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IDC HPC User Forum Conference Appro Product Update Anthony Kenisky, VP of Sales.

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Presentation on theme: "IDC HPC User Forum Conference Appro Product Update Anthony Kenisky, VP of Sales."— Presentation transcript:

1 IDC HPC User Forum Conference Appro Product Update Anthony Kenisky, VP of Sales

2 APPRO HPC User Forum Presentation – 09-15-10 Innovative Technology – Won SC Online 2009 Product Of the Year Award Price/Performance Leadership – Consistently offers the best price/performance solution in the marketplace Brand & Reputation – Impeccable reputation among both customers and competitors Flexibility – Internal, engineering capabilities to cater solutions to specific customer’s problems Company Introduction

3 APPRO HPC User Forum Presentation – 09-15-10 Innovative Solutions ::Based on GPU’s & FLASH Hybrid solutions based on the latest CPU & GPU Technologies Flash solutions for I/O enhancements or Global memory GPU Blade & Rack mount solutions

4 APPRO HPC User Forum Presentation – 09-15-10 :: Recent Major Design Wins Innovative Design Wins DASH & Trestles DASH – A Winner of the SC09 Storage Challenge is available on the Terragrid network today. A 5.7TF cluster with SSD’s and 768GB of global shared memory space per node. Trestles – will have 10,368 processor cores, a peak speed of 100 teraflop/s, and 38 terabytes of flash memory. Like Dash, Trestles will be available to users of the TeraGrid, the nation’s largest open-access scientific discovery infrastructure.

5 APPRO HPC User Forum Presentation – 09-15-10 :: Recent Major Design Wins Data Intensive Design Wins Next-generation Supercomputer to solve “data- intensive” scientific problems in 2011 Gordon – will feature 245TF of total compute power, 64TB of DRAM, 256 TB of flash memory, and four petabytes of disk storage. A key feature of Gordon will be the availability of the supernode. Each of the systems supernodes (a group of 32 nodes) has the potential of 7.7 TF of compute power and 10 TB of memory. Gordon will become a key part of a network of next-generation high- performance computers (HPC) being made available to users of the TeraGrid.

6 APPRO HPC User Forum Presentation – 09-15-10 :: Recent Major Design Wins Data Intensive Design Wins LLNL Testbed Cluster– Over 40,800,000 IOPS and 320GB/s aggregated bandwidth in two racks. Designed to enable computational scientists to have I/O test beds for scalable parallel file systems such as Lustre and CEPH. Secondly, it will allow the evaluation of large scale checkpoint restart mechanisms that don't depend on global scalable file systems. Thirdly, it will facilitate investigation of cloud base file systems and analysis tools such as Hadoop and MapReduce.

7 APPRO HPC User Forum Presentation – 09-15-10 :: GPU Solutions Appro GPU Computing Supports 1:1, 1:2, 1:4 CPU:GPU ratio combinations

8 APPRO HPC User Forum Presentation – 09-15-10 Platform specifications – Integrated 2P x86 host server + 4x “Fermi” GPUs – M2050 or M2070 – Host server agnostic – can support either Intel or AMD host boards – Supports 6x hot-swappable 2.5” HDDs – Support 1 additional PCIe expansion slot – Intelligent power control – GPUs can be powered down independent of host to save overall system power – Integrated IPMI 2.0 Remote Management First 1U server to achieve over 1 TeraFLOP on Linpack :: 2CPU & 4GPU in one Server Appro 1U Tetra Solution

9 APPRO HPC User Forum Presentation – 09-15-10 :: CPU/GPU Compute Blades Direct PCIe bus slot to slot connection No need for external PCIe cables Host/GPU Pair is a single GPU blade system Each GPU system is hot-swappable & easily serviceable All monitoring sensors and data are integrated between host and GPU Host and GPU module can be upgraded independently Compute Host BladeGPU Expansion Blade GPU Compute Blade + Appro GreenBlade System

10 APPRO HPC User Forum Presentation – 09-15-10 4x Racks of 2P x86 Servers Traditional 2P Servers Combination X86 host + GPUs Hybrid ComputingSAME FLOOR SPACE 4x Racks of Hybrid Servers SAMEPOWER/COOLING Up to 8x MORE PERFORMANCE :: Optimum Performance/Density

11 Do More with Less with Appro


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