Presentation is loading. Please wait.

Presentation is loading. Please wait.

C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design Mechanical Design, CRaTER Assembly and Electronics Assembly Preliminary.

Published byLouise Oliver Modified over 8 years ago

Similar presentations

Presentation on theme: "C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design Mechanical Design, CRaTER Assembly and Electronics Assembly Preliminary."— Presentation transcript:

1 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design Mechanical Design, CRaTER Assembly and Electronics Assembly Preliminary Design Review Matthew Smith Mechanical Engineer (617)-252-1736 matt@space.mit.edu

2 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design Overview Instrument and Assembly Description Mechanical Environments and Requirements Mechanical Design Details Near Term Tasks Back-up slides

3 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design Instrument and Assembly Description Crater integrates two main sub-assemblies: The Telescope Assembly and The Electronics Assembly. –The Telescope Assembly is being designed and built by The Aerospace Corporation –The Analog Board is being designed by Aerospace. The Flight Analog Boards will be built by MIT –The Digital Board and Electronics Enclosure Assembly are being designed and built by MIT. –MIT will integrate the sub-assemblies and perform all functional, environmental and acceptance testing.

4 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design Instrument and Assembly Description

5 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design Mechanical Environments From 431-RQMT-000012, Environments Section 2. SectionDescriptionLevels 2.1.2Net cg limit load12 g 2.4.2Sinusoidal Vibration LoadsFrequency: 5-100 Hz Protoflight/Qual: 8g Acceptance: 6.4g 2.5Acoustics Enclosed box without exposed thin surfaces OASPL Protoflight/Qual: 141.1 dB OASPL Acceptance: 138.1 dB 2.6.1Random VibrationSee Random Vibration slide 2.7Shock environment40 g at 100 Hz 2665g at 1165 to 3000 Hz. No self induced shock. 2.8VentingPer 431-SPEC-000091 LRO Thermal Subsystem spec.

6 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design Mechanical Requirements and Verification From 431-RQMT-000012, Verification Requirements Section 3. SectionDescriptionLevels 3.1.2.1 3.1.2.2 Stowed fundamental Hz Deployed fundamental Frequency Freq >35 >3 Hz 3.2.1Factors of SafetySee FOS table 3.2.2Test factorsSee Test Factors table 3.2.3.2MEVR-10 Perform frequency verification test for Instruments with frequencies above 50 Hz.. MEVR-11 Report frequencies up to 200Hz Low level sine sweep We will be above 50Hz. 3.3Finite Element Model requirementsWe will be above 75Hz and will not be required to submit an FEM of CRaTER.

7 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design General Thermal Subsystem Requirements from 431-Spec-000091 SectionDescription 4.1 Exterior facing MLI blankets shall have 3 mil Kapton with VDA in outer Coating. 4.2MLI Blanket Grounding: All blankets shall be grounded per 431-ICD-00018 4.3MLI Blanket Documentation: The location and shape documented in as-built ICDs. 4.4Attachment to MLI Blankets: All exterior MLI blankets shall be mechanically constrained at least at one point.

8 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design DESIGN DETAILS Electronics Assembly Natural Frequency Estimates –Based from Steinberg Vibration Analysis for Electronic Equipment- (Simply supported on 4 sides.) Top Cover~ 199 Hz Bottom Cover ~ 159 Hz Analog Board~ 138 Hz Digital Board~ 149 Hz –From SOLID WORKS model of E-Box frequency is 702Hz at the middle plate that holds the two Circuit Card Assemblies.

