1. Off Detector Electronics Upgrade

2. Outline Present schemes and features New schemes of nSYNC Technology 19/03/2014 S. Cadeddu - INFN Cagliari 2

3. Present ODE implementation L0 front-end electronics stage 192 LVDS input signals 24 SYNC chips (on 3 types of piggy board) TFC system interface and clock management 1 optical receiver + 1 TTCrx chip 1 QPLL chip Tree network based on MC100LVEP family L0 trigger interface 12 GOL chips + 1 parallel optical transmitter Valid data transmission @40MHz L1 DAQ interface 1 GOL chip + 1 VCSel diode Valid data transmission @1 MHz FPGA board controller Flash RAM based Actel FPGA (ProAsicPlus) 3 buses (32 bit) for SYNC and GOL interfaces ECS interface 1 ELMB board –CANbus link on the backplane –2 I2C internal buses 6U Compact PCI card 10 layers motherboard with controlled impedance Mixed 5/3.3/2.5 V devices 19/03/2014 S. Cadeddu - INFN Cagliari 3 SYNC DAQ inter. TRG inter. TFC inter. GOL ECS inter. Controller

4. Present SYNC implementation 19/03/2014 S. Cadeddu - INFN Cagliari 4 TDC & Synchronizer: 4 bit TDC (1.5 ns resolution @ 40 MHz) – DLL based. Custom Macro-cell. L0 Trigger Interface: Sends 8 synchronized hits along with the 2 LSB of the BX Id @ 40 MHz. Prog. buffer depth L0 buffer & Derandomizer: Based on the 128x27 SRAM blocks (CERN development – K. Kouklinas) Circular buffer of 256x54 SRAM. Initial R/W address programmable. FIFO of 128x54 SRAM The depth is programmable to 16, 32, 64 or 128. EDAC: Single Error detection and correction, Double Error detection. 7 bits code. Histogram Builder: 16 bins of 2 24 entries each. I 2 C Interface Used to R/W internal configuration. Configuration Registers are t riple voted and auto-corrected for best SEU immunity. All other registers are triple voted Trigger link test L1 link test

5. SYNC 1.0: The present … 19/03/2014 S. Cadeddu - INFN Cagliari 5 L0 Buffers Derand TDC’s VDD GND 8 LVDS Input Output to L1 electronics GOL output GND I2CI2C I2CI2C I2CI2C CTRLS SYNC 1.0 97 pins 4x4 mm 2 QFP 14x14 100 pins IBM 0.25  m RadHard

6. ODE upgrade specs Design new boards (nODE), almost “plug & play” with current ODEs –No need to touch cables from chamber to crates –Same transition boards (no crate re-cabling) –Single type of board for all stations/regions Use new GBT and versatile link components to implement trigger, DAQ, TFC and ECS interfaces –Optimized number of links to the L0 Muon trigger Maintain the trigger unit information on the same link Possible implementation in the TELL40 –Read TDC data @ 40 MHz rate –No more need to maintain present TFC and ECS systems Use a new custom ASIC (nSYNC) to integrate all the required functionalities –Clock synchronization and Bx alignment –Time measurements and histogram capability –Zero suppression algorithm and buffering –Test facilities and diagnostic –Trigger, DAQ, TFC and ECS interfaces via GBTx Guarantee enough flexibility to increase granularity and reduce channel occupancy –Possible IB boards replacement in the high occupancy zone –Possible chambers replacement in low granularity zone 19/03/2014 S. Cadeddu - INFN Cagliari 6

7. nODE Architecture 19/03/2014 S. Cadeddu - INFN Cagliari 7 nODE DATA Path Sync nSYNC Bunch cross synchr. TDC Hit format Hist. GBT interf. Zero Supp. GBT interf. ECS/TFC LVDS Receivers Translators GBTx Hit data serializer VTTx Optical transmitter GBT-SCA Control Monitor VTRx Optical transceiver GBTx Data Ser/Des VTTx Optical transmitter GBTx Hit data serializer Sync nSYNC Bunch cross synchr. TDC Hit format Hist. GBT interf. Zero Supp. GBT interf. Sync nSYNC Bunch cross synchr. TDC Hit format Hist. GBT interf. Zero Supp. GBT interf. Sync nSYNC Bunch cross synchr. TDC Hit format Hist. GBT interf. Zero Supp. GBT interf. LVDS Receivers Translators Sync nSYNC Bunch cross synchr. TDC Hit format Hist. GBT interf. Zero Supp. GBT interf. 192 Input channels Power section Voltage regulators DC/DC converter Power up sequencer Clock management Clock driver Phase adjust Sync nSYNC Bunch cross synchr. TDC Hit format Hist. GBT interf. Zero Supp. GBT interf. GBTx TDC data serializer GBTx HIT data serializer To TELL40 Links simplex To Trigger links simplex To/from TFC 1 link duplex

8. nSYNC Architecture 19/03/2014 S. Cadeddu - INFN Cagliari 8 TDC + Histogram builder: 4 bit TDC (1.5 ns resolution @ 40 MHz) 16 bins of 2 24 entries each. The counts stop when any of the bins saturates. Dead time free in hit capture. Muon Trigger TELL40 Interface: Sends synchronized hits every machine cycle (40 MHz). Prog. buffer depth to guarantee the synchronization between different nSYNC sending data through the same GBT TDC ZS: Zero Suppression of TDC’s data not related to hit events. TDC TELL40 Interface: Sends synchronized ZS TDC data every machine cycle (40 MHz). Prog. buffer depth to guarantee the synchronization between different nSYNC sending data through the same GBT I 2 C Interface: Configure through the ECS. Triple-voted configuration

9. SYNC 1.0 vs nSYNC 19/03/2014 S. Cadeddu - INFN Cagliari 9 8 ch vs 32 ch Histo for each TDC No more needs for RAM’s + EDAC TDC data ZS 97 pins vs 220 pins

10. Why an asic Modularity: we are thinking at three possible modularity (32, 48, 96 channels), to best fit the requirements for: –Power consumptions (less then 20mA per channel) –Best ZS for TDC data An eye on LS3 stage: If we go to design a new detector with higher granularity for at least M2R1 and M2R2 (and maybe for the same regions of M3 too), we have also to design a new front-end electronics and a new front-end board where we can integrate the nSYNC direct on the detector. 19/03/2014 S. Cadeddu - INFN Cagliari 10

11. Technologies IMEC DARE (Design Against Radiation Effects) technology: Radiation-hardened-by-design libraries in standard commercial technology –DARE180 well supported (UMC.18) –DARE90 small core & IO library available(UMC 90nm) Manufacturing, Packaging, Testing, Characterization (lot) Qualification & Radiation test up to FM is supported by imec’s ASIC Services –Through subcontractors (Microtest, Maser, MAPRAD) Flexible solution –DARE allows for mixed signal design Can add specific analog blocks; designed by customer, design house or imec Encrypted models of library cells can be used in analog design ervironment. –Cells can be added to the library –IO pads can be customized... Imec has expertise on the full DSM design flow They tested DARE digital blocks up to 1 MRad without failures or leakage current increases. SEU performance is in the order of a LET cross-section of 48/60 Mev. 19/03/2014 S. Cadeddu - INFN Cagliari 11

12. Technologies DARE UMC 180 Family 19/03/2014 S. Cadeddu - INFN Cagliari 12 IO at 3.3 and 2.5 V pads: - 70x70 - 110x110 - custom All FF’s have scan equivalents+ Fillers & Corners + Customer Requests + Additional Analog IP developed by an external design house (DAC, ADC,...)

13. nSYNC: work in progress I 2 C interface: Designed and tested in another chip for a INFN gruppo 5 experiments. PLL and Delay lines: These are the main crucial parts for the TDC implementation as well as the GBT interfaces that needs a different frequencies from the master clock. They are under study and develpment in another INFN gruppo 5 experiment (alldigitall) 19/03/2014 S. Cadeddu - INFN Cagliari 13

14. All Digital PLL An ADPLL include a DCO instead of a VCO In most architecture the DCO=DAC+VCO In other case the DCO is based on effects of analog components The aim of ALLDIGITALL experiment is to realize a true DCO, portable on different technologies (FPGA, ASIC), integrable in a flow fully digital 19/03/2014 S. Cadeddu - INFN Cagliari 14

15. DCO in 130nm technology Frequency Range (1.3 – 25.5) ns (770 – 39) MHz LSB95 ps DNL(+/- 13) ps 19/03/2014 S. Cadeddu - INFN Cagliari 15

16. DCO in 130nm technology Frequency Range (0.75 – 39) ns (1250 – 26) MHz LSB150 ps DNL(+/- 10) ps 19/03/2014 S. Cadeddu - INFN Cagliari 16