PI
SI FLEX
Korea / China
720
PI, Rigid-Flex
R2R
LGIT
640
BT, FR4
AMSAP
Youngpoon
480
Daisho
Japan 1
180
Rigid-Flex
Shennan
China
Founder
FR4,..
Foxconn
620
High Tg FR4
ASE
Taiwan
120 BT
Simmtech
320
Unimicron
TOTAL 26

15. Vertical Electroless Copper Printoganth PV (E)

16. Neoganth LS Activator Plus (75 ppm Pd)
Process Sequence Activation & E‘less Cu
Products
Temp. (°C)
Time (min)
Securiganth Cleaner 902 60 4
SPS 30 1
Neoganth LS Pre Dip RT
Neoganth LS Activator Plus (75 ppm Pd) 40
Neoganth LS Reducer 3
Printoganth PV (E) 34
8-20
Desmear
Cleaning
Etch Cleaning
Pre Dip
Neoganth V8 (60 ppm) 50
Activator
Reducer
E’less Copper

17. Activation Series Neoganth LS Plus Features & Benefits
Ionic Activator for vertical application
Optimal coverage at low running cost (75ppm Pd)
Fine & homogeneous distribution of Pd particles
No tooling hole issues
Not corrosive
Improved robustness, no precipitations during manual replenishment
Easy handling, no premixing
100% compatible to established conditioning concept
Pre Dip
Activator
Reducer

18. Activator Neoganth V8 – full power ionic activation at low cost
Economic Activator EXPT Neoganth V8 Features & Benefits
New ionic activator system for vertical MLB/HDI applications running at only 60 ppm Pd
Enables significant savings in running costs by less consumed Pd
Modified complexing agents
Ensures good coverage despite low palladium content
‘Locking’ copper ions in a stable complex enhances bath lifetime
Less alkaline
Improved bath stability by reduced carbonate formation
Perfect coverage on a wide range of relevant base materials
Fully compatible to established Atotech conditioning system
Easy drop in solution
Robust & easy process
No additional NaOH dosing required by optimized replenishment concept
Wide working window
Activator Neoganth V8 – full power ionic activation at low cost

19. Printoganth PV Stabilizer
Printoganth PV vs PV E Comparison
Printoganth PV
Printoganth PV E
Printoganth V Copper
Printoganth V Copper E
Printoganth V Basic
Printoganth PV Stabilizer
Cu Reduction Solution
NaOH …
Cleaning
Etch Cleaning
Pre Dip
Identical stabilizer system
Same bath performance
Different Cu source (CuSO4, CuCl) to be more flexible in supply chain
PV E potentially more cost-effective due to higher concentrated Cu additive
Activator
Reducer
E’less Copper

20. Printoganth PV (E) Features and Benefits
Versatile vertical e’less Cu process for advanced MLB/HDI applications
Superior adhesion on most materials including PI, PTFE, BT... due to optimal internal stress characteristics of the copper deposit:
No blistering
No pull away
Highly reliable process
Fulfills all standard reliability requirements such as SST, IST, TCT
No ICDs at standard conditions and only low occurrence at harsh solder shock conditions as 9x 326ºC
Low to high build deposit possible
Deposition speed µm in 10 min
Environmentally friendly
Tartrate based
Cyanide free

21. Printoganth PV E Coverage in Through Holes
Pos.1
Pos.6
Pos.2
Pos.7
Pos.3
Pos.8
Pos.4
Pos.9
Pos.5
Pos.10

22. Excellent BMV coverage despite strong glass fiber protrusion!
Printoganth PV E Coverage in Blind Micro Via
SEM picture
Excellent BMV coverage despite strong glass fiber protrusion!

23. Printoganth PV E Coverage
Base material
Tg °C
phenolic
Halogen -free
Lead-free compatible
Poly- imide
Backlight PV E
Backlight PV
Isola Duraver 104
135 x D8 D9
Matsushita R1566
150
D7-8
Hitachi MCL- BE-67G
D9-10
DuPont Pyralux AP
195
D8-9
Isola Duraver 114
Isola Duraver 117
170
Nan-Ya NP- 175-TL
D10
PIC DF-170 D7
standard pth process without 902 Flex Cleaner or Reduction Conditioner

24. Outstanding adhesion with Printoganth PV E !
Printoganth PV E Surface Adhesion
Excellent adhesion on exposed polyimide
Outstanding adhesion with Printoganth PV E !

25. Printoganth PV E Production Example – Exotic Materials
Korean Customer for military application
Final Product
Fe oxide powder
EPDM Rubber

26. Printoganth PV E fulfills highest reliability requirements
Printoganth PV E Solder Shock Results
Solder dip conditions
ICD
Inspected Inner layer
% ICD
6 x 10
203 0%
9 x 10
202
12 x 10
182
15 x 10
102
18 x 10 1 99 1%
Alpha site test with customer production panel (Nanya NP-175TL, phenolic-cured FR4, Tg 175ºC)
Printoganth PV E fulfills highest reliability requirements

27. Printoganth PV E Solder Shock Results
6x IR reflow + 1x solder shock
no pull away
no ICD
customer internal test results, production panels (EMC EM-320, lead-free high Tg 170ºC)
Solder shock tests
Test conditions
ICD
Inspected Inner layer
% ICD
6 x 10 36 0%
10 x 10
14 x 10 34
18 x 10
Test at customer site with production panels (Isola E-Cu 114, dicy-cured FR4, Tg 150ºC)

28. PC Chipset, Graphic chipset, Mobile
Printoganth PV E and PV References
Customer
Country
Lines
Capacity
Base Materials
Application
Boardtek
Taiwan 4
High Tg FR4, Teflon
high frequency
New Flex
Korea 1
PI, FR-4
PC Chipset, Graphic chipset, Mobile
Jiang Nan Institute
China
FR4, RCC, HTg
military
ChangSung
60.000
Special
ACB
Europe
25.000
FR4, HTG, PI, PTFE
Military, automotive
Exception
23.000
FR4, HighTg, BT,
various
Others -
30.000
Printoganth PV
Customer
Country
Lines
Capacity [m²/year]
Base Materials
Application
Sonic
India 1
72.000
FR4
Arktron
15.000
Meadville (DMC)
China
FR-4 High Tg,
High-layer MLB
Meadville (MAS)
350,000
FR-4 High Tg, HF
MEIKO
FR-4, HF
HDI
Mutual-Tek
Taiwan
FR4, PI
Flex-Rigid
Printoganth PV E
status

29. Printoganth PV (E) Summary
vertical e’less Cu process for MLB/HDI applications
outstanding non-blistering performance on any kind of base materials
highly reliable
Optimal performance in conjunction with
Securiganth BLG desmear
Neoganth LS Plus activation
Outlook
Neoganth V8 Activator for lower running cost
Deposit structure of Printoganth PV E
Plated BMV with Printoganth PV E 29