1. 1 October 21, 2009 Gary K. Maki*, Wusi C. Maki* and Nirankar Mishra CAMBR, University of Idaho, Post Falls, ID Integration of Nano Transistor Food Biosensors BC Food Protection Association Workshop Supported by USDA * Now with Integrated Molecular Sensors

2. 2 Integration of Microelectronics CAMBR/NASA Custom Processors Reed Solomon Coder – Programmable error correction, message length Lossless Data Compressor (USES) Low Density Parity Check Encoder – Landsat Data Continuity Mission High Performance Data Compression – MMS mission New correlator work underway – GeoStar IIP Delivered November 2008

3. 3 GeoStar System The GeoStar system enables astronomers to advance science with a space based imager which will correlate data from 588 separate antennas. This requires a custom processor board capable of 442,368,000,000,000 correlations per second while using less than 120W for the correlations. Equivalent to 17,332 Quad Intel Processors consuming 346,600 watts (not counting memory)

4. 4 Nano Technology Promise Increased Sensitivity – Electronic device size approximate size of detection molecule Nano transistors on order of 50 nm capable of manufacture in modern semiconductor foundries – IBM, Intel, TSMC markets 45 nm electronics – With proper integration, possible to mass produce sensitive detection electronics $20 detectors with integrated microprocessors with USB interfaces

5. 5 Au Nano FET Al VSS AmplifierComputerDigitizer Off Chip Communications Silicon Substrate Self-assembled monolayerCapture Molecule Target Molecule Integration of Electronic Biosensor

6. 6 Detector Sensor Electronic Amplifier Micro processor Communication Link Cell PhoneInternetSatelliteComputers National Data Base Pathogen Biomarker Capture & Amplification

7. 7 Technologies/Expertise Molecular Biology/Biochemistry Nano Technology Semiconductor Fabrication Surface Chemistry Electronics – Digital Design – Analog Design – Special purpose computers How to integrate people/technologies

8. 8 8 Work Together Multiple disciplinary – Speak the same language Substrate – Understand basic concepts Cross Knowledge borders – Ph.D’s are experts in narrow fields – Ph.D’s do not like to show ignorance Electronic EngineeringMolecular Biology Chemistry

9. 9 Food Safety Detection Targets Toxins – SEB SEC (Staph) – Stx1, Stx2 (E. coli) Bacteria signature DNA – 16S rRNA gene Bacteria signature RNA – 16S rRNA E. coli O157:H7 – Specific phage KH1

10. 10 Virus Bacterium DNA Protein

11. 11 Nano-FET Ideal Detection Real Detection

12. 12 Au Nano FET Al VSS AmplifierComputerDigitizer Off Chip Communications Silicon Substrate Self-assembled monolayerCapture Molecule Target Molecule Established Bio-Recognition Methods

13. 13 Au Nano FET Al VSS AmplifierComputerDigitizer Off Chip Communications Silicon Substrate Self-assembled monolayerCapture Molecule Target Molecule Established Microelectronic Technology

14. 14 Bio-Molecular Recognition Signal Generation Electronic Signal Amplification Digitalization Challenges In Signal generation and Interface The interface of Nano- and Micro-electronics The interface of Bio-Molecules and Nano-sensing surface

15. 15 Interface Questions Charge must be generated from target recognition Charge must be brought to the sensing surface Insulator layer on the nanowire must be as thin as possible Nanowire must be affected by very small E-field Which generates a detectable electronic signal Electronic signal is amplified and digitalized How to generate charge?What kind of charge? How much? How to attach the charge to the surface?How to make ultra-thin insulator layer? How to integrate nano-/micro-electronics?Temperature and packaging problems Signal level: magnitude only? Phase? Electronic amplify?

16. 16 Challenges in Charge Generation Not all molecules are alike – Charge quantity variable Example – Charge sense variation DNA negative charge Poly-lysine positive charge Steroid hormone charge neutral Transistor Impacts – Transistor variation with different targets – Transistor surface modification

17. 17 Solution for Charge Generation Keep engineer’s life simple – Known amount of charge – Known charge sense – No transistor surface modification Ease design pain Enable mass production Engineers have to design only one thing and produce billions of identical copies

18. 18 Universal Signal Molecule Target Recognition Signal Molecule Generation Same Signal Molecule - known charge Target Invariant Electronics

19. 19 Universal Nano-FET Biosensor PNA Signal Molecule Antigen Antibody Universal Detection Model

20. 20 Transistor Design Device which detects molecular charge Specifications – Wafer – Doping level – Nanowire Length – Contact material – Insulator layer – Sensing area

21. 21 Signal Data Nano Transistor – nano amp current Noise Problems – External noise Light, 60 Hz, electrical ground movement Long wires from nano FET to instrument No alligator clips – Internal noise Electrical grounding, cross talk, leakage

22. 22 University of Idaho - CAMBR22 Transistor Layout Au Pad Doped Silicon Top View Silicon Wafer Insulation Layer Doped Silicon Au Pad PNA Au Pad Side View

23. 23 University of Idaho - CAMBR23 Areas of Concern Silicon Wafer Insulation Layer Au Pad PNA Au Pad Side View Contact Doped Silicon High reliability needed Example 0.01% Modern VLSI chip with 100M Xsters 4 contracts per transistor 10,000 Xsters non-functional

24. 24 University of Idaho - CAMBR24 Areas of Concern Silicon Wafer Insulation Layer Au Pad PNA Au Pad Thickness Doped Silicon Nano FET Surface Thickness Small for good E-Field Thick for insulation

25. 25 Au Pad Doped silicon Au Pad Doped silicon Au Pad Doped silicon Au Pad Doped silicon Au Pad Doped silicon Au Pad Doped silicon University of Idaho - CAMBR25 Au Pad Doped silicon Digital Electronics

26. 26 Au Pad Doped silicon Au Pad Doped silicon Au Pad Doped silicon Au Pad Doped silicon Au Pad Doped silicon Au Pad Doped silicon 26 Au Pad Doped silicon Digital Electronics Analog Signal to Digital With multiple sensors, quality control routine Data Analysis to map Target Identify Intelligent I/O Interface Internet Communication

27. 27 Au Pad Doped silicon Au Pad Doped silicon Au Pad Doped silicon Au Pad Doped silicon Au Pad Doped silicon Au Pad Doped silicon 27 Au Pad Doped silicon Digital Electronic Problems Processing Order 1.Create Digital Circuits (20 layers) 2.Place Gold pads 3.Place doped silicon on gold pads High Temperature Process Nano packaging solution ?

28. 28 Integration of Nano- and Microelectronics Microelectronics

29. 29 Hybrid Packaging Approach Short wire interface Common ground Noise reduction elements Single package Nano-device Micro-electronics Hybrid Package

30. 30 Conclusion Systems Level Problem Various Technology experts needed Integrated team is needed Resource costs are High – nano foundry (already exists) – Digital/Analog Design Tools Commercial costs > $1M/year Engineering experts needed Commercial fabrication > $200K/run – Biomolecular laboratory