1. 1 IIC-China: BIG on Education Conferences ▪ Technical Application Courses Shenzhen  February 28, March 1 & 2, 2013

2. 2 The world has seen BIG technological breakthroughs in the past few years What is next in the future of electronics design?

3. 3 Engineers need your technology to innovate & design the next BIG thing

4. 4 They attend IIC-China to find new technology and learn the latest trends *Reasons why engineers attend IIC-China (Source: IIC-China 2012 visitor survey)

5. 5 Influence technology selection in an authoritative environment IIC-China’s educational program helps improve my design skills. The panel discussion featuring industry experts is very insightful and thought provoking. - Yue Jie, Purchasing Manager, Osee Digital Technology Ltd.“” 5,174 engineers attended 61 educational sessions in 2012

6. 6 Shape the future of China’s electronics industry at the Conference Conference Join other experts to discuss new trends and emerging technologies in China’s electronics industry Position your brand with the influential, editor-led conferences before, during and after the event Be part of the panel of experts as you address engineers’ design challenges Session time: 40 min presentation + seat at the panel discussion at the end of the day US$6,000 per session

7. 7 Smart Technologies. Smart World. 2013 themes: “Connecting Worlds” for Connectivity Conference Cloud computing, HD data transmission, NFC, RFID, HDMI, HML, WLAN, USB, Rapid IO, High-speed Interfaces, Security control “Switched On!” for Power Conference AC/DC, DC/DC, LDO, Wireless charge, MOSFET, IGBT, GaN, SiC, Digital Power, LED lighting, LED Dimming, smart meter “Smart, Secure Solutions” for Security and Smart Home Conference Gesture identifying; Sensor, Amplifier, MCU, DSP, Processor, Networking, Smart TV solution, Media/Data Center, Remote control (Zigbee, bluetooth), STB, home security monitoring, video image processing, video data transmission, embedded OS

8. 8 Smart Technologies. Smart World. “Mobility Rules” for Smartphone and Tablet Design Conference - Hardware and Software track Memory, MEMS Sensor, 4G/LTE, processor, PA, OS, IP core, Mobile Internet, Clock “Competing Views” for Smartphone and Tablet Design Conference - Display Technology track Multi-touch controller, HD, 3D, AMOLED Driver, latest display panel “Testing Grounds” for Test & Measurement Conference Oscilloscope, Signal source generator, thermal test, RF/Microwave test, Virtual instrument, optical network test, portable instrument “Building on Your Ideas” for IC Supply Chain Conference EDA tools, PCB design tools, Mixed-signal EDA tools, verification workflow, 3D manufacturing technology, MEMS chips manufacturing

9. 9 Instruct engineers on latest solutions at the Technical Application Courses Technical Application Courses (TAC) Train China’s engineers on your technology, how it’s applied, and how it makes a difference to their design work Address technologies essential to engineers in their future design Session time: 50 minutes US$3,500 per session *Refer to the latest matrix for time slots

10. 10 Educate and build thought leadership at IIC-China’s Conference Program ConferenceTAC Session duration 40 min presentation + seat at the panel discussion 50 min presentation Expected attendance80-10050-80 Sound system, video projection system & screen Complimentary invitation materials Full editorial support to define talking points - Brand building Website, relevant print ads & eDMWebsite Pre-event promotion Onsite promotion Signboard at the conference room Logo on backdrop Invitation cards Lead generation Attendee list using scanner Onsite name card collection Access to the attendee list Rates US$6,000US$3,500

11. 11 Conference themes suggested topics

12. 12 Connecting Worlds Connectivity Conference: Connecting Worlds Keynote Cloud computing: How to connect the ‘clouds’ over the China sky? Roundtable Prospects & competitive analysis of new connectivity technologies Suggested topics Network design for the cloud EMI protection strategy for HSDI Implementation of near field communication (NFC) Application of Serial Rapid IO in high performance embedded system interconnect Using chips to ensure data transmission security Prospects of NFC in mobile payment Overcoming the challenges of HD data transmission 802.11ac solutions HDMI designs Cloud computing: Its requirements for next-generation memory technologies How can high-speed connection technology meet needs of cloud computing? High-speed interconnect technology for data centers HD data transmission solutions for portable devices New breakthroughs in high-speed optical connection Connectivity: Optimization and innovation for the Internet of Things

13. 13 Switched On! Power Conference: Switched On! Keynote Optimizing power efficiency of portable devices Roundtable New approaches to improving efficiency Suggested topics  Digital power: easy design even for a novice engineer  Optimizing LED lighting design  Lowering noise of switch-mode DC-DC convertors  Challenges & breakthroughs in conversion efficiency for wireless charging technology  Improve standby power management of smart terminals (cell phones, tablets)  Low-power design solutions for smart terminals  Latest battery technologies  Breakthroughs and application prospects of new GaN 、 SiC power devices  How can power MOSFETs and IGBTs improve efficiency?  Advanced technologies to improve device efficiency  New methods to improve efficiency of linear and switching power devices  Energy-saving solutions for data centers  High-efficiency, high-integration power modules  Next-generation smart meter design

14. 14 Smart, Secure Solutions Security and Smart Home Conference: Smart, Secure Solutions Keynote Smart home with multiscreen interaction: when will it be a reality? Roundtable Who will win the smart home battle - TV, cell phone or PC manufacturers? Suggested topics  Three HD video surveillance solutions (IP surveillance, SD-HDI surveillance, 960H analog surveillance)  SoC chip applications for high-definition IP cameras and video imaging enhancement technologies  Next-generation image sensor technologies  Solutions for real-time, secure video transmission  Cloud computing and video data storage solutions  3G/4G LTE video surveillance solutions  The future of 3D gesture recognition  Home wireless controls with Zigbee technology  DSP solutions for smart video analysis devices  MEMS applications in smart TVs  Embedded software platforms for smart home control panels  Smart home applications based on wireless sensor networks

15. 15 Mobility Rules Smartphone & Tablet Design Conference -- Hardware & Software track: Mobility Rules Keynote Smartphones: How many CPU cores do we really need? Roundtable Striking a balance between features and costs Suggested topics  What advantages do multi-core CPUs bring to your applications?  Multi-core GPUs for next generation smart devices  Has the era of x86-based multi-core processors arrived?  MEMS applications in portable devices  Applying eMCP and eMMC in smart devices  HD audio adds value to smart devices  Speech enhancement in noisy environment  RF design of multi-mode, multi-band LTE/4G smartphones  Will ARM+Win8 tablets replace notebooks?  How can China's OS seize the opportunity in mobile Internet?  MEMS gyroscopes and gravity accelerometers (inclinometers)  Prospects of mobile payment in China  Comparison of various embedded operating systems  Breaking the bottleneck of large-scale commercial use of MEMS clocks  Latest IP cores improve performance of cell phones and tablets  Optimization of memory performance

16. 16 Competing Views Smartphone & Tablet Design Conference: Display Technology track: Competing Views Keynote What display technologies will lead next-generation mobile terminals? Roundtable 3D display technology: the next flash point in smartphone market? Suggested topics  HD display design: Design challenges  Penetration of 3D display technologies into the smartphone market  Will 720p become a standard feature in high-end smartphones?  Augmented reality technology injects new life to smartphones  Will >300ppi pixel density go mainstream in Smartphones  Flexible screens: The ideals and the reality  New trends in UI enabled by multi-touch technology  Supply and demand trends for small and medium OLED panels  Smartphone boom to drive innovation in tablet display technology  Trends of efficient backlight technology  Latest solutions in touch tech  Realize display differentiation through AMOLED  Optimizing display technology

17. 17 Testing Grounds Test & Measurement Conference: Testing Grounds Keynote Test technology for the 4G era Roundtable How will the T&M industry meet challenges of new applications? Suggested topics High-speed, high-precision oscilloscopes Test technology for next-generation wireless communication Test technologies for high-speed interfaces (Thunderbolt, Displayport1.2) Testing energy-efficient computing devices Testing near-field detection systems (e.g. NFC) Measuring technologies for new applications (e.g. LED driver, electric car) New trends in oscilloscopes Breakthroughs in signal generators Realizing manufacturing automation with virtual instrumentation RF/microwave measurement: break through the performance bottleneck Improving reliability of portable devices Enhancing the accuracy of thermal test analysis

18. 18 Building on Your Ideas IC Supply Chain Conference: Building on Your Ideas Keynote Improving and optimizing production yield Roundtable The new roles of Foundry & EDA vendors in China’s nanometer era Suggested topics Analog process meeting the needs of China Fabless HV Analog process improves yield Finding right approach to manufacture MEMS chips 3D manufacturing technology Selecting a right foundry to achieve quick TTM EDA tools meet mass production requirements Creating new features for Mixed-signal EDA tools PCB design tool to improve SI performance Emulator speeds up verification workflow

19. 19 IIC-China: BIG on Education Conferences ▪ Technical Application Courses