9 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design DESIGN DETAILS Mechanical Environments, Random Vibration Random Vibration will drive most of the analysis For resonances in the Random Vibration Spec, Miles’ Equation shows 3 sigma loading on the order of 75-150 g Assume Q=10 Overall 14.1 Grms 10.0 grms

10 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design DESIGN DETAILS Stress Margins, Electronics Assembly Pieces Load levels are superceded by random vibration spec Factors of Safety used for corresponding material from 431-SPEC-000012. –Metals: 1.25 Yield, 1.4 Ultimate –Composite: 1.5 Ultimate Margin of Safety = (Allowable Stress or Load)/(Applied Stress or Load x FS) – 1 DescriptionMaterial Desc.MS YieldMS UltimateComments Top CoverAluminum 6061 +14.2+19.5Note 1 Bottom CoverAluminum 6061+13.4+18.4Note 1 Digital BoardFR4brittle +1.5Note 1 Analog BoardFR4Brittle +0.2Note 1 E-box Structure Aluminum 7075> +2.8>+3.1Note 2 Note 1. From Steinberg, Vibration Analysis for Electronic Equipment Note 2. From SOLID WORKS, COSMOS excluding top and bottom covers in the model. All components have positive Margin of Safety

11 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design Mechanical Design Details The first fundamental frequency is estimated to be 149 Hz. –Not required to produce an FEM since our predicted first frequency is >75 Hz. All positive margins of safety. Meet all factors of safety. No Fracture Critical Items.

12 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design Internal Requirements for the Electronics Assembly Derived Internal Mechanical Requirements for Electronics Enclosure –Have adequate contact area (.5 in^2 min) to the spacecraft to support Thermal requirements. –Provide safe structure, within Factors of Safety specified, to support Telescope Assembly. –Provide for mounting 2 Circuit Card Assemblies. The Analog Board and Digital Board must be separated by an aluminum plate. –The Analog Board to provide direct linear path for electronics from the telescope interface to the Digital Board interface to reduce noise. –Provide means to route cable from telescope to the Analog side of the Electronics Enclosure. –Electrically isolate the electronics Enclosure from the Telescope, yet provide sufficient thermal conductance path. –Provide adequate surface area for mounting electrical components. –Interface to the Spacecraft to be on one side of the Electronics Enclosure. The interface connectors to be on the Digital side of the Electronics Enclosure (separate from the Analog side) –Provide GN2 purge interface inlet and outlet ports. –Follow the octave rule for natural frequency of the PWAs to the Electronics Enclosure. The Electronics Assembly meets all internal requirements except for … –Details need to be worked out for the GN2 design. –Electrical isolation of the E-box and Telescope needs more thought.

13 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design DESIGN DETAILS Electrical/Mechanical Interface Interface Connectors J1 9 Pin D-Sub Male 311409-1P-B-12 J2 9 Pin D-sub Female 311409-1S-B-12 J3 1553, BJ3150 J4 1553, BJ3150 PART OF MID DRAWING NUMBER 32-02003.02 Mounting Hardware - Six #10-32 SHCS Surface roughness of 63 micro inches or better for interface surfaces. Mounting surfaces have Electrically Conductive finish (MIL-C-5541 Cl 3)

14 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design NEAR TERM TASKS –Update MICD to reflect latest configuration. –Further develop analysis on natural frequencies and stresses using SOLID WORKS and COSMOS on the complete CRaTER Assembly. –Finalize interface between Telescope Assembly and Electronics Box Assembly. Specify the electrical isolation material between the telescope and the E-Box. –Identify the GN2 purge system (mechanical interface to the spacecraft, internal flow, pressure measurements…) –Complete the drawings for part and assembly fabrication. –Define attachment points and outline for thermal blankets.

15 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design Backup Slides

16 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design Factors of Safety

17 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design BOARD ANALYSIS Analog Board Analysis 123456 an 8.429 x 5.95 board separated into two parts Polyimide modulus of elasticityE (lb/in sq4.21E+05 Thicknessh (inches)0.060.090.10.110.120.15 poisson ratiou0.12 lengtha (in)4.215 widthb (in)5.95 weightW (lb)0.60.650.690.710.730.79 gin/secSq386 pi3.14 D=E*h^3/(12(1-u^2))D=7.6925.9535.6047.3861.51120.14 density pmass/area=W/gab6.19797E-056.7145E-057.13E-057.33E-057.54E-058.16E-05 for a a simply supported board on 4 sides f=pi/2((D/p)^.5)(1/a^2+1/b^2))^.5Frequency=(Hz)478394107120161 From Steinberg, vibration analysis for electronic equipment page 149 for a fixed beam on 4 sidesFrequency=(Hz)91160182207232312 Average Frequency69121138157176237

