1. Shanghai Microsemi
Semiconductor Co., Ltd.
Feb 2011 1

2. Company Profile Located at Xin Zhuang, Shanghai, China
Established in September 1995
100% owned by Microsemi Corp in Dec 2007
4” Wafer Fab with monthly output 60K pcs, 80% utilization rate
Feb 2011

3. Products Portfolio
GPP Chips
Finished Goods
Feb 2011

4. Products Tree Finish Goods Diode Bridges Modules Feb 2011 GPP Diode
Single-Phase
Rectifier Bridges
Diode Modules
FRED
Modules
3-Phase Rectifier
Modules
High Voltage
Stack Diode
3-Phase
Rectifier Bridges
SCR
Modules
Rectifier+SCR
Modules
Feb 2011

5. Microsemi Shanghai ’s Technology Advantages
Feb 2011

6. Passivation techniques
Star
Die Construction
Process
Diffused wafer (Open Junction)
Diffused wafer +
Silicone rubber protection
Grooves etching
Glass layer on etched grooves
SIPOS
Quality rating
Low end
Low quality
Medium quality
Better than medium quality P + N P+ N+ P+ N N+ P+ N N+ N N+ P+
Feb 2011

7. Microsemi’s 5-Star Passivation
Silicon nitride layer
= Silicon Nitride & Glass passivation
Microsemi uses the process for all hi-rel discrete devices
Process : Grooves etching + Silicon Nitride + glass layer on etched grooves
Quality rating: Highest quality process
Feb 2011

8. Advantages of SMSC’s GPP chips
Technology coming from Microsemi Corp’s Hi-Rel processing
Unique multilayer passivation ensure excellent high temperature characteristics and passing 200C HTRB test
Die size from 0.050” Sq to 0.672” Hex
High purity evaporated metal ensure a strong metallurgical bond and provides extremely low contact resistance
P+ Layer
N+ Layer
LPCVD growth layers plus glass passivation
LPCVD : Low Pressure Chemical Vapor Deposition
Feb 2011

9. Double Isolation Technology
Advantages:
GPP Chips -- SMSC’s New developed Passivated Double Isolation Chips
Feb 2011

10. FG’s Release to Market (RTM) Procedures
SMSC
SMSC/Sub-con
SMSC
Die receiving inspection
Visual / Electrical inspection
Assembly
Finished Goods (FG)
Visual/Electrical
Stamping
Reliability tests
REPEATEDABILITY TRIALS
RTM
Die qualification
Visual examination
Electrical inspection
HTRB
FG inspection
Visual / Electrical inspection
Reliability tests (next slide)
Feb 2011

11. Reliability Tests Plan
Test Description
Purpose
Device Under Test 1
High Temperature reverse Voltage Burn-in
Determine the effect of bias and temp on the device over an extended period of time
Die & F.G. 2
Autoclave
Determine the effect of temp, humidity & pressure on the device over time, unbiased
F.G. 3
High temperature storage test
To accelerate failure mechanisms which are thermally activated through the application of extreme temp, unbised 4
Temperature Cycling
Determine the effect of temp on Material Thermal Mismatch 5
Intermittent Operating Life
To evaluate the bulk stability of the die and to generate defects resulting from manufacturing aberrations that are manifested as time and stress-dependent failures 6
Reverse Energy test
Application test for high voltage diode
High voltage diode 7
Welder test
Application test for UFT modules
UFT Modules
Feb 2011

12. Reliability Tests Test Description Test Conditions
High Temperature Storage Life(HTSL)
Ta = 150 ℃, T=48H,
No bias
Temperature Cycling Test(TCT)
HOT Ta=Tvjm T= 30mins, COLD Ta=Tvjl T= 30mins, TRANSFERRING ≤ 10secs, Cycles=10
Pressure Cooker Test (PCT)—(Plastic package)
121℃, T=48H
High Temperature Reverse Bias(HTRB)
Tj=150℃, VBR=80%VRRM, T=96H
Intermittent Operating Life(OP-Life)
Ton = Toff = 5minutes,
or Ton =From Tj= 25+/-5 ℃ to Tj =150+0/-10 ℃,
Toff= From Tj= 150+0/-10 ℃ to Tj =25+/-5 ℃
Feb 2011

13. Single Phase Bridge Rectifiers
Specs:
Io = 0.5~50A STD VRRM =200 ~ 1000V
Typical Applications:
GBJ、IH、KBJ Series:
Induction Heater/Home Appliance/Switching Power/Industrial Power Controller
GBU、GBL、KBP Series:
PC Power/LCD-TV/Industrial Power Controller
GBPC & GBPC-W Series:
Welder/Air-condition/Communication Power Supply/Industrial Power Controller
Feb 2011

14. High Voltage Stack Diodes
Plastic case UL flammability recognition 94V-0
Replacement of Philips parts (e.g. BYX134GPL)
Using SMSC’s unique passivated GPP chips
High voltage up to 6KV GPP chips
High maximum operating temperature
Application: Ignition systems; High voltage coils;
X-ray system; Microwave system, etc.
Business Partners:
Federal Mogul
Delphi
Eldor
TYPE
MAIN ELECTRICAL PARAMETERS
PKG
DIMM
VRRM / kV
IF（AV）/ mA
IFSM/A
VF/ V
BYX134P 4 10 30
5.00
DO-15
MSHV40P
DO-41
Feb 2011

15. FRED Modules Ultra Fast Recovery Epitaxial Diodes
Common cathode configuration
Epoxy Potting body
Low Leakage Current
Low Forward Voltages
150℃ Operating Junction Temperature
RoHS Compliance
CODE
VRRM VF
I F
Trr
UFT20040CT
400V
1.1 V
100A
75ns
UFT20060CT
600V
1.2 V
Feb 2011

