1. Preliminary Design Review Northwest Nazarene University Advisor: Dr. Lawrence Chad Larson Ben Gordon Seth Leija David Vinson Zach Thomas Drew Johnson

2.  Section 1: Mission Overview ◦ Purpose ◦ Goals ◦ Theory ◦ Success ◦ Benefits ◦ Expected Results ◦ Concept of Operations  Section 2: Design Overview ◦ Design Process ◦ Design Requirements ◦ System Overview ◦ Design View ◦ Superhydrophobic ◦ Flexible Chips ◦ Radiation Hardened Chips ◦ Data / Sensors ◦ Block Diagram ◦ Prototyping Plan ◦ RockSat-C 2012 User’s Guide Compliance ◦ Shared Can Logistics

3.  Section 3: Management ◦ Team Organization ◦ Budget ◦ Work Breakdown Schedule ◦ Timeline ◦ Risk Factors  Section 4: Conclusions

4.  Study the feasibility of using superhydrophobic materials in the presence of high acceleration and vibrations for possible use on space missions.  Test Radiation Hardened chips and new flexible chips with American Semiconductors

5.  Do research on superhydrophic material that would allow it to be used in future space missions.  Gather data on Radiation hardened chips and to gain experience working with the microchip industry.

6.  W hen water is in contact with the superhydrophobic surface (diatomaceous earth) it is more attracted to its own surface tension than it is to the material. This is because the material works like a microscopic bed of nails. Diatomaceous earth is a new material developed by John Simpson at Oakridge National Laboratory and is exceptional due to its high contact angle with water and low price.

7.  For this mission to be considered a success, the SH material needs to be recovered and tested post-flight. It would be best if the superhydrophobic material survived the flight.  Get usable data from the radiation hardened chips

8.  The goal of this launch is to prove that this diatomaceous earth can survive a rocket launch and still be functional post-flight.  This material could have many different benefits if it is shown to survive space travel. The SH material has already been shown to work in microgravity by NNU and NASA’s Reduced Gravity program. NASA would benefit from the data gathered if they decide to use this material on future missions.  Provide data to American Semiconductors about their radiation hardened chips.

9.  It is hypothesized that the material will survive the high acceleration and vibrations and still be functional in post-flight testing.

10.  It is expected that the radiation hardened chips will make less errors in the flight compared to the non-hardened chips.

11. Concept of Operations Rocket Launch/G- switch triggered Time =1.3 min Height: 75km Start of main chip data Time=2.8 min Apogee of Flight Best data on chips gathered Time= 4.5 min Height: 75km Main chip data complete Time=5.5 min Chute is deployed Time= 15 min Lands in ocean

12.  Design Superhydrophobic Encasement  Design American Semiconductor Board/ Final Design of Plate.  Build encasement/Build American Semiconductor board.  Implement into Plate ◦ Test board ◦ Run full flight test

13.  Physical Envelope Cylindrical:  Diameter: 9.3 inches  Height: 4.75 inches  Mass Canister + Payload = 20±0.2 lbf  Center of Gravity Lies within a 1x1x1 inch envelope of the RockSat payload canister‘s geometric centroid.

14.  A Superhydrophobic “donut” will be on one plate  Along with that is the Flexible chips attached to small cylinders.  The electrical systems will be on another plate above the original plate.

15. Superhydrophobic “donut” Flexible Chips American Semiconductor Board Geiger Counter

16. “Donut”  A donut shaped hollow object will house Superhydrophobic material. This shape allows for different forces on different axis.  This will be on the lower plate and will be placed around the center support.

17. Flexible Chip Cylinders  New flexible chips from American Semiconductors will be placed on different axis to find effects of space travel on them.

18.  American Semiconductors will work with students to design a board which will test their radiation hardened chips American Semiconductor Board & Geiger Counter

19.  Time  Radiation – Geiger Counter  American Semiconductor data will be stored on a flash memory.

20. Radiation Hardened Chip FleX Clock/Signal Power Memory Geiger Counter

21.  Between now and the CDR, the superhydrophobic enclosure will be in production. The American Semiconductor plate will be fully designed and the actual AVR board will be in production.

22.  Predicted mass - 10lb  Using Rocksat Workshop Plexiglas plate ◦ Diameter – 9” ◦ Height – 3” to 4.5”  A g-switch will be used for activation  Using deionized double contained water

23.  We will share a canister with the RockOn Workshop.  We will stay in contact with Colorado via e-mail and keep then updated with our design.  We will be using standoffs.

24. Electrical –American Semiconductors David Vinson Seth Leija Drew Johnson Mechanical - Superhydrophobic Ben Gordon Chad Larson Zach Thomas

25. ItemAmount Budgeted ($) ½ Can $7000.00 paid by American Semiconductors Superhydrophobic MaterialMade by NNU for less then $50.00 TravelFunded by Idaho Space Grant FacilitiesProvided by NNU Radiation Hardened Chips and Electronics Provided by American Semiconductors

26. Electrical/ American Semiconductors Design Fabricate AVR Build Mechanical/ Superhydrophobic Complete Design Begin Fabrication of Enclosure Paint material on interior of “donut”

27. Complete design on SH subsystem Nov 14 Preliminary Design with American Semiconductors Begin Fabrication Nov 30 Finalized Design Jan 30 Complete Fabrication Electrical Subsystem Mechanical Subsystem Begin Testing

28.  Risk 1: SH enclosure breaks  Risk 2: G-switch fails to start data collection  Risk 3:Malfunction on electrical board. Consequence Risk 1Risk 2 Risk 3 Possibility

29.  The main focus before the CDR will be completing the design of the American Semiconductor board and begin the construction of the board.  Begin fabrication of superhydrophobic enclosure.

30.  Questions?