18 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design BOARD ANALYSIS Analog Board Analysis Cont’d STRESS Gin=peak load(g's)=125 Q=transmisibility=10 Gout=Gin*Q=1250 W=board weight(lb)=0.60.650.690.710.730.79 q=load intensity=W*Gout/ab13.39314.50915.40215.84816.29517.634 My=bending moment at center=6.6417.1957.6377.8598.0808.744 DYNAMIC BENDING STRESS Kt= stress concentration factor 333333 h=height0.060.090.10.110.120.15 Sb=6*Kt*My/h^2= lb/in^2Stress due to bending33206159881374711691101006995 FACTORS OF SAFETY FOS Yield FOS Ultimate24000 psi0.71.51.72.12.43.4 NUMBER OF CYLES BEFORE FAILURE check S-N curve for board type Ch 12 to determine if board will fail number of cycles before failure10^4>10^8 MARGIN OF SAFETY MOS=(Allowable stress/applied stress*FS)-1-0.50.00.20.40.61.3 For a composit Fs=1.5 Ultimate

19 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design BOARD ANALYSIS Digital Board Analysis 123456 a 8.562 x 7.488 board two sections modulus of eleasticity Polyimide fiberglassE, psi4.21E+05 Thicknessh(inches)0.060.090.10.110.120.15 poisson ratiou0.12 lengtha (in)4.281 widthb (in)7.488 weightW (lb)0.550.570.580.590.60.61 gin/secSq386 pi 3.142857 1433.142857143.142857 D=E*h^3/(12(1-u^2))D=7.6925.9535.6047.3861.51120.14 density pmass/area=W/gab 4.44492E- 054.6066E-054.69E-054.77E-054.85E-054.93E-05 for a a simply supported board on 4 sides f=pi/2((D/p)^.5)(1/a^2+1/b^2))^.5Frequency, HZ =47.3285.3999.14113.41128.14177.60 This is from an example by Steinberg, vibration analysis for electronic equipment page 149 for a fixed board on 4 sidesFrequency, HZ =94.79171.06198.61227.19256.69355.79 Average Frequency 71128 149 170192267

20 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design BOARD ANALYSIS Digital Board Analysis Cont’d STRESS Gin=peak load(g's)=125 Q=transmisibility=10 Gout=Gin*Q=1250 W=board weight(lb)=0.550.570.580.590.60.61 q=load intensity=W*Gout/ab12.27712.72312.94613.17013.39313.616 My=bending moment at center=5.7825.9926.0976.2026.3076.412 DYNAMIC BENDING STRESS Kt= stress concentration factor 333333 h=height0.060.090.10.110.120.15 Sb=6*Kt*My/h^2= lb/in^2289081331510974922678845130 FOS Yield FOS Ultimate24kpsi0.81.82.22.63.04.7 check S-N curve for board type Ch 12 to determine if board will fail>10^8 MARGIN OF SAFETY MOS=(Allowable stress/applied stress*FS)-1MOS0.61.21.51.72.03.1 For a composite FS=1.5 (Ultimate)

21 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design E-BOX COVERS, ANALYSIS Top CoverBottom Cover Elastic ModulusE(lb/in sq1.00E+07 Thicknessh(inches)0.063 Poisson ratiou0.33 lengtha (in)9.3439.119 widthb (in)6.6238.443 weightW (lb)0.410.46 gin/secSq386 pi3.142857143 G125 q0.8282334490.746833585 D=E*h^3/(12(1-u^2)D=233.837392 density pmass/area=W/gab1.71655E-051.54784E-05 f=pi/2((D/p)^.5)(1/a^2+1/b^2))^.5frequency =199159 Bending moment at center My= q(u/a^2=1/b^2)/(pi^2(1/a^2+1/b^2)^21.90092.0061 dynamic bending stress Sb=6*My/h^2Stress=28743033 Check S-N curve at StressN=5.E+08 FOS Yield/StressTensile yield, psi3500012.1811.54 Ultimate/StressTensile Ultimate, psi4200014.613.8 Margin of Safety (allowable stress/applied stress *FOS)-1Tensile yield, psi3500014.213.4 Tensile Ultimate, psi4200019.518.4

