1. 1 Module and stave interconnect Rev. sept. 29/08

2. 2 Outer Stave layout … End of stave card serves 8 modules (half a stave) along Z Stave has 32 modules total, 16 on each face. 8 modules connected to 1 stave card via stave cable. Cable is pre-assembled on stave (4 cables per stave). Modules are loaded on top of cable and connected down to it with a connector similar to present PP0 connector, but smaller. Module on back

3. 3 4-chip outer stave module Active area 10.0 15.0 Flex pigtail (connector plugs into page)‏ Pixel orientation Flex down to chip w-bonds Flex hybrid on top of sensor

4. 4 Loaded module side view 20 position connector would be used. Replace 10.22 dimension by 6.52 glue chips sensor flex connector Compressed scale 1.0 mm stiffener Hirose DF30 series 0.4mm contact pitch

5. 5 12mm1.5mm X8 HV-ret HV-1-2 HV-3-4 HV-5-6 NTC Out-1 Out-2 HV-7-8 Multi- drops Layer 1: Signals (1/4 oz copper)‏ Layer 2: Power and return (25um aluminum)‏ ground ref. +LV x8 DC-DC Stave cable layout -LV x8 (trace width varies such that each module sees the same cable resistance)‏...

6. 6 Stave section (not to scale)‏ Center line glue Polyimide substrate inter-layer cover layer aluminum copper chips sensor glue facing foam Flex hybrid

7. 7 Power parameters 3.390% efficient DCDC module power excluding sensor bias (W)‏ 0.34Cable power dissipation (average per module in W)‏ 0.34Stave cable round-trip voltage drop before DCDC convert. (V)‏ 220Number of squares 1-way (same for all modules)‏ 0.0016Aluminum layer resistance per square (ohm)‏ 2.0Single module 1.5V chip combined current (A)‏ 3.8stave cable metal width (cm) 25Stave cable aluminum thickness (um)‏ These are nominal values without contingency Single module stave cable current with DC-DC (A)‏ 1.0

8. 8 Inner layer modules For small radius the staves must be narrow => single-chip-wide modules. Probably want single sided staves also. If sensors are 3D they can naturally have active edges Once active edge sensors are used, single-chip modules are very attractive –No active fraction advantage for bigger modules –High data rates also prefer single chip modules One serial output per chip –(may still not be enough for BL)‏

9. 9 Single chip module features Simplified assembly process –no single chip probing needed before flip-chip –No flex hybrid Test individual modules with a probe card Load “bare modules” directly on stave cable Inherently high yield SC stave module concept from US Upgrade meeting, Dallas 2004: robotically placed, fully tested 1-chip modules. Wire bond to stave after placement. End of stave card

10. 10 But… Stave cable is more challenging. –Not as much room as on outer staves –4 times as many data output lines needed (at least)‏ Inner stave cable concept (presented in BL replacement meeting sept. 2007) Cable stack Pre-laminated on bare stave Cable stack with 24 flaps before lamination (half stave). End of stave card could be built-in Flap folds over after module is glued