1. Date Conference Paris February 19th 2004 peter.straub@ppc-electronic.ch Seite 1 © Copyright PPC ELECTRONIC AG Optical layers PPC Electronic OPTOBOARD ® Technology V ertical C avity S urface E mitting L aser VCSEL VCSEL/Diode Layers Opto-electronical components Opto-electronical components electrical dielectrical optical Connector PPC Electronic AG Peter Straub R&D Riedstrasse 2 CH-6330 Cham www.ppc-electronic.com

2. Date Conference Paris February 19th 2004 peter.straub@ppc-electronic.ch Seite 2 © Copyright PPC ELECTRONIC AG Electrical vs optical Interconnection over a 100 cm PCB 1990 1994 1998 2002 2006 2010 2014 YEAR 160 Gbps 40 Gbps 10 Gbps 2.5 Gbps Electrical Copper Interconnection prefered (cheaper) technology prefered (cheaper) technology Optical Interconnection prefered (cheaper) technology prefered (cheaper) technology Shannons Theorem: C = B * log 2 (1+ S/N) C = channel capacity B = Bandwidth (FR4, 1m Coppertrace ≈ 3 GHz) S = Mean Signalpower N = Mean Noisepower at the Receivers input S/N ≈ 100 (FR4 Coppertrace 1m long) Channel capacity over a 100 cm backplane ≈ 20 Gbps (only with optimal datacoding possible) 50 cm

3. Date Conference Paris February 19th 2004 peter.straub@ppc-electronic.ch Seite 3 © Copyright PPC ELECTRONIC AG The sum of R&D Cost (Krubasik 1982) Technology Performance Profit/Cost Today New Technology Limit (optical PCB) Old Technology Limit (electrical PCB) Optoboard New Technology Potential Old Technology Potential Technology Potential High Speed PCBs vs Optoboard V ertical C avity S urface E mitting L aser FC VCSEL

4. Date Conference Paris February 19th 2004 peter.straub@ppc-electronic.ch Seite 4 © Copyright PPC ELECTRONIC AG Electrical Backplane High Speed Problems  Architecture »From multiple-point to point-to-point with or without switch fabric  Density »Crosstalk (distance between lines) »Shielded lines and PTH necessary (PPC Patent) »Noise (differential signals necessary) »Impedance tolerance better ± 10% »High layer count (three plate constr.)  Connectors »High aspect ratio PTH »Drill back vias or SMD µVias ! »High price for high speed connectors  Material losses »High price for low loss polymers »Skineffect losses on copper  Drivers »Preemphasis necessary »Adaptive signal processing »Lasertuned Resistors on the Backplane 1m Rogers R04350 Material 1m FR4 Material Switch PPC Electronic AG Pat. pend.

5. Date Conference Paris February 19th 2004 peter.straub@ppc-electronic.ch Seite 5 © Copyright PPC ELECTRONIC AG Waveguides in the Backplane and Systemcard (250µm Pitch Flip Chip VCSEL and Photodiode Flip Chip VCSEL and Photodiode 50$ /Link 10$ /Link Parallel Optical Modules Waveguides in the Backplane (250 µm pitch) Fiber ribbon Optical Connector 30$ /Link 2006 2008 2003 2nd to 3rd Generation Optical Backplane Evolution

6. Date Conference Paris February 19th 2004 peter.straub@ppc-electronic.ch Seite 6 © Copyright PPC ELECTRONIC AG Optoboard ® Technology Keyelements 1. Transparent Medium Thinglass 2. Multimode Waveguide Technology 3. Optical Connector 4. Parallel Optical Module with VCSEL and Pin Diode Arrays 5. In- Out-Coupler Waveguide In-CouplerOut-Coupler

7. Date Conference Paris February 19th 2004 peter.straub@ppc-electronic.ch Seite 7 © Copyright PPC ELECTRONIC AG Etched Glass Multimode Waveguide (250µm Pitch)

8. Date Conference Paris February 19th 2004 peter.straub@ppc-electronic.ch Seite 8 © Copyright PPC ELECTRONIC AG Optical Backplane Market