22 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design CURRENT BEST ESTIMATE, MASS PROPERTIES Electronics Assembly gramslbs Analog CCA4801.05 Digital CCA5401.19 Interconnect Cable, A/D520.11 Internal E-box Cables1220.27 Mechanical Enclosure18003.96 Top Cover2500.55 Bottom Cover2250.49 Hardware1660.36 Purge system1780.39 Electronics Assembly Sub-Total38138.38 Detector Assembly Circuit Board1380.30 Telescope Sub-Assy1398.87 Detector Mechanical Enclosure5251.15 Detector Assembly Sub- Total10612.32 MLI and TPS Sub-Total250.55 Mounting Hardware Sub-Total40.09 CRaTER CBE Total516411.34

23 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design Drawing List Drawing NumberDrawing TitleRev.Layout CompleteDrawing CreatedCheckedReleased 32-1000CRaTER Assembly0% 32-10200Electronics Assembly-25% 32-10201Digital Electronics, PWA0250% 32-10202Analog Electronics PWA0250% 32-10203Electronics Enclosure 0195% 32-10204 Cover, Top Electronics Enclosure 0195% 32-10205 Cover, Bottom Electronics Enclosure -95%

24 C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design Material Properties 1.MIL-HDBK-5J 2.Efunda materials list via efunda.com 2 2 1 2

Download ppt "C osmic R Ay T elescope for the E ffects of R adiation CRaTER PDR Mechanical Design Mechanical Design, CRaTER Assembly and Electronics Assembly Preliminary."

Similar presentations

GLAST LAT ProjectMarch 24, 2003 HPS-102090-0002 Tracker Peer Review, WBS 4.1.4 Section 2-D 1 GLAST Large Area Telescope: Tracker Subsystem WBS 4.1.4 Structural.

GLAST LAT ProjectMarch 24, 2003 HPS Tracker Peer Review, WBS Section 2-D 1 GLAST Large Area Telescope: Tracker Subsystem WBS Structural.
C osmic R Ay T elescope for the E ffects of R adiation CRaTER Pre-Ship Review (I-PSR) Qalification/Functional Testing Bob Goeke January 3-4, 2008.

C osmic R Ay T elescope for the E ffects of R adiation CRaTER Pre-Ship Review (I-PSR) Qalification/Functional Testing Bob Goeke January 3-4, 2008.
Mechanical Systems Analysis Branch/Code 542 Goddard Space Flight Center Analysis of Damping Treatments Applied to the MAP Spacecraft Scott Gordon Code.

Mechanical Systems Analysis Branch/Code 542 Goddard Space Flight Center Analysis of Damping Treatments Applied to the MAP Spacecraft Scott Gordon Code.
Analysis of thermal failure of electronic components

Analysis of thermal failure of electronic components
GLAST LAT ProjectDOE/NASA Mechanical Systems Peer Review, March 27, 2003 Document: LAT-PR-0XXXX Section 7.1 Stress Analysis 1 GLAST Large Area Telescope:

GLAST LAT ProjectDOE/NASA Mechanical Systems Peer Review, March 27, 2003 Document: LAT-PR-0XXXX Section 7.1 Stress Analysis 1 GLAST Large Area Telescope:
Circuit Board Fatigue Response to Random Vibration Part 2

Circuit Board Fatigue Response to Random Vibration Part 2
GLAST LAT ProjectDOE/NASA Peer Critical Design Review, March 19-20, 2003 D. Nelson 1 GLAST Large Area Telescope: Electronics, Data Acquisition & Instrument.

GLAST LAT ProjectDOE/NASA Peer Critical Design Review, March 19-20, 2003 D. Nelson 1 GLAST Large Area Telescope: Electronics, Data Acquisition & Instrument.
Spacecraft Structure Development - Vibration Test - (60 minutes)

Spacecraft Structure Development - Vibration Test - (60 minutes)
WBS 3.2.4 & 3.2.5 AO Controls Jason Chin, Don Gavel, Erik Johansson, Mark Reinig Design Meeting (Team meeting #10) Sept 17 th, 2007.