16. 3-Phase Bridge Rectifiers MT Series
35 to 50 Ampere Current Rating
800V to 1800V Reverse Voltage Rating
Direct Replacement to IXYS & IR parts
Typical Applications:
UPS, Industrial Power Controller,
Input rectifiers for PWM inverter,
Battery DC power supplies
High-frequency Switching Power Supply
Feb 2011

17. 3-Phase Bridge Rectifiers
Type
Frame
Remark
MT3516A
Framework: Aluminium Copper Clad Laminate
The lower Case-temperature, the higher efficient, the better reliability, and the longer lifetime
MT3516
Framework: Aluminium based Case
NEW
Feb 2011

18. 3-Phase Bridge Rectifiers
Brand
Type
Rthj-c(℃/W)
MSC
MT3516A 1#
0.73
MT3516A 2#
0.70
(A)
Vxx #
1.76
Vxx #
2.04
(B)
36Mx #
2.70
Feb 2011

19. Power Diode Modules Quality Assurance Assembly Technology
NEW
Quality Assurance
SMSC’s New developed Passivated Double Isolation Chips Inside
100% HTRB Test for Each Lot
Double Moat Structure
DGP Chip
DGP design would improve the reliability and performance
Assembly Technology
-- “Vacuum + H2” Multi-Gas Brazing Technology
-- Brazing with DBC for excellent thermal distribution
-- Ultrasonic scanning to ensure reliable brazing quality
-- High insulation voltage ≥ 3000V
-- Vacuum Welding Technology -- Voidage: <2.5%
-- X-ray Whole Body Scanned
Feb 2011

20. Power Diode Modules Diode-Diode Modules
CODE
CIRCUIT
VRRM IF
PKG
MSKD
800V-1800V
36A-120A D1
165A-200A D2
MSAD
250A-300A D3
350A-400A D4
MSCD
500A-600A D5
800A D6
Feb 2011

21. Power Diode Modules Rectifier Modules
CODE
CIRCUIT
VRRM ID
PKG
MSD
800V-1800V
30A-50A M1
52A-75A M2
100A-200A M3
Feb 2011

22. Power Diode Modules Applications -- DC Power Equipment -- Inverter
-- Battery Charger
-- DC Motor Power Supply
-- Welding Machine
-- PWM Converter Rectifier
Nov 2010

23. MAIN ELECTRICAL PARAMETERS
New product Promotion
60EPS Series
High Reliability & High current capacity
Low Leakage Current
Low Forward Voltage
150℃ Operating Junction Temperature
ROHS Compliance
Replacement of IR Parts
The official approval document of 60EPS by APC of Schneider Denmark.
Applications
-- Input rectification
-- Output rectifies which are available in indentical package outlines
-- Industrial Level
TYPE
MAIN ELECTRICAL PARAMETERS
PKG
DIMM
VRRM / V
IF（AV）/ A
IFSM/A
VRSM/ V
60EPS12
1200 60
1100
1300
TO-247AC
60EPS16
1600
1700
Feb 2011

24. New product Promotion ——3-phase Rectifier Modules
MSDM Series
Glass passivated chip
High Reliability
Superior thermal conductivity
Blocking voltage:800 to 1800 V
Heat transfer through aluminum
oxide DBC ceramic isolated metal
baseplate
M2-1
M3-1
Thin modules
(17mm high)
Application
--Three phase rectifiers for power supplies
--Rectifiers for DC motor field supplies
--Battery charger rectifiers
--Input rectifiers for variable frequency drives
CODE IF
CASE
MSDM
50~100A
M2-1
150~200A
M3-1
Feb 2011

25. New product Promotion ——Diode Modules
MSCD-B/MSAD-B/MSKD-B Series
Blocking voltage:800 to 1800V
Heat transfer through aluminum
oxide DBC ceramic isolated metal
baseplate
Glass passivated chip
D2-1
CODE IF
CASE
MSCD-B
MSKD-B
MSAD-B
36A-120A
D1-1
165A-240A
D2-1
Application
Non-controllable rectifiers for AC/AC converters
Line rectifiers for transistorized
AC motor controllers
Field supply for DC motors
Circuit
Feb 2011

26. New product Promotion ——Thyristor Modules
MSTC/MSFC Series
Isolation voltage 3000V
High surge capability
Glass passivated chips
International standard package
Simple Mounting
Heat transfer through aluminum oxide DCB ceramic isolated metal baseplate
T1/F1
T2/F2
Circuit
Application
Power Converters
Lighting Control
DC Motor Control and Drives
Heat and temperature control
Feb 2011

27. New product Promotion ——3 phase Rectifiers+SCR Modules
MSDT Series
Three Phase Diode and a Thyristor
Isolation voltage 3000V
High surge capability
Glass passivated chips
Simple Mounting
Isolated Module Package M4 M5
Application
Inverter for AC or DC motor control
Current stablilzed power supply
Switching power supply
CODE
Case
MSDT75 M4
MSDT100
MSDT150 M5
MSDT200
Circuit
Feb 2011

28. Power Modules Cross Reference Guide (partial)： * For Reference Only
Feb 2011 28

29. Power Modules Cross Reference Guide (partial)： * For Reference Only
Feb 2011 29

30. Major Customers
Feb 2011

31. Quality System
ISO
9001:2008
ISO 14001:2004
Feb 2011

32. Quality System
RoHS Compliance
REACH
Compliance
UL Approved
Feb 2011

33. Thank You Shanghai Microsemi Semiconductor Co., Ltd.
203 Shen Nan Road, Shanghai, , PRC
Website:
Sales :
Feb 2011