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The energy influx from an rf plasma to a substrate during plasma processing W.W. Stoffels, E. Stoffels, H. Kersten*, M. Otte*, C. Csambal* and H. Deutsch.

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Presentation on theme: "The energy influx from an rf plasma to a substrate during plasma processing W.W. Stoffels, E. Stoffels, H. Kersten*, M. Otte*, C. Csambal* and H. Deutsch."— Presentation transcript:

1 The energy influx from an rf plasma to a substrate during plasma processing W.W. Stoffels, E. Stoffels, H. Kersten*, M. Otte*, C. Csambal* and H. Deutsch Department of Physics, Eindhoven University of Technology, PO Box 513, 5600 MB Eindhoven * Institute for Physics, University of Greifswald, Domstr. 10a, D-17487 Greifswald, Germany. The work has been supported by the Royal Dutch Academy of Sciences (KNAW) and the Deutsche Forschungsgemeinschaft (DFG) under SFB198/A14. Acknowledgment 13 n

2 Abstract Aim: determine the energy flux to a substrate in an low pressure rf plasma Method: calorimetric probe Results : –Argon: heat flux is few times 10 -3 W/cm 2 heating mainly due to ions and electrons –Oxygen 50% higher heat flux than argon molecular surface processes are important as well

3 Substrate heating: c s dT/dt =  in -  out  in = Heat flux J x times probe surface: –ions: kinetic recombination –electrons:kinetic –neutrals: kinetic, internal, association, chemical –photons: blackbody, plasma  out: –thermal conduction of gas and substrate –radiation The ion and electron heating depends on surface potential: =>Separation of neutral component possible by using a bias voltage C s : heat capacity substrate; j i,j e ion/electron flux; V pl -V fl acceleration voltage of ions in sheath Note

4 Thermal probe Principle: heat flux determines the heating time of the probe The probe is a Cu plate, diameter 3.4 cm, height 0.002 cm. Mounted to a thermocouple and shielded from below (see picture). It can be moved (x,y,z) and rotated. Photograph of the thermal probe placed in the glow at substrate position.

5 Thermal probe: raw data T S (t)-curves as measured during the argon plasma process (p=1Pa, P=15W) for three substrate voltages (0, -46, -95V). Rising edge plasma on, decreasing edge plasma off. The plasma heat flux is determined from the derivative signal Current-voltage characteristic of the thermal probe for argon and oxygen. The measured electron and ion flux is used to separate ion and electron heating from neutral heating.

6 Experimental setup Capacitively coupled 13.56 MHz plasma. –Al electrode D=130mm –Spherical reactor D=400mm. Diagnostics: –Thermal probe –Langmuir probe –CCD camera Typical conditions: –1Pa, 15W Ar or O 2 –Argon: T e = 3.5 eV n e = 2 10 15 m -3

7 Results: Argon Calculated contributions by ions (J i, J rec ) and electrons (J e ) to the thermal balance of the substrate. The calculations are based on n e measured by the Langmuir probe and a Bohm flux. For the electron current (right branch) the measured substrate current is used. Measured data fitted by the model results. Left Right

8 Results: Oxygen –Similar trends for oxygen and argon –Overall higher heat flux in oxygen due to neutral heating –n e (oxygen) < n e (argon) so electron branch is smaller Comparison with argon Measured integral energy influx (Q in ) for argon and oxygen, respectively, for the same macroscopic discharge conditions.

9 Conclusions Thermal heat flux to a substrate can be measured by probe Electron, ion and neutral heating can be separated Argon 15W, 1Pa: –heat flux few times 10 -3 W/cm 2. –Increases with bias voltage –mainly ion (and electron) heating Oxygen 15 W, 1Pa: –same trends –significant influence of neutral heating These data are also valid for heat flux in dusty plasmas


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