WBS & AO Controls Jason Chin, Don Gavel, Erik Johansson, Mark Reinig Design Meeting (Team meeting #10) Sept 17 th, 2007.
April 7, 2008University of Minnesota PDR Satellite Structure Subsystem Structural and Vibrational Stress Analysis Presented By: Chris Matthews.

April 7, 2008University of Minnesota PDR Satellite Structure Subsystem Structural and Vibrational Stress Analysis Presented By: Chris Matthews.
C osmic R Ay T elescope for the E ffects of R adiation CRaTER Pre-Ship Review (I-PSR) MISSION ASSURANCE Brian Klatt January 3-4, 2008.

C osmic R Ay T elescope for the E ffects of R adiation CRaTER Pre-Ship Review (I-PSR) MISSION ASSURANCE Brian Klatt January 3-4, 2008.
Student Satellite Project University of Arizona Team Goals Design, Fabricate, and Analyze a Structure that will Support the Payload –Space Allocation of.

Student Satellite Project University of Arizona Team Goals Design, Fabricate, and Analyze a Structure that will Support the Payload –Space Allocation of.
1 NASA’s Goddard Space Flight Center 2005/4/14 LRO/CRaTER Technical Interchange Meeting LRO Mechanical Systems Giulio Rosanova / 543 301-286-5907 /

1 NASA’s Goddard Space Flight Center 2005/4/14 LRO/CRaTER Technical Interchange Meeting LRO Mechanical Systems Giulio Rosanova / /
C osmic R Ay T elescope for the E ffects of R adiation Telescope Mechanical Design Albert Lin The Aerospace Corporation Mechanical Engineer (310) 336-1023.

C osmic R Ay T elescope for the E ffects of R adiation Telescope Mechanical Design Albert Lin The Aerospace Corporation Mechanical Engineer (310)
23 - 1 NASA’s Goddard Space Flight Center LRO Integration and Test Joanne Baker GSFC Code 568 August 16-17, 2005.

NASA’s Goddard Space Flight Center LRO Integration and Test Joanne Baker GSFC Code 568 August 16-17, 2005.
C osmic R Ay T elescope for the E ffects of R adiation CRaTER Pre-Ship Review (I-PSR) R. Foster January 3-4, 2008.

C osmic R Ay T elescope for the E ffects of R adiation CRaTER Pre-Ship Review (I-PSR) R. Foster January 3-4, 2008.
C osmic R Ay T elescope for the E ffects of R adiation CRaTER Pre-Environmental Review (I-PER) MISSION ASSURANCE ACTIVITIES Brian Klatt September 10-11,

C osmic R Ay T elescope for the E ffects of R adiation CRaTER Pre-Environmental Review (I-PER) MISSION ASSURANCE ACTIVITIES Brian Klatt September 10-11,
STARLight PDR 3 Oct ‘01 F.1.1 Rashid STARLight STARLight Mechanical Tahir Rashid STARLight Mechanical Engineer (734) 764-7210

STARLight PDR 3 Oct ‘01 F.1.1 Rashid STARLight STARLight Mechanical Tahir Rashid STARLight Mechanical Engineer (734)
GLAST LAT ProjectDOE/NASA Mechanical Systems Peer Review, March 27, 2003 Section 4.5 - Mechanical Systems X-LAT Assy1 GLAST Large Area Telescope: Mechanical.

GLAST LAT ProjectDOE/NASA Mechanical Systems Peer Review, March 27, 2003 Section Mechanical Systems X-LAT Assy1 GLAST Large Area Telescope: Mechanical.
GLAST LAT ProjectDOE/NASA Mechanical Systems Peer Review, March 27, 2003 Document: LAT-PR-0XXXX Section 5.1 Grid Box Design 1 GLAST Large Area Telescope:

GLAST LAT ProjectDOE/NASA Mechanical Systems Peer Review, March 27, 2003 Document: LAT-PR-0XXXX Section 5.1 Grid Box Design 1 GLAST Large Area Telescope:

Similar presentations

Ads by Google