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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 1 History of ISA SP76 NeSSI Current Standards ANSI/ISA-76.00.02(2002) IEC 62339-1 (2006-12) reference IEC 62339-1:2006(E) design
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 2 NeSSI / SP76 History/Standards Initially Semiconductor Industry Concept Center for Process Analytical Chemistry (CPAC) University of Washington at Seattle New Sampling / Sensor Initiative (NeSSI) Ad Hoc group of manufacturers, end users, integrators worked together to improve technology and achieve ‘Smart’ systems http://www.cpac.washington.edu/NeSSI/NeSSI.htm US Standard: ANSI / ISA –76.00.02 ( 2002 ) World Standard: IEC 62339-1: 2006(E) (listed 2007)
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 3 GEN I (hardware) System
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 4 Roots in Semiconductor Industry First Sprouts in HPI/CPI 1998 Vision and Patents –Don Mayeaux A+ Corporation –09DEC1998 New Orleans, LA “Industry Forum on Modular Sample Systems (MSS)”
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 5 Industry Forum Companies (now) ARCO Chemical (Basell) Chevron Refining & Research (ChevronTexaco) Equilon (division of Shell) Esso-Canada, Exxon-BOP & R & E (ExxonMobil) Shell-Oil, Products, Development (Shell) Union Carbide (Dow)
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 6 Seeds in Refining Industry 1998 ISA EXPO1998 Houston, TX Paul Otteman –Displays Autoflow unit Dan Podkulski –Borrows Autoflow unit –Demonstrates to Chevron Best Practices Process Analyzer Meeting Attendees
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 7 Growth in Refining Industry 1999 ISA SP76 Working Group Dan Podkulski, Chair, OCT1999 Initial Writing/Ballot –ANSI / ISA Standard –“Modular Sample Conditioning Component Interface”
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 8 Growth in Academia 2001 CPAC Users’ Meeting This (CPAC) solved Legal Problems –Monopoly / Restraint of Trade CPAC User Proponents –Jim Tatera – CPAC (Dow Corning) –Rob Dubois – Dow –Dan Podkulski – Chevron (ExxonMobil)
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 9 CPAC Oil & Petrochemical Focus Group A+ Corporation Autoflow DuPont ExxonMobil Rosemount Swagelok
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 10 NeSSI Appears 2000 –Rob Dubois Dow –Peter van Vuuren ExxonMobil Chemical 2001 –IFPAC Professional Presentation –Rob Dubois http://www.cpac.washington.edu/NeSSI/NeSSI.htm
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 11 NeSSI Generations Announced; SAM is Introduced 2001 Rob Dubois Dow Mel KochCPAC Peter van VuurenExxonMobil Chemical Generations –I. Functional Subassemblies –II. Open Communications Network and –III. Sensor-on-Chip Analyzers
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 12 Initial NeSSI Roadmap SAM: Gen II Sensor Actuator Manager
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 13 Technology Roadmap Current NeSSI™ Roadmap NeSSI™ is a trademark of the Center for Process Analytical Chemistry, U of WA Initiative started 1999 True Gen 2 devices in Lab and Field Test applications since FEB2007; Commercial availability since OCT2007 (except SAM)
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 14 Gen II “NeSSI-Bus” Devices
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 15 Gen II Future Developments Example of CANbus IS Network (courtesy of CiA CANbus IS Work Group) Future development and certification Current development
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 16 End User Value Gain from Gen I to Gen II using ANSI/ISA-76 Devices Lower device wiring cost –40% less Real estate benefits –Multiple outputs from single devices Resource optimization –Does more with less hardware Remote troubleshooting and diagnostics Sample system uptime increased –Preventive vs. reactive maintenance operations
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 17 Initial Physical System Proposals 2000 CPAC RFP - Six Common Designs Responses –Substrate Designs by Autoflow, Parker, Swagelok (Rosemount) –Surface Mount Components by CIRCOR and Tescom –Constructive Criticism by ABB and Siemens Applied Automation Inc.
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 18 Life Cycle Considerations (LCC) 1998 John Sablatura ExxonMobil –Key Performance Indicators (KPI) 2000 Jeff Gunnell / Peter van Vuuren –Today’s Cost of Build –Today’s Cost of Ownership –Hidden LCC Costs in Process Analyzer Systems
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 19 ANSI / ISA Standard 2002 Elastomer Seals (o-rings) ANSI / ISA-76.00.02(2002) granted IEC SC 65D/119/CDV 62339-1 initiated
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 20 ISA 48 th Annual AD Meeting 2003 Responses to Dow RFQ In-depth Review by Bac Vu (Dow) Four System Responses –CIRCOR Tech –Fujikin –Parker –Swagelok
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 21 IEC (world) Standards IEC 62339-1 2006-12 reference IEC 62339-1 : 2006 (E) design
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 22 Q1 and Q2 2007 Developments Smart Sampling Connectivity Bus Closed bus –Siemens i 2 C Open bus –CIRCOR iCAN –IS CAN bus Product –ISO CANOpen Basis
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 23 ISA EXPO2007 Smart Sampling / Bus Components –Digital Multivariable Transmitter (P, T, Q) –Digital Flow Transmitter –Digital Pressure Transmitter –Digital Temperature Transmitter –Digital Combi (pilot) Valve All i 2 C Siemens & iCAN CIRCOR Tech compatible
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Complete, Modular, Ready Today www.circortech.comCONFIDENTIAL 24 Thank you… …go and create New History ! !
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