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Testbeam 2010 with CAPTAN System Jianchun Wang Syracuse University.

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Presentation on theme: "Testbeam 2010 with CAPTAN System Jianchun Wang Syracuse University."— Presentation transcript:

1 Testbeam 2010 with CAPTAN System Jianchun Wang Syracuse University

2 Telescope Setup 2 Courtesy: Ryan Rivera

3 Telescope Configuration 3 Type Thickness (  m) Size (mm 2 ) HVComment TelescopeN-type Si300 ? 16 x 24 32 x 16 220 DUT sCVD5004x 4250 At 0 , 10 , & 20 , HV scan at 20  MCZ Si300 ?16 x 24500 0 , threshold scan Purdue 3D2008x8403d_4e_wb5_8, failed 2008x8403d_2e_wb216_6, HV & threshold scan 2858x8403d_2e_wb5_2, HV & threshold scan DUT YY 120 GeV proton beam Scint X Z Y XX YY  : –22  : +22  : +22  : –22  : 0, –10 , –20  Lab frame

4 Pixel Planes 4  Y X Looking from upstream 00 7 0 0 5 0 Plane Station/Plaquette Z (mm)Comment RyanData 01/10/3-43.4 Row/Y, as shown, rotated by  =+22  11/00/2-42.6 Row/Y, flipped, 0 left-top, rotated by  =+22  20/0 -27.4 Row/X, as shown, rotated by  =–22  30/1 -26.6 Row/X, flipped, 0 right-top, rotated by  =–22  44/0 0 Row/X, as shown, rotated by  =0 , –10 , –20  (for 3D 00 flipped down, for MCZ it is 2x3) 53/02/226.6 Row/X, as shown, rotated by  =+22  63/12/327.4 Row/X, flipped, 0 right-top, rotated by  =+22  72/1 42.6 Row/Y, as shown, rotated by  =–22  82/0 43.4 Row/Y, flipped, 0 left-top, rotated by  =–22  00 1 2 3 6 5 4 1 4 2 3 Row/Y Row / X Viewing with sensor in front

5 PSI46 Readout Chip 5 Ultra-black black last DAC C0 C1 A0 A1 A2 signal CMS PSI46 readout chip  Zero suppressed analog signals, serial readout.  Double column logic.  Use 6 levels of analog signals for addressing  2 digs for double column: 0-25 (max 35).  3 digs for row x 2 column: 0-159 (max 215). 52 col 80 row 9800  m 7900  m

6 Sensor Geometry 6 Size (row) = 100x79+200 = 8100  m Size (col) = 150x50+300x2 = 8100  m 79 78 77 76 1 0 200  m 100  m 0 1 2 3 49 50 51 300  m 150  m 150  m 300  m 2X3 Module

7 Purdue 3D Sensors 7

8 CAPTAN System 8 PCB – Processing and Control Board DCB – Data Conversion Board PDB – Power Distribution Board It is designed to be flexible to include other readout electronics.

9 Hit Data Format 9 Bit313029282726252423222120191817161514131211109876543210 Byte3210 Item bit76543210151413121110981918171676543210 ItemTrigger Station Bit6362616059585756555453525150494847464544434241403938373635343332 Byte7654 Item bit7654321054321098065432102104321 ItemAdcColumnAdccRowplaquetteChip Bit313029282726252423222120191817161514131211109876543210 Byte before4567 Item bit2104321065432105432109876543210 ItemPlaquetteChipRowColumnAdc Before Reordering Bytes After Reordering Bytes Bit6362616059585756555453525150494847464544434241403938373635343332 Byte before0123 Item bit76543210191817161514131211109876543210 ItemStationTrigger

10 Hit Maps 10 X in Plane Frame (mm) Y in Plane Frame (mm) X Z/beam Y/up Lab frame X Z Y Plane frame beam Diamond DUT at 20 

11 Cluster Size 11 Too many single pixel clusters. The resolution can not be as good as what was claimed. Thresholds are not the same for different telescope planes. Threshold needs to be further reduced. Gain, threshold calibrations are not available yet. Number of Pixels in a Cluster Diamond DUT

12 Charge Distribution 12 Gain calibration need more work. Gain for diamond seems wrong. This just give you an idea on how they work. Charge (Ke) Diamond DUT

13 DX 13 X – X 2 in Lab Frame (mm) Center aligned, no angle alignment yet

14 DY 14 Y – Y 0 in Lab Frame (mm)

15 Form Raw Tracks 15 Number of Raw tracksNumber of Hits Per Track Track window is quite lose for two reasons: Detectors are not aligned yet. Want to include interaction tracks.

16 Summary  Different radiation hard sensors are tested: sCVD diamond, MCZ, 3D.  We are more interested in the diamond detector. Properties extracted from this test beam will be important inputs to our upgrade simulation.  Get familiar with the CAPTAN system, get offline analysis package ready. We may have our own detector tested with the system in near future. 16

17 PSI Signal and Addressing 17 For each hit pixel, the readout chip produces a signal at six levels. The first five encode the pixel address. The 6 th represents the analog signal from the pixel. The first two encode the double column address. The next three encode the pixel address in that double column. Most significant bit for the double column address (C0) Least significant bit for the double column address (C0) Least significant bit for the pixel address in the double column (A0) Most significant bit for pixel address in the double column (A2) A1 Analog signal from the pixel (data) One pixel hit

18 18

19 CMS PLT Diamond Sensor  CMS PLD 500 um thick sCVD  Physical size 4.7 x 4.7 19


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