1. Presenter EUROPEAN NANOELECTRONICS FORUM 2009 17 – 18 November Noordwijk, The Netherlands ENIAC project IMPROVE Implementing Manufacturing science solutions to increase equiPment pROductiVity and fab pErformance F.Finck

2. Presenter 2 Implementing Manufacturing science solutions to increase equiPment pROductiVity and fab pErformance The IMPROVE Eniac Project Context

3. Presenter 3 Scaling down CMOS (Moore Law) Managing High mix and heterogeneity (More than Moore) Two Technical Challenges for the Future

4. Presenter 4 20nm Length (Development) 15nm Length (Research) 65nm Node 2006 45nm Node 2007 90nm Node 2003 32nm Node 2009 22nm Node 2011 10nm Length (Research) 50nm Length (Production) 30nm Length (Production) 30nm Scaling Down CMOS What kind of Process Control Systems do we need to develop to be able to manufacture these devices in high volumes at reduced cost per die? Source: Intel Ireland Public Relations Courtesy of Intel

5. Presenter 5 SPC Chart 4750 4800 4850 4900 4950 5000 5050 5100 5150 5200 5250 135791113151719212325272931 Lot number Trench Depth Metrology Data UCL LCL Etch STI Planer Hours/days delay for metrology SPC LRC Etch Wafer Voltage, power, OES etc Metrology y Y Y = f(X) Y X=[X 1,X 2,………. X n ] Virtual Metrology Data Courtesy of Intel Virtual Metrology

6. Presenter 6 High Mix and Heterogeneity (typ. fab) 10 technologies types 4 to 6 generations of each technology type > 50 products running concurrently through the manufacturing fab. 5000 wafers per Week 100 reticle changes per week

7. Presenter 7 High Mix and Heterogeneity Challenges in Equipment Effectiveness –Increase in non productive time (gating metrology, recipe qualifications, wait and down time) –Stagnating equipment reliability, availability and utilization –Increasing variations by increased number of equipment per process step (and vice-versa) –Increasing interaction between process steps –Increasing internal tool complexity

8. Presenter 8 Manufacturing Science Answers Manage FDC strategy, collect data, perform analysis at equipment level Solutions to Process Control Issues –Virtual metrology, dynamic control plan, data mining, data reduction, data / time synchronization Improving Equipment Effectiveness –Predictive Maintenance, remote diagnostics, lots scheduling and resources planning

9. Presenter 9 Implementing Manufacturing science solutions to increase equiPment pROductiVity and fab pErformance The IMPROVE Eniac Project Project Presentation

10. Presenter 10 ENIAC Annual Work Plan Sub Programme 8 Target Activity 1: Advanced Line Operation (Manufacturing Science) SP8-1 Objective: To allow European device makers to increase the productivity and sustainability of the most advanced CMOS and derivative technologies semiconductor fabs

11. Presenter 11 IMPROVE Master Objectives To improve processes reproducibility and quality To improve the effectiveness of production equipement To shorten cycles time => To IMPROVE Fab Competiveness

12. Presenter 12 Expected Project Results Virtual Metrology Implementation –Allow measurement of every wafer in real time –Improve process control from "run to run" to "wafer to wafer" Increase device quality and yield –Reduce standard metrology steps Cycle time improvement Operating costs reduction

13. Presenter 13 Expected Project Results Passing from reactive to predictive factory operations in European fabs. –Reduce unscheduled equipment downtime –Increase equipment reliability –Reduce number of scrapped wafers. Dynamically optimizing the Control Plan with respect to the real time risk analysis –Reduce unecessary control steps –Reinforce the control on critical steps

14. Presenter 14 How to address these challenges (1) Need for an extensive vertical collaboration –SC Manufacturers To define problem, provide data, specify and assess solutions –Academics To work on physical and statistical models –Solution Providers To prototype harware and software tools for development assessment Data Acquisition Modeling Prototypes Assessment

15. Presenter 15 How to address these challenges (2) Need for an extensive horizontal collaboration –SC Manufacturers To be able to address in parallel different processing equipment and silicon structures To ensure developped solutions will be adapted to various production environments –Academics To provide a cluster of complementary expertise on the modeling activity –Solution Providers To address the different software packages and sensors needed by the project

16. Presenter 16 Diffusion How to address these challenges (2) –SC Manufacturers –Academics –Solution Providers More Moore Physical Modeling 200/300mm Lines More than Moore Etch ImplantPhoto-Litho APC Framework Data Analysis Simulation Software Sensors Non linear Stats. Neural Networks Bayesian Networks Risk Analysis Need for an extensive horizontal collaboration

17. Presenter 17 Consortium 6 major European SC manufacturers –ATMEL –INTEL –INFINEON –Austriamicrosystems –Numonyx –ST 2 Institutes –Fraunhofer G. –LETI

18. Presenter 18 Consortium 10 Solutions Providers –France:PDF Solutions, Probayes –Germany: Camline, ISYST, InReCon –Ireland: Straatum, Lexas Research –Italy: Techno Fittings, AP-Technologies, LAM –Portugal:Critical SoftWare

19. Presenter 19 Consortium 12 Academic Labs –France:EMSE-CMPGC, GSCOP, LTM CNRS –Germany: LMU (München), FAPS (Erlangen) –Ireland: DCU (Dublin) –Italy: UNIPV, UNIMI, UNIPD, CNR E, CNR IMM –Austria:FH-WN (Wiener Neustadt)

20. Presenter 20 Key figures 3600 Men Months over 3 years 100 full-time researchers 35 Partners over 6 countries SC Manufacturers SW Providers Academics

21. Presenter 21 IMPROVE WORK PACKAGES 3 R&D themes in 3 main Work Packages: –Virtual Metrology (Leader INTEL) –Predictive Equipment Behaviour / Predictive Maintenance (Leader INFINEON) –Dynamic Risk Assessment & Control Plan (Leader STMicroelctronics)

22. Presenter 22 IMPROVE WORK PACKAGES 3 "ancillary" Work Packages –Survey & Specification (Leader Fraunhofer) –Integration in Manufacturing Decision Systems (leader Numonyx) –Equipment Forum (Leader Fraunhofer)

23. Presenter 23 Work Packages Structure

24. Presenter 24 Project Progress after 6 months Building the cooperation structure –Consolidate work distribution among partners –Define technical and geographical clusters –Implement communication channels (Web site, net meetings) Novel approach using combination of technologies to estimate wafers physical dimensions and electrical performance

25. Presenter 25 First Results in Virtual Metrology Etch rate estimation from Optical Spectra using statistical approach.

26. Presenter 26 First Results in Predictive Equipment Behaviour Example of Equipment Behaviour analysis from Ion Implantation Equipment Predictive Behaviour System Concept and Interaces

27. Presenter 27 Benefits of the Cooperation for Europe The IMPROVE project will be a key enabler for 2 main competitive advantages 1.To directly contribute to the competitiveness of the semiconductor fabrication in Europe with the developped solutions Better process and equipment control at lower cost Better productivity of equipment Better cycle time

28. Presenter 28 Benefits of the Cooperation for Europe 2.To contribute to the creation and reinforcement of a European ecosystem in the semiconductor manufacturing area Leadership in Manufacturing Science for SC manufacturers, labs and academics –The Virtuous Cycle Advanced hardware and software tools in solution providers portofolio –Opportunity to gain new customers and increase marketshare Building of a continuous collaboration network in Manufacturing Science among European actors

29. Presenter 29 Benefits of the Cooperation for Europe The Virtuous Cycle SC Manufacturers Labs & Academics Solution Providers Long term reinforced competitiveness for all actors New Technologies Introduction New Problems Expertise Development & Recognition New Concepts to Implement Enriched Portofolio, New Markets More Effective Production Lines New Tools

30. Presenter 30 Thank you for your attention More information available on IMPROVE public web site:to be completed