1. e-mail, April 9, 2006Václav Vrba, Institute of Physics, Prague 1. Phenix NCC Silicon Pad Sensors produced in ON Semiconductor Lukas Tomasek, Michal Tomasek, Vaclav Vrba Institute of Physics, Prague Michael Finger, Miroslav Finger Charles University, Prague Michael Merkin at al. Moscow State University Edward Kistenev, Edward O’Brien Brookhaven National Laboratory Richard Seto University of California at Riverside Matthias Grosse Perdekamp University of Illinois at Urbana-Champaign

2. e-mail, April 9, 2006Václav Vrba, Institute of Physics, Prague 2 Layout of components on the wafer

3. e-mail, April 9, 2006Václav Vrba, Institute of Physics, Prague 3 I-V and C-V on single diodes

4. e-mail, April 9, 2006Václav Vrba, Institute of Physics, Prague 4 I-V curves for 4x4 pad array

5. e-mail, April 9, 2006Václav Vrba, Institute of Physics, Prague 5 I-V curves for 4x4 pad array

6. e-mail, April 9, 2006Václav Vrba, Institute of Physics, Prague 6 Reverse current long term stability

7. e-mail, April 9, 2006Václav Vrba, Institute of Physics, Prague 7 I-V curves for 4x4 pad array

8. e-mail, April 9, 2006Václav Vrba, Institute of Physics, Prague 8 Summary 8 wafers with pad sensors of Phenix design with integrated bias resistors have been fabricated in ON Semiconductor; First measurements indicate very good quality of sensors and also of integrated resistors; For future production QA criteria and measurement procedure shall be elaborated. It will help also better define and accent our needs; At the moment ONS is finishing processing of the second part of wafers (out of 24 raw wafers provided by Misha Merkin); It is highly desirable to send to ONS a.s.a.p. new wafers 525 µm thick purchased from Wacker Siltronic